Saad K Doss

6538857, Mar 25, 2003

Sep 14, 2000

09/662247

Saad Doss - Gilroy CA
Glen Adam Garfunkel - San Jose CA
Edward Hin Pong Lee - San Jose CA
Chie Ching Poon - San Jose CA
Neil Leslie Robertson - Palo Alto CA
Andrew Ching Tam - Saratoga CA

International Business Machines Corporation - Armonk NY

G11B 540

360323, 430319

A read head is provided with an N-cycle switch for sequentially shorting and unshorting a sense current circuit of a read head so that the read head will be protected from electrostatic discharges (ESDs) by shorting when the read head is not being tested and unshorted during tests of the read head. The shorting and unshorting switches, which are mounted on or in a slider carrying the read head, are activated by a laser beam.

44002467, Aug 23, 1983

Jun 28, 1982

6/392840

George A. Condas - Castro Valley CA
Saad K. Doss - Gilroy CA

International Business Machines Corporation - Armonk NY

C25D 1104

204 58

A barrier anodizing process for an aluminum alloy substrate employs an anodizing current having a density between 20 and 300 milliamps/cm. sup. 2 to produce a 300 volt barrier layer in respectively 60 and 4 second.

55164188, May 14, 1996

Jun 26, 1995

8/494862

Saad K. Doss - Gilroy CA
Dennis R. McKean - San Jose CA
Alfred F. Renaldo - San Jose CA
Robert J. Wilson - Cupertino CA

International Business Machines Corporation - Armonk NY

C25D 502

205119

A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of hydroxyquinoline which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.

45942730, Jun 10, 1986

Nov 19, 1984

6/672518

Saad K. Doss - Gilroy CA
Peter B. P. Phipps - Saratoga CA

International Business Machines Corporation - Armonk NY

B05D 118

4274431

The rate of deposition of metallic film on a substrate in an electroless plating process is substantially increased without affecting film properties or causing adverse consequences to the plating bath. The boiling point of the plating bath is elevated either by adding to the bath a substance, such as ethylene glycol, which does not alter the reactivity of the bath, or by providing a sealed enclosure over the bath to increase the ambient pressure. The bath is then heated to a substantially higher temperature but below the temperature at which localized boiling occurs. Excellent metal film qualities are obtained on the substrate at a substantially higher rate than in conventional electroless plating and no nucleation sites are created in the bath to cause spontaneous decomposition of the bath.

55453074, Aug 13, 1996

Apr 6, 1995

8/417621

Saad K. Doss - Gilroy CA
Dennis R. McKean - San Jose CA
Alfred F. Renaldo - San Jose CA
Robert J. Wilson - Cupertino CA

International Business Machines Corporation - Armonk NY

C25D 502

205122

A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of amninoalkylpyridine which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.