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Ruperta Tamayo Ramdular

from Orange Park, FL
Age ~60
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Also known as:
Ruperta T Ramdular, Dida Ramdular, Ruperta T Sanchez, Ruerta T Ramdular, Ruperta T Randula, Ruperta T Ramoular, Rupert Ramdular, Ruperta R
Phone and address:
1224 Stern Way, Orange Park, FL 32003
(904) 269-0065
Related to:
Virjanand Satram, 66Rajesh Persaud, 53Roy Singh, 60Ida Chandrika, 77Shawana Roark, 46Edna Chainsukh, 76
Connected to:
Kerwin A Rame, 57Ranjini Rame, 43Caroline Rameau, 50Kenneth Rameau, 57Martin G Rameau, 48Peggy Rameau, 49Victor P Rameau, 57Ellen L Ramech, 79Sylvaine N Rameckers, 46Datu E Ramel, 72

Ruperta Ramdular Phones & Addresses

  • 1224 Stern Way, Fleming Island, FL 32003 (904) 269-0065 (904) 269-4969
  • 393 Edson Dr, Orange Park, FL 32073
  • Middleburg, FL
  • 9002 Vickors Ln, Brooklyn Park, MN 55443 (763) 424-4901
  • Winter Park, FL
  • Green Cove Springs, FL
  • San Diego, CA
  • Escondido, CA
  • Poway, CA
  • Fleming Isle, FL
  • 1224 Stern Way, Orange Park, FL 32003 (904) 334-0559

Work

Position: Craftsman/Blue Collar

Education

Degree: Associate degree or higher

Professional Records

License Records

Ruperta Tamayo Ramdular

Address:
1224 Stern Way, Fleming Island, FL 32003
License #:
CL1185663 - Active
Category:
Cosmetology
Issued Date:
Aug 14, 2006
Effective Date:
Aug 14, 2006
Expiration Date:
Oct 31, 2017
Type:
Cosmetologist

Ruperta T Ramdular

Address:
1224 Stern Way, Fleming Island, FL
479 Houston, Green Cove Springs, FL
Phone:
(904) 480-3501
License #:
5161137 - Active
Category:
Health Care
Issued Date:
Feb 12, 2004
Effective Date:
Feb 24, 2004
Expiration Date:
Jul 31, 2017
Type:
Licensed Practical Nurse

Publications

Us Patents

Laser-Assisted Slicing Of Notched Wafer

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US Patent:
20030013227, Jan 16, 2003
Filed:
Mar 7, 2002
Appl. No.:
10/094236
Inventors:
Mohamed Khlif - Fridley MN, US
Gordon Jones - Eagan MN, US
Paul Gallup - New Hope MN, US
Jumna Ramdular - Brooklyn Park MN, US
Ruperta Ramdular - Brooklyn Park MN, US
Assignee:
Seagate Technology LLC - Scotts Valley CA
International Classification:
H01L021/44
H01L021/76
US Classification:
438/106000, 438/110000, 438/114000
Abstract:
A method is used for forming sliders for use in a disc drive actuation system. The method comprises providing a wafer formed of a substrate having a base coat and an overcoat. Wafer-level notch lanes having a first width extend across the wafer in a first direction. The overcoat is removed from the wafer-level notch lanes. The wafer is sliced along a portion of the wafer-level lanes through the base coat to form a channel. The wafer is mechanically sliced through the substrate along slice lanes that extend across the wafer in the first direction to differentiate the wafer into bars. The bars are cut in a second direction substantially perpendicular to the first direction to form the sliders.
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Ruperta Tamayo Ramdular from Orange Park, FL, age ~60 Get Report