Inventors:
David J. Mitchell - Oviedo FL, US
Anand A. Kulkarni - Oviedo FL, US
Ramesh Subramanian - Oviedo FL, US
Edward R. Roesch - Orlando FL, US
Rod Waits - Sunnyvale CA, US
Roberto Schupbach - Fayetteville AR, US
John R. Fraley - Fayetteville AR, US
Alexander B. Lostetter - Fayetteville AR, US
Brice McPherson - Fayetteville AR, US
Bryon Western - West Fork AR, US
Assignee:
Siemens Energy, Inc. - Orlando FL
Arkansas Power Electronics International, Inc. - Fayetteville AR
International Classification:
H05K 1/14
US Classification:
361739, 3613211, 361737, 361743, 361760, 361767, 361770, 174255, 174521, 174557, 257100, 257531, 257678, 257728, 29739, 29840, 438125, 438637, 428383
Abstract:
A circuit assembly () resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board () is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.