US Patent:
20110308956, Dec 22, 2011
Inventors:
Rajwant S. Sidhu - Brea CA, US
Ruben A. Zepeda - Yorba Linda CA, US
Carlos A. Lopez - San Dimas CA, US
International Classification:
H05K 3/46
H05K 3/10
C25D 5/02
Abstract:
Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards are described. One such method includes applying a first resist layer on a substrate having a first copper layer, applying a first image to the first resist layer, developing the first resist layer in accordance with the first image, applying a second copper layer on the first copper layer, electroplating a first metallic layer on the second copper layer, removing the first resist layer, etching a portion of the first copper layer, removing the first metallic layer, depositing a third copper layer on a surface of the assembly, applying a second resist layer on the third copper layer, applying a second image to the second resist layer, developing the second resist layer in accordance with the second image, electroplating a preselected metal layer on the third copper layer, removing the second resist layer, and etching a portion of the third copper layer.
