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Scott Kazle Phones & Addresses

  • Rogers, MN
  • 26479 147Th St, Zimmerman, MN 55398 (763) 856-5036
  • Saint Paul, MN
  • 27313 110Th St NW, Zimmerman, MN 55398

Publications

Us Patents

Edge Terminals For Electronic Circuit Modules

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US Patent:
58479309, Dec 8, 1998
Filed:
Oct 13, 1995
Appl. No.:
8/542896
Inventors:
Scott J. Kazle - Mound MN
Assignee:
HEI, Inc. - Victoria MN
International Classification:
H01L 2328
B32B 302
US Classification:
361736
Abstract:
Improved edge terminals for electronic circuit modules such as single- or multi-chip modules and hybrid circuits, and methods of making the edge terminals are disclosed. The improved edge terminals are formed on the edges of the modules, where they do not take up appreciable surface area from the module, and are formed of heat resisting metal and are of larger size as compared to conventional surface terminal pads which simplifies making connections to the module. In one embodiment, ends of pins are inserted in holes in a substrate along lines which will be the edges of the finished modules. After encapsulating in epoxy, the substrate is cut along the lines to bisect the pins, leaving the halves of the pins as embedded terminals flush with the edge of the module. In another embodiment, terminals are formed by attaching the terminal pieces to pads on the substrate, either in the form of widened zones in a grid structure, or an array of terminal plates. The grid or plates are cut through after encapsulation, bisecting the terminals to form the embedded terminals flush with the edge of the module.

Low Profile Electronic Circuit Modules

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US Patent:
59368470, Aug 10, 1999
Filed:
May 2, 1996
Appl. No.:
8/642114
Inventors:
Scott J. Kazle - Mound MN
Assignee:
HEI, Inc. - Victoria MN
International Classification:
H05K 111
US Classification:
361771
Abstract:
An improved circuit module construction for mounting and interconnecting electronic components to substrates, which is applicable to mounting a wide variety of electronic components and conductors, including inverted or `flip chip` mounted integrated circuits. The components are mounted to the substrate with a sandwiched non-conductive polymer layer which acts as the bonding agent and underfill. The substrate and underfill have apertures aligned with signal traces on the substrate and the contacts of the component and conductive polymer is injected through the apertures to fill the area between the substrate contacts and the component contacts, to secure good electrical connection. In one embodiment the non-conductive polymer is printed on the contact side of the substrate with gaps for the contacts. In another embodiment B-staged non-conductive polymer is coated on the non-contact side of the substrate, prior to forming contact apertures and mounting of components.
Scott J Kazle from Rogers, MN Get Report