Sasha N Oster

20230069488, Mar 2, 2023

Aug 30, 2021

17/461568

- Cedar Rapids IA, US
Sasha Oster - Marion IA, US

H04B 7/0426
H04B 7/0408
H04B 7/08

A receiver system for correlating one or more signals (beam patterns) is disclosed. One or more antenna elements are configured to receive the signals. A controller generates correlator outputs based on a first set of duplicated signals, generates a first set of beams based on the one or more correlator outputs using a first beamforming module, generates a second set of beams based on a second set of duplicated signals using a second beamforming module, generates one or more power estimates based on the second set of beams, and divides each of the first set of beams by a corresponding power estimate to generate one or more normalized correlations.

20210376437, Dec 2, 2021

Aug 16, 2021

17/403571

- Santa Clara CA, US
Telesphor Kamgaing - Chandler AZ, US
Sasha N. Oster - Chandler AZ, US
Adel A. Elsherbini - Chandler AZ, US
Shawna M. Liff - Scottsdale AZ, US
Johanna M. Swan - Scottsdale AZ, US
Brandon M. Rawlings - Chandler AZ, US
Richard J. Dischler - Bolton MA, US

H01P 3/16
H01P 11/00
H01P 3/12
H01Q 9/04

A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

20210328620, Oct 21, 2021

Apr 16, 2021

17/232757

- Cedar Rapids IA, US
Sasha Oster - Marion IA, US
Vadim Olen - Cedar Rapids IA, US

H04B 1/692
H04B 1/707
H04B 1/719

A spread-spectrum transmitter is disclosed. The transmitter includes a modulator configured to produce an intermediate frequency signal, a frequency shifter configured to shift the intermediate frequency factor by a first factor, and a local oscillator (LO) configured to generate a LO signal. The transmitter further includes a ramp signal generator configured to determine the value of the first factor and a second factor, is configured to transmit the value of the factor to the frequency shifter, is configured to transmit the value of the second factor to the LO, where the frequency of the intermediate frequency signal shifted by the first factor is shifted synchronously with the frequency of the LO signal shifted by the second factor. The transmitter includes a mixer configured to mix the shifted intermediate frequency with the shifted LO signal that has been shifted by the second factor, producing a spread leaked LO signal.

20210265288, Aug 26, 2021

Sep 23, 2016

16/327810

- Santa Clara CA, US
SASHA OSTER - Chandler AZ, US
JOHANNA SWAN - Scottsdale AZ, US
SHAWNA LIFF - Scottsdale AZ, US
ADEL ELSHERBINI - Chandler AZ, US
TELESPHOR KAMGAING - Chandler AZ, US
ALEKSANDAR ALEKSOV - Chandler AZ, US

INTEL CORPORATION - Santa Clara CA

H01L 23/66
H01P 3/12

Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package. Included are a first conductive member and a second conductive member separated by a dielectric material. Also included is a conductive structure, such as a plurality of vias, that conductively couples the first conductive member and the second conductive member. Together, the first conductive member, the second conductive member, and the conductive structure form an electrically conductive side-radiating waveguide launcher enclosing shaped space within the dielectric material. The shaped space includes a narrow first end and a wide second end. An RF excitation element is disposed proximate the first end and a waveguide may be operably coupled proximate the second end of the shaped space.

20210265732, Aug 26, 2021

May 11, 2021

17/317332

- Santa Clara CA, US
Sasha N. OSTER - Marion IA, US
Telesphor KAMGAING - Chandler AZ, US
Aleksandar ALEKSOV - Chandler AZ, US

H01Q 9/04
H01L 21/56
H01L 23/31
H01L 23/495
H01L 23/552
H01L 23/66
H01Q 1/22
H01Q 1/24
H01Q 1/52
H01Q 19/22

Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

20210223381, Jul 22, 2021

Jan 21, 2020

16/748433

- Cedar Rapids IA, US
Sasha Oster - Marion IA, US

G01S 13/46
H04W 4/029
G01S 13/58
H04W 16/28

A multi node radar network system is disclosed. The system includes a base node configured to transmit a directional 5G RF signal, a request node configured to request the base node to transmit the 5G RF signal, and one or more listening nodes configured to receive reflections of the 5G RF signal off of a target object. The system further includes a computation module configured to determine the location of the target object from data received from at least one of the base node, the request node, or the one or more listening nodes. A method for determining the position of a target object in a multi node radar system is disclosed.

20210041647, Feb 11, 2021

Oct 28, 2020

17/083173

- Santa Clara CA, US
Adel A. ELSHERBINI - Chandler AZ, US
Telesphor KAMGAING - Chandler AZ, US
Sasha N. OSTER - Chandler AZ, US
Gaurav CHAWLA - San Jose CA, US

G02B 6/42

Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

20200388898, Dec 10, 2020

Dec 30, 2017

16/764600

- Santa Clara CA, US
Sasha N. OSTER - Marion IA, US
Telesphor KAMGAING - Chandler AZ, US
Kenneth SHOEMAKER - Los Altos Hills CA, US
Erich N. EWY - Phoenix AZ, US
Adel A. ELSHERBINI - Chandler AZ, US
Johanna M. SWAN - Scottsdale AZ, US

H01P 3/16
H04B 3/54

Embodiments include a waveguide bundle, a dielectric waveguide, and a vehicle. The waveguide bundle includes dielectric waveguides, where each dielectric waveguide has a dielectric core and a conductive coating around the dielectric core. The waveguide bundle also has a power delivery layer formed around the dielectric waveguides, and an insulating jacket enclosing the waveguide bundle. The waveguide bundle may also include the power deliver layer as a braided shield, where the braided shield provides at least one of a DC and an AC power line. The waveguide bundle may further have one of the dielectric waveguides provide a DC ground over their conductive coatings, where the AC power line does not use the braided shield as reference or ground. The waveguide bundle may include that the power delivery layer is separated from the dielectric waveguides by a braided shield, where the power delivery layer is a power delivery braided foil.