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Robin V Ihnfeldt

from San Diego, CA
Age ~47
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Also known as:
Robin Veronica Ihnfeldt, Robin T
Phone and address:
10459 Roselle St STE A, San Diego, CA 92121
Related to:
Kanyanee IhnfeldtScott Ihnfeldt, 45Ronald Ihnfeldt, 82Mary Ihnfeldt, 77
Connected to:
Bill N Ihnken, 63Kirsten Ihns, 35Linda L Ihns, 73Kent T Ihori, 40Lani A Ihori, 34Larry S Ihori, 98Stanley K Ihori, 67Nicole M Ihrie, 51Alyssa Ihrig, 33Claudia M Ihrig, 80

Robin Ihnfeldt Phones & Addresses

  • 10459 Roselle St STE A, San Diego, CA 92121
  • 1652 Reed Ave, San Diego, CA 92109
  • Rogers, AR
  • Parker, CO
  • 3324 Lakeharbor Ln, Boise, ID 83703
  • Golden, CO
  • 10514 E Black Forest Dr, Parker, CO 80138

Resumes

Resumes

Robin Ihnfeldt Photo 1

President

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Location:
3226 Newell St, San Diego, CA 92106
Industry:
Nanotechnology
Work:
Apex Medical Technologies Jul 2008 - Nov 2009
Senior Development Engineer
General Engineering & Research, L.l.c. Jul 2008 - Nov 2009
President
Pfizer Apr 2005 - Jul 2008
Purification Engineer
University of California, San Diego Sep 2003 - Jun 2008
Graduate Student Researcher
Micron Technology 2001 - 2003
Development Engineer
Education:
Uc San Diego 2003 - 2008
Doctorates, Doctor of Philosophy, Chemical Engineering Uc San Diego 2003 - 2005
Master of Science, Masters, Chemical Engineering Colorado School of Mines 1998 - 2001
Bachelors, Bachelor of Science, Chemical Engineering
Languages:
English
Robin Ihnfeldt Photo 2

Robin Ihnfeldt

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Location:
San Diego, CA
Industry:
Medical Devices
Education:
University of California, San Diego 2003 - 2008
Robin Ihnfeldt Photo 3

Robin Ihnfeldt

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Robin Ihnfeldt Photo 4

Robin Ihnfeldt

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Robin Ihnfeldt
General Engineering & Research, LLC
Engineering & Research · Materials Research · Engineering Services · Engineering Services Coml Physical Research Noncoml Research Orgnztn Legal Services Office
10459 Roselle St, San Diego, CA 92121
1652 Reed Ave, San Diego, CA 92109
1040 Wilbur Ave, San Diego, CA 92109

Publications

Us Patents

Contact Release Capsule Useful For Chemical Mechanical Planarization Slurry

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US Patent:
20130280910, Oct 24, 2013
Filed:
Jul 5, 2012
Appl. No.:
13/542651
Inventors:
Robin Ihnfeldt - San Diego CA, US
International Classification:
C09G 1/02
H01L 21/306
US Classification:
438693, 252 791
Abstract:
The invention relates to a contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein the particle is impregnated with the chemical payload, and the chemical payload is held inside the particle by the polymer coating until the contact release capsule contacts a surface and a shearing force removes the polymer coating allowing the chemical payload to release outside the particle. The contact release capsule is useful in chemical mechanical planarization slurries. Particularly, the contact release capsule may comprise a glycine impregnated silica nanoparticle coated with a polymer, wherein the contact release capsule is dispersed in an aqueous solution and used in the copper chemical mechanical planarization process. Use of the contact release capsule in a slurry for copper chemical mechanical planarization may significantly improve planarization efficiency, decrease unwanted etching and corrosion, and improve dispersion stability.

Contact Release Capsule Useful For Chemical Mechanical Planarization Slurry

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US Patent:
20150132958, May 14, 2015
Filed:
Jan 20, 2015
Appl. No.:
14/601011
Inventors:
- San Diego CA, US
Robin Ihnfeldt - San Diego CA, US
International Classification:
C09G 1/02
H01L 21/768
H01L 21/306
US Classification:
438693, 252 791, 252 795
Abstract:
The invention relates to a contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein the particle is impregnated with the chemical payload, and the chemical payload is held inside the particle by the polymer coating until the contact release capsule contacts a surface and a shearing force removes the polymer coating allowing the chemical payload to release outside the particle. The contact release capsule is useful in chemical mechanical planarization slurries. Particularly, the contact release capsule may comprise a glycine impregnated silica nanoparticle coated with a polymer, wherein the contact release capsule is dispersed in an aqueous solution and used in the copper chemical mechanical planarization process. Use of the contact release capsule in a slurry for copper chemical mechanical planarization may significantly improve planarization efficiency, decrease unwanted etching and corrosion, and improve dispersion stability.
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Robin V Ihnfeldt from San Diego, CA, age ~47 Get Report