US Patent:
20190295968, Sep 26, 2019
Inventors:
- Hamilton, BM
Abdullah Celik - Istanbul, TR
Winslow Round - Amesbury MA, US
Santosh Anil Kudtarkar - Ayer MA, US
Yusuf Atesal - Istanbul, TR
Turusan Kolcuoglu - Arlington MA, US
International Classification:
H01L 23/66
H01L 23/31
H01L 23/498
H01L 23/00
Abstract:
A package is disclosed. The package includes a carrier that comprises a first conductive layer on a first side and a second conductive layer on a second side opposite the first side. The first conductive layer comprises wire bonding pads. The package also includes a semiconductor die that is flip chip mounted on the first side of the carrier.