Ronald L Strijek

6788724, Sep 7, 2004

Jul 6, 2001

09/900423

John E. Sell - San Jose CA
Paul N. Ludwig - Livermore CA
Victor M. Alvarez - Fremont CA
Ronald L. Strijek - Gilroy CA

Intel Corporation - Santa Clara CA

H01S 308

372 92, 372 34

An external cavity laser in a hermetically sealed container and methods for hermetically sealing the external cavity laser. The external cavity laser may be tunable by various mechanisms to allow transmission at multiple selectable wavelength channels.

54989736, Mar 12, 1996

Dec 22, 1994

8/362682

William A. Cavaliere - Verbank NY
John S. Ferrario - Waterbury VT
Howard E. Ferris - Wappingers Falls NY
Raymond C. Schuler - South Burlington VT
Ronald L. Strijek - Wappingers Falls NY

International Business Machines Corporation - Armonk NY

G01B 902
G01R 3102

324765

An apparatus for testing individual ones of semiconductor laser devices of a laser bar during a manufacturing thereof comprises a laser bar chuck for securing the laser bar in a first manner and orientation. A probe is used for probing a laser device of the laser bar. A translational manipulator receives the laser bar chuck and the probe in a second and third manner and orientation, respectively, the manipulator further for translationally positioning the laser bar chuck and the probe independently in a fourth and fifth controlled manner. An energizing means energizes the probe in a sixth controlled manner. A detector detects a lasing of a probed laser device and provides a characteristic output signal representative of a testing characteristic of the probed laser device. Lastly, a controller controls the manipulator and the energizing means in a prescribed manner: (i) in preparation for a testing of a desired one of the laser devices of the laser bar; (ii) during a testing of a desired one of the laser devices of the laser bar; and (iii) upon a completion of the testing of the desired one of the laser devices.

62527258, Jun 26, 2001

Feb 7, 2000

9/498634

Dean Tran - Westminister CA
Eric R. Anderson - Redondo Beach CA
Ronald L. Strijek - Vista CA
Edward A. Rezek - Torrance CA
Luis M. Rochin - Oxnard CA

TRW Inc. - Redondo Beach CA

G02B 702
H01L 2358

359811

A method for fabricating a monolithic micro-optical component. The construction of the micro-optical components is accomplished by using standard semiconductor fabrication techniques. The method comprises the steps of depositing an etch stop layer (44) onto a semiconductor substrate (42); depositing an optical component layer (46) onto the etch stop layer (44); coating the entire surface of the optical component layer with a photoresist material; applying a photoresist mask (50) to the photoresist material on the optical component layer (46); selectively etching away the optical component layer (46) to form at least one optical column (52); forming a pedestal (54) for each of the optical columns (52) by selectively etching away the etch stop layer (44); and finally polishing each of the optical columns (52), thereby forming monolithic optical components (56). The method may optionally include the step of removing the photoresist mask from each of the optical columns prior to polishing the optical columns, as well as the step of depositing an antireflectivity coating onto each of the optical components.

58539603, Dec 29, 1998

Mar 18, 1998

/040636

Dean Tran - Westminster CA
Eric R. Anderson - Redondo Beach CA
Ronald L. Strijek - Vista CA
Edward A. Rezek - Torrance CA

TRW Inc. - Redondo Beach CA

H01L 2714
H01L 310304

430321

The invention relates to a method for fabricating III-V semiconductor micro-optical lenses for hybrid integration with micro-optical devices, where a micro-optical lens is formed from a semiconductor wafer by selectively etching a surface of the semiconductor wafer and a lens arm is formed from the semiconductor wafer on a surface opposite the surface by selectively etching the surface of the semiconductor wafer. The lens and lens arm are then cleaved from the substrate wafer and directly mounted to a micro-optical device. As a result of using III-V semiconductor material to form micro-optical lenses for hybrid integration to micro-optical devices of the same semiconductor material, thermal expansion stability is increased and efficient transfer of light between micro-optical lenses and micro-optical devices is achieved.

61155217, Sep 5, 2000

May 7, 1998

9/074187

Dean Tran - Westminster CA
Eric R. Anderson - Redondo Beach CA
Ronald L. Strijek - Vista CA
Edward A. Rezek - Torrance CA

TRW Inc. - Redondo Beach CA

G02B 632

385 52

The invention relates to an optical integrated alignment device for accurately aligning optical fiber and waveguides to efficiently couple energy between optical devices. This is accomplished by using the anisotropic etch characteristics of III-V semiconductor materials. One orthogonal etch direction serves to provide a channel for precise fiber-positioning; the other direction, which is also orthogonal provides a reflecting surface for directing the optical energy between optical devices; and finally, a non-selective etch to form a micro-optical lens to focus optical energy to an optical device.

61501921, Nov 21, 2000

Jul 13, 1998

9/114633

Dean Tran - Westminster CA
Eric R. Anderson - Redondo Beach CA
Ronald L. Strijek - Vista CA
Edward A. Rezek - Torrance CA

TRW Inc. - Redondo Beach CA

H01L 2144

438106

An interconnected apparatus for producing a low loss, reproducible electrical interconnection between a semiconductor device and a substrate includes a rod and rod receptor. The rod, generally cylindrically shaped, is attached to the semiconductor device and includes an outer circumferential wall which comes into contact with the rod receptor during a bonding process. A lip portion is formed on one end of the rod receptor for interlocking engagement with the rod. The rod receptor is plated on the substrate and includes a generally circularly shaped body which forms a centrally disposed well for receiving the rod. A lip portion is formed on one end or mouth of the rod receptor for interlocking engagement with the rod. When the rod and corresponding receptor are aligned and brought together, the rod deforms and interlocks with its corresponding rod receptor. A thermo-compression bonding process is utilized to bond the rod to the rod receptor, thereby producing a strong interlocking bond.

60748885, Jun 13, 2000

Aug 18, 1998

9/135696

Dean Tran - Westminister CA
Eric R. Anderson - Redondo Beach CA
Ronald L. Strijek - Vista CA
Edward A. Rezek - Torrance CA
Luis M. Rochin - Oxnard CA

TRW Inc. - Redondo Beach CA

H01L 2100

438 39

A method for fabricating a monolithic micro-optical component. The construction of the micro-optical components is accomplished by using standard semiconductor fabrication techniques. The method comprises the steps of depositing an etch stop layer (44) onto a semiconductor substrate (42); depositing an optical component layer (46) onto the etch stop layer (44); coating the entire surface of the optical component layer with a photoresist material; applying a photoresist mask (50) to the photoresist material on the optical component layer (46); selectively etching away the optical component layer (46) to form at least one optical column (52); forming a pedestal (54) for each of the optical columns (52) by selectively etching away the etch stop layer (44); and finally polishing each of the optical columns (52), thereby forming monolithic optical components (56). The method may optionally include the step of removing the photoresist mask from each of the optical columns prior to polishing the optical columns, as well as the step of depositing an antireflectivity coating onto each of the optical components.

61875155, Feb 13, 2001

May 7, 1998

9/074188

Dean Tran - Westminster CA
Eric R. Anderson - Redondo Beach CA
Ronald L. Strijek - Vista CA
Edward A. Rezek - Torrance CA

TRW Inc. - Redondo CA

G02B 636

430321

The invention relates to an optical integrated circuit microbench system for accurately aligning optical fiber and waveguides to efficiently couple energy between optical devices. This is accomplished by using the anisotropic etch characteristics of III-V semiconductor materials in two orthogonal directions. One etch direction serves to provide a channel for precise fiber-positioning; the other direction, which is orthogonal provides a reflecting surface for directing the optical energy onto optical devices.