Inventors:
Robert L. Ornsteen - Key West FL
Peter S. Melendy - Brentwood NH
Dennis J. Fitzmeyer - Epping NH
Assignee:
Adhesive Technologies - Hampton NH
International Classification:
C08L 3104
C08L 9108
C08L 9304
Abstract:
Hot-melt adhesives, useful for both glue-port and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280. degree. F. and preferably at temperatures of at most 250. degree. F. The adhesive compositions have a heat resistance of at least 125. degree. F. and are readily shaped into glue sticks for use in glue guns. The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifyin resin and/or wax. The resulting composition has a shape viscosity profile, which is readily achieved, e. g. , by using a high melt index adhesive polymer as an essential component.