Ronald S Charsky

49162594, Apr 10, 1990

Jul 3, 1989

7/375247

Ronald S. Charsky - Binghamton NY
Leonard T. Olson - Centreville VA
David P. Pagnani - Apalachin NY

International Business Machines Corporation - Armonk NY

H05K 100

174256

The disclosure describes a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by changes in the dielectric structure between two levels of circuitry. This adjustment in the composite dielectric structure is accomplished by changes in the electrical properties of the composite dielectric material, one level being preset to a value and the other level being adjusted by alterations of predetermined amounts that depend upon the performance desired.

41726642, Oct 30, 1979

Dec 30, 1977

5/865807

Ronald S. Charsky - Binghamton NY
Alexander L. Flamholz - Monsey NY

International Business Machines Corporation - Armonk NY

G02B 900

356356

A system for measuring the lateral displacement between edges located on two spaced apart objects, with a precision in the order of 1 microinch, generates and analyses the diffraction pattern produced by the physical edge on one object and the aerial image of the edge on the other object. The system can be used for the alignment of the objects or the comparison of patterns located on the objects.

47440082, May 10, 1988

Sep 11, 1987

7/097322

Vincent J. Black - Apalachin NY
Ronald S. Charsky - Binghamton NY
Leonard T. Olson - Endwell NY

International Business Machines Corporation - Armonk NY

H05K 720

361386

An electronic packaging structure includes a second level electronic package having at least one opening formed therein and circuitry for electrical connection to a semiconductor chip. A circuitized polyimide film chip carrier includes at least one semiconductor chip mounted on one major surface thereof and at least one decoupling capacitor mounted on an opposite surface thereof. The decoupling capacitor is electrically coupled to input/output contacts of the semiconductor chip. The carrier is then mounted on the second level electronic package so that one semiconductor chip is positioned within a respective opening and the circuitry formed on the carrier is coupled to the circuitry formed on the second level package thereby interconnecting the semiconductor chip to the electronic package.