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Roger D Mock

from Morristown, TN
Age ~65
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Also known as:
Roger Duane Mock, Rodger D Mack, Roger Y
Phone and address:
2789 Cherokee Dr, Morristown, TN 37814
Related to:
Roger Holden, 65Raymond C Schultz, 96Judy MockCarol L Holden, 61Tamara L Holden, 79Heidi Ann Garant, 58Robert W Holden, 82Edward D Roberts, 68D RobertsRichard C Loznak, 80Craig Allan Roberts, 54Brenda K Dunlap, 52Judith M Mock, 63Kristene O Loznak, 79Amanda L Mccray, 37Carol Lynn Loznak, 61
Connected to:
Aaron S Mock, 44Alexandra M Mock, 36Alexander Mock, 55Athena G Mock, 69Bill W Mock, 79Brandon Mock, 35Brett F Mock, 56Carmen M Mock, 81Cary L Mock, 60Cassi Mock, 42

Roger Mock Phones & Addresses

  • 2789 Cherokee Dr, Morristown, TN 37814
  • 1931 Tehama St, Oxnard, CA 93035
  • Dandridge, TN
  • 58 Pacific Ave, Ventura, CA 93001
  • Kokomo, IN
  • Las Vegas, NV
  • Hampton, TN
  • Long Beach, CA
  • Ojai, CA
  • Port Hueneme, CA

Work

Company: Delphi electronics & safety - Kokomo, IN 1998 Position: Senior manufacturing engineer

Education

School / High School: Ball State University- Muncie, IN 1978 Specialities: Master of Arts in Industrial Education

Skills

Tool Design • Solid Edge (CAD)

Resumes

Resumes

Roger Mock Photo 1

Roger Mock

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Roger Mock Photo 2

Roger Mock Kokomo, IN

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Work:
Delphi Electronics & Safety
Kokomo, IN
1998 to Apr 2013
Senior Manufacturing Engineer
Delphi Delco Electronics Systems
Kokomo, IN
1993 to 1998
Senior Project Engineer
Delco Electronics Corporation
Kokomo, IN
1986 to 1993
Advanced Project Engineer
Delco Electronics Corporation
Kokomo, IN
1979 to 1986
Manufacturing Tool Designer
Education:
Ball State University
Muncie, IN
1978 to 1979
Master of Arts in Industrial Education
Ball State University
Muncie, IN
1974 to 1978
Bachelor of Science in Industrial Education
Skills:
Tool Design, Solid Edge (CAD)

Publications

Us Patents

Automotive Electronics Heat Exchanger

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US Patent:
6639798, Oct 28, 2003
Filed:
Jun 24, 2002
Appl. No.:
10/178136
Inventors:
Michael A Jeter - Kokomo IN
Roger A Mock - Kokomo IN
Erich W Gerbsch - Cicero IN
Jeffrey J. Ronning - Tipton IN
Ralph S. Taylor - Noblesville IN
Andrew R. Hayes - Clarence Center NY
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H05K 720
US Classification:
361699, 361698, 361702, 361704, 174 151, 165 804
Abstract:
An electronics assembly is provided, including a housing and at least one electronic power device positioned within. A heat sink device is positioned within the housing and is in thermal communication with the electronic power device. The heat sink device includes a fluid vessel , a fluid input port , a fluid output port , and at least one fin insert brazed into the fluid vessel. The heat sink device is in fluid communication with an automotive radiator such that coolant flows from the automotive radiator through the fluid vessel thereby cooling the electronic power device.

Dual-Sided Substrate Integrated Circuit Package Including A Leadframe Having Leads With Increased Thickness

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US Patent:
7148564, Dec 12, 2006
Filed:
Feb 17, 2004
Appl. No.:
10/780163
Inventors:
Roger A Mock - Kokomo IN, US
Erich W. Gerbsch - Cicero IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H01L 23/48
H01L 23/495
H01L 23/498
US Classification:
257696, 257E23063, 257673, 257676, 257734, 257775, 257776, 257691, 257E23066, 257666, 257698
Abstract:
An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

Dual-Sided Substrate Integrated Circuit Package Including A Leadframe Having Leads With Increased Thickness

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US Patent:
7697303, Apr 13, 2010
Filed:
Apr 24, 2008
Appl. No.:
12/150070
Inventors:
Roger A Mock - Kokomo IN, US
Erich W. Gerbsch - Cicero IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H05K 5/02
US Classification:
361813, 361807
Abstract:
An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

Dual-Sided Substrate Integrated Circuit Package Including A Leadframe Having Leads With Increased Thickness

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US Patent:
20070069348, Mar 29, 2007
Filed:
Oct 5, 2006
Appl. No.:
11/543605
Inventors:
Roger Mock - Kokomo IN, US
Erich Gerbsch - Cicero IN, US
International Classification:
H01L 23/495
H01L 21/00
US Classification:
257676000, 257696000, 438123000, 257E23048
Abstract:
An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

Dual-Sided Substate Integrated Circuit Package Including A Leadframe Having Leads With Increased Thickness

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US Patent:
20100133672, Jun 3, 2010
Filed:
Feb 2, 2010
Appl. No.:
12/698644
Inventors:
ROGER A. MOCK - KOKOMO IN, US
ERICH W. GERBSCH - CICERO IN, US
Assignee:
DELPHI TECHNOLOGIES, INC. - TROY MI
International Classification:
H01L 23/495
H01R 43/00
US Classification:
257676, 257666, 29884, 257E23031
Abstract:
An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

Parallel Dual Switch Module

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US Patent:
60547650, Apr 25, 2000
Filed:
Apr 27, 1998
Appl. No.:
9/067242
Inventors:
Charles Tyler Eytcheson - Kokomo IN
Monty Bradford Hayes - Kokomo IN
Lisa Ann Viduya - Carmel IN
Roger Allen Mock - Kokomo IN
Eric Von Kierstead - Anderson IN
Todd G. Nakanishi - Noblesville IN
Robert John Campbell - Noblesville IN
Erich William Gerbsch - Brownsburg IN
Assignee:
Delco Electronics Corporation - Kokomo IN
International Classification:
H01L 2334
US Classification:
257724
Abstract:
A parallel dual switch module that is characterized by improved mechanical and electrical packaging efficiency and low cost. The module includes a common terminal defined by a first stamped elongate metal plate insert molded into the module housing, and positive and negative terminals defined by second and third stamped elongate metal plates disposed side-by-side atop the common terminal. Connection areas formed on the positive and negative terminals extend in opposite lateral directions, and interdigitate with connection areas formed on the common terminal, thereby forming two linear parallel rows of connection areas. Adjacent each row of connection areas, and mounted on a baseplate of the module is a set of parallel connected transistors subassemblies. A molded elongate gate collection component is mounted on the baseplate between the sets of transistor subassemblies, and beneath the common terminal. The gate collection component confines a pair of insert molded gate terminal strips to which the gate terminals of the respective sets of transistor subassemblies are connected, and the terminal strips, in turn, are coupled to gate terminals of the module.

Braided Wire Connection For An Electronics Assembly

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US Patent:
20150171578, Jun 18, 2015
Filed:
Dec 13, 2013
Appl. No.:
14/105624
Inventors:
- Troy MI, US
ROGER A. MOCK - KOKOMO IN, US
Assignee:
DELPHI TECHNOLOGIES, INC. - Troy MI
International Classification:
H01R 25/16
Abstract:
An electrical assembly that includes an electronic device, a buss bar, and an electrical connection. The electronic device is operable to control electrical energy. The buss bar is configured to distribute electrical energy within the assembly. The electrical connection is configured to electrically interconnect the device and the buss bar. The electrical connection is formed of braided wire. Flat braided wire is advantageous as it is more flexible than a direct connection formed by a sheet-metal type lead frame, and provides for large contact areas capable of carrying higher currents than a wire-to-surface type contact made with a twisted wire that is generally round in shape.
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Roger D Mock from Morristown, TN, age ~65 Get Report