Search

Sanjay S Upasani

from Manalapan, NJ
Age ~64
Get Report
Also known as:
Sanjay N Upasani, Sanjay S Upasni, Upasani Sanjay, Sanjay I, Pasah U Sanjay
Phone and address:
26 Iris Cir, Millstone Township, NJ 07726
(732) 682-5792
Related to:
Priyanka Upasani, 27Rohan Upasani, 32Rohan S Upasani, 28Suneeta S JoshiAnup Upasani, 31
Connected to:
Prashant P Upasani, 46David J Upbin, 41Richard M Upbin, 78Everett G Upcheshaw, 64Adam M Upchurch, 37Aimee L Upchurch, 44Alisha Upchurch, 47Andrea F Upchurch, 49Annette L Upchurch, 69Anthony R Upchurch, 59

Sanjay Upasani Phones & Addresses

  • 26 Iris Cir, Englishtown, NJ 07726 (732) 682-5792
  • Manalapan, NJ
  • 101 Aimwick Ct, Somerset, NJ 08873
  • Edison, NJ
  • Warren, NJ
  • Howell, NJ
  • Middletown, NJ
  • Drexel Hill, PA
  • 26 Iris Cir, Manalapan, NJ 07726

Work

Company: Crestron electronics May 2012 Position: Engineering manager, mechanical analysis and compliance engineering

Education

Degree: Master of Science, Masters School / High School: Villanova University Specialities: Mechanical Engineering

Skills

Engineering Management • Design For Manufacturing • Product Development • Telecommunications • Manufacturing • Product Design • Solidworks • Finite Element Analysis • Rf • Systems Engineering • Cross Functional Team Leadership • Wireless Technologies • Automation • Aerospace • R&D • Pro Engineer • Wireless • Fmea • Ptc Creo • Tolerance Analysis • Design Verification Testing • Consumer Products

Languages

Hindi • Marathi

Industries

Telecommunications

Resumes

Resumes

Sanjay Upasani Photo 1

Engineering Manager, Mechanical Analysis And Compliance Engineering

View page
Location:
26 Iris Cir, Eatontown, NJ
Industry:
Telecommunications
Work:
Crestron Electronics
Engineering Manager, Mechanical Analysis and Compliance Engineering
Commscope Jun 2006 - Dec 2011
Engineering Manager, Mechanical Engineering
Commscope Jun 2001 - Jun 2006
Principal Mechanical Engineer
Motorola Mar 2000 - Jun 2001
Section Manager, Mechanical Engineering
Nokia Apr 1993 - Mar 2000
Member of Technical Staff
Education:
Villanova University
Master of Science, Masters, Mechanical Engineering The Wharton School
Skills:
Engineering Management
Design For Manufacturing
Product Development
Telecommunications
Manufacturing
Product Design
Solidworks
Finite Element Analysis
Rf
Systems Engineering
Cross Functional Team Leadership
Wireless Technologies
Automation
Aerospace
R&D
Pro Engineer
Wireless
Fmea
Ptc Creo
Tolerance Analysis
Design Verification Testing
Consumer Products
Languages:
Hindi
Marathi

Publications

Us Patents

Interconnection Pin/Socket Components For Electrically Connecting Two Circuit Boards And Method For Mounting Said Components In A Circuit Board

View page
US Patent:
6790056, Sep 14, 2004
Filed:
Mar 20, 2003
Appl. No.:
10/393434
Inventors:
Charles J. Buondelmonte - Glen Gardner NJ
Joseph P. Mendelsohn - Englishtown NJ
Richard William Brown - Hilliard OH
Min Li - Basking Ridge NJ
Richard Franklin Schwartz - Cranbury NJ
Sanjay S. Upasani - Manalapan NJ
Assignee:
Andrew Corporation - Orland Park IL
International Classification:
H01R 1200
US Classification:
439 83, 29739
Abstract:
A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

Bottom Entry Interconnection Element For Connecting Components To A Circuit Board

View page
US Patent:
7581965, Sep 1, 2009
Filed:
May 1, 2008
Appl. No.:
12/113285
Inventors:
Sanjay Sudhakar Upasani - Manalapan NJ, US
Sebsibe Kebede - Lopatcong NJ, US
Richard William Brown - Grove City OH, US
Scott Allen Bergman - Groveport OH, US
Assignee:
CommScope, Inc. of North Carolina - Hickory NC
International Classification:
H01R 12/00
US Classification:
439 82, 439857, 439885
Abstract:
An interconnection element for coupling a component with a circuit board having a top side and a bottom side has a planar portion configured to be surface mounted on the top side of the circuit board to overlie an opening in the circuit board. An opening is formed in the planar portion to coincide with the circuit board opening. Opposing spring fingers are coupled to the planar portion, and each spring finger has a gripping leg extending downwardly toward the planar portion. The gripping legs are positioned on opposite sides of the opening in the planar portion and extend through the opening in the planar portion to extend into the board opening and capture a component lead that extends in the board opening from the bottom side of the circuit board.

Rugged Housing For Portable Devices

View page
US Patent:
20010052521, Dec 20, 2001
Filed:
May 30, 1997
Appl. No.:
08/866754
Inventors:
SURESH GOYAL - WARREN NJ, US
DHIRENDRA MANUBHAI PATEL - JERSEY CITY NJ, US
SANJAY SUDHAKER UPASANI - MANALAPAN NJ, US
International Classification:
B65D006/28
B65D008/18
H04B001/034
US Classification:
220/004210, 455/098000
Abstract:
In a clamshell housing, such as is used for portable devices, engaging elements other than screws or hooks are employed to prevent the two halves of a clamshell housing from having significant slippage between them along the interface at which they meet when the clamshell is subjected to bending and/or torsional moments. Such engaging elements may include slip preventing elements at the clamshell halves interface, e.g., various forms of interlocking teeth, elements that increase friction, or the like, which are added to, or molded into, each half of the housing. By restricting relative motion along the plane of the interface, the propensity to separate along the direction perpendicular to the interface plane is reduced. This is achieved because the restriction of the relative motion increases the bending and torsional rigidities.

Impact-Tolerant Mounting Of Acoustic Components

View page
US Patent:
61283851, Oct 3, 2000
Filed:
Jun 12, 1998
Appl. No.:
9/096759
Inventors:
Suresh Goyal - Warren NJ
Pratod V. Kasbekar - Manalapan NJ
Harish S. Mangrulkar - Colonia NJ
Sanjay Upasani - Manalapan NJ
Assignee:
Lucent Technologies, Inc. - Murray Hill NJ
International Classification:
H04M 100
H04R 2500
US Classification:
379433
Abstract:
Acoustic component sub-assemblies for direct mounting on a telephone handset inner substrate comprise a tubular housing containing a component having terminal pins electrically connected within the tubular housing to coil springs extending outwardly through an open end of the tubular housing. The coil springs serve as component terminals for spring biased contact with conductive lands on the substrate. The tubular housing is press fitted within a seat on the substrate and contacted by the handset outer housing for being tightly clamped within the substrate seat.

Portable Telephone Handset

View page
US Patent:
D3891410, Jan 13, 1998
Filed:
Dec 30, 1994
Appl. No.:
D/032962
Inventors:
Mark Biasotti - San Jose CA
John Edward Clarke - Colts Neck NJ
Michael L. Moroze - New Egypt NJ
Michael John Nuttall - Portola Valley CA
Dhirendra M. Patel - Jersey City NJ
John Henry Schaffeld - New Vernon NJ
Susan L. Tuttle - East Windsor NJ
Sanjay Upasani - Howell NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
1403
US Classification:
D14138

Droppable Battery Packs

View page
US Patent:
62320130, May 15, 2001
Filed:
Nov 26, 1997
Appl. No.:
8/979055
Inventors:
John Edward Clarke - Colts Neck NJ
Suresh Goyal - Warren NJ
Sanjay Sudhaker Upasani - Manalapan NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
H01M 210
H01M 600
US Classification:
429100
Abstract:
In a battery pack made up of battery cells encased within a housing made up of a stronger outer housing portion and a weaker inner housing portion, the battery cells are secured to the stronger outer housing portion. Advantageously, the relative motion between the battery cells and the stronger of the housing portions that results when prior art battery packs are dropped, and which causes catastrophic failure of the prior art battery packs, is prevented. The battery cells may be secured to the stronger outer housing portion, for example, by gluing the battery cells to the stronger housing portion, attaching the battery cells to the stronger housing portion by using double-sided sticky tape, molding features into the stronger housing portion that immobilize the battery cells adjacent to the stronger housing portion, or providing screw holes through the stronger housing portion so that screws may engage the battery cell or an appendage thereto.

Spring Biased Microphone Sub-Assemblies

View page
US Patent:
6246762, Jun 12, 2001
Filed:
May 11, 1998
Appl. No.:
9/075566
Inventors:
Suresh Goyal - Warren NJ
Pratod V. Kasbekar - Manalapan NJ
Harish S. Mangrulkar - Colonia NJ
Sanjay Upasani - Manalapan NJ
Assignee:
Lucent Technologies, Inc. - Murray Hill NJ
International Classification:
H04M 100
US Classification:
379433
Abstract:
Microphone sub-assemblies for direct mounting on a telephone handset inner substrate comprise a tubular housing containing a microphone having terminal pins electrically connected within the tubular housing to leads extending through the housing tubular wall. The leads provide contact springs for spring biased contact with conductive lands on the substrate. In one embodiment, the contact springs comprise coiled springs and, in another embodiment, the contact springs comprise leaf springs terminating in arcuate cam surfaces.

Apparatus For Cooling Electronic Circuitry

View page
US Patent:
20210345521, Nov 4, 2021
Filed:
Jul 14, 2021
Appl. No.:
17/375045
Inventors:
- Rockleigh NJ, US
Kriss Replogle - Brookside NJ, US
Sanjay Upasani - Manalapan NJ, US
Don Florczak - Tenafly NJ, US
Assignee:
Crestron Electronics, Inc. - Rockleigh NJ
International Classification:
H05K 7/20
Abstract:
An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.
Control profile
Sanjay S Upasani from Manalapan, NJ, age ~64 Get Report