Inventors:
Rockwell M. Hsu - Phoenix AZ, US
Thomas S. Dory - Gilbert AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 29/40
US Classification:
257621, 257753, 257762, 257773, 257774, 257E23145, 257E21577
Abstract:
Embodiments of the invention include apparatuses and methods relating to conductive interconnects along the edges of a microelectronic device. In one embodiment, the conductive interconnect has the shape of a half cylinder.