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Rockwell M Hsu

from Tempe, AZ
Age ~61

Rockwell Hsu Phones & Addresses

  • Tempe, AZ
  • Poinciana, FL
  • Milpitas, CA
  • 3461 Glenhaven Dr, Phoenix, AZ 85048 (480) 704-8998
  • 3416 Glenhaven Dr, Phoenix, AZ 85048
  • 2922 Woodland Ave, Phoenix, AZ 85048 (480) 704-8998
  • 3232 Humbolt Ave, Santa Clara, CA 95051 (408) 260-9889
  • Sunnyvale, CA

Publications

Us Patents

Conductive Interconnects Along The Edge Of A Microelectronic Device

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US Patent:
7750441, Jul 6, 2010
Filed:
Jun 29, 2006
Appl. No.:
11/479611
Inventors:
Rockwell M. Hsu - Phoenix AZ, US
Thomas S. Dory - Gilbert AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 29/40
US Classification:
257621, 257753, 257762, 257773, 257774, 257E23145, 257E21577
Abstract:
Embodiments of the invention include apparatuses and methods relating to conductive interconnects along the edges of a microelectronic device. In one embodiment, the conductive interconnect has the shape of a half cylinder.

Integrated Inductors And Compliant Interconnects For Semiconductor Packaging

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US Patent:
20060038289, Feb 23, 2006
Filed:
Oct 14, 2005
Appl. No.:
11/251403
Inventors:
Rockwell Hsu - Phoenix AZ, US
Sriram Muthukumar - Chandler AZ, US
Jiangqi He - Gilbert AZ, US
International Classification:
H01L 23/48
US Classification:
257734000
Abstract:
Some embodiments of the present invention include integrated inductors and compliant interconnects for semiconductor packaging.

Integrated Inductors And Compliant Interconnects For Semiconductor Packaging

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US Patent:
20070290362, Dec 20, 2007
Filed:
Sep 4, 2007
Appl. No.:
11/849437
Inventors:
Rockwell Hsu - Phoenix AZ, US
Sriram Muthukumar - Chandler AZ, US
Jiangqi He - Gilbert AZ, US
International Classification:
H01L 23/48
US Classification:
257774000, 257531000, 257E23010
Abstract:
Some embodiments of the present invention include integrated inductors and compliant interconnects for semiconductor packaging.
Rockwell M Hsu from Tempe, AZ, age ~61 Get Report