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Ryan M Braid

from Cambridge, MA
Age ~39
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Also known as:
Ryan Mercer Braid
Related to:
Wesley Charles Martin, 52Claire L Martin, 29John E Braid, 78Ruth E Braid, 74Adam T Knabe, 43Ashley M Braid, 41
Connected to:
Danielle E Braid, 39Dann E Braid, 69Deborah A Braid, 71Martin K Braid, 66Tina M Braid, 61Brian M Braida, 54Carlo Braida, 87Charlene A Braida, 72Craig M Braida, 30John P Braida, 69

Ryan Braid Phones & Addresses

  • Cambridge, MA
  • 1781 Spyglass Cv, Austin, TX 78746 (512) 494-4917 (512) 551-3105
  • 6001 Shepherd Mountain Cv, Austin, TX 78730 (512) 494-4917
  • 7051 Richville Dr SE, Massillon, OH 44646 (503) 320-0017

Work

Company: Lightmatter Feb 2018 Position: Senior digital design engineer

Education

Degree: Bachelors, Bachelor of Science School / High School: The University of Toledo 2003 to 2008 Specialities: Computer Science, Engineering, Computer Science and Engineering

Skills

Verilog • Asic • Rtl Design • Low Power Design • Upf • Soc • Logic Synthesis • X86 • Ocp • Axi • Vlsi • Functional Verification • Semiconductors • Simulations • Gate Level Simulation • Embedded Systems • Python • Logic Design • Debugging • Timing Closure • Static Timing Analysis • Rtl Coding • Rtl Verification • Systemverilog • X86 Assembly • Formal Verification • Computer Architecture • Synopsys Tools • Ovm • Perl • C++ • C • Linux • Design Compiler • Tcl • Cdc • Verification • Makefiles • Lec • Eco • Coreassembler • Corebuilder • Integrated Circuits • Processors • Machine Learning • Firmware • Gnu Octave

Ranks

Certificate: Machine Learning

Industries

Semiconductors

Public records

Vehicle Records

Ryan Braid

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Address:
4717 Highland Ter, Austin, TX 78731
VIN:
JHMAP21467S001647
Make:
HONDA
Model:
S2000
Year:
2007

Resumes

Resumes

Ryan Braid Photo 1

Senior Digital Design Engineer

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Location:
5 Craigie Cir, Cambridge, MA 02138
Industry:
Semiconductors
Work:
Lightmatter
Senior Digital Design Engineer
Intel Corporation Apr 2014 - Feb 2018
Senior Ip Logic Design Engineer
Intel Corporation May 2008 - Apr 2014
Component Design Engineer
Intel Corporation May 2006 - Aug 2006
Undergrad Intern Technical
Education:
The University of Toledo 2003 - 2008
Bachelors, Bachelor of Science, Computer Science, Engineering, Computer Science and Engineering
Skills:
Verilog
Asic
Rtl Design
Low Power Design
Upf
Soc
Logic Synthesis
X86
Ocp
Axi
Vlsi
Functional Verification
Semiconductors
Simulations
Gate Level Simulation
Embedded Systems
Python
Logic Design
Debugging
Timing Closure
Static Timing Analysis
Rtl Coding
Rtl Verification
Systemverilog
X86 Assembly
Formal Verification
Computer Architecture
Synopsys Tools
Ovm
Perl
C++
C
Linux
Design Compiler
Tcl
Cdc
Verification
Makefiles
Lec
Eco
Coreassembler
Corebuilder
Integrated Circuits
Processors
Machine Learning
Firmware
Gnu Octave
Certifications:
Machine Learning

Publications

Us Patents

Photonic Communication Platform

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US Patent:
20210278590, Sep 9, 2021
Filed:
May 6, 2021
Appl. No.:
17/313415
Inventors:
- Boston MA, US
Carl Ramey - Westborough MA, US
Michael Gould - Boston MA, US
Thomas Graham - Cambridge MA, US
Darius Bunandar - Boston MA, US
Ryan Braid - Cambridge MA, US
Mykhailo Tymchenko - Malden MA, US
Assignee:
Lightmatter, Inc. - Boston MA
International Classification:
G02B 6/122
G02B 6/12
H01L 21/027
G02B 6/13
G02B 6/136
Abstract:
Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

Photonic Communication Platform

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US Patent:
20200284981, Sep 10, 2020
Filed:
Mar 5, 2020
Appl. No.:
16/810573
Inventors:
- Boston MA, US
Carl Ramey - Westborough MA, US
Michael Gould - Boston MA, US
Thomas Graham - Cambridge MA, US
Darius Bunandar - Boston MA, US
Ryan Braid - Cambridge MA, US
Mykhailo Tymchenko - Malden MA, US
Assignee:
Lightmatter, Inc. - Boston MA
International Classification:
G02B 6/122
G02B 6/12
H01L 21/027
G02B 6/13
Abstract:
Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.
Control profile
Ryan M Braid from Cambridge, MA, age ~39 Get Report