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Robert Douglas Mikkola

from Kalispell, MT
Age ~75
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Also known as:
Robert D Mikkola, Robert A Mikkola, Robert Mikkole
Phone and address:
410 Leisure Dr, Kalispell, MT 59901
(406) 407-2921
Related to:
Jeremy Scott Mikkola, 34Natasha Mccollum, 43Charity Withrow, 50Beverly WithrowCharles Withrow, 81Barbara Mccravey, 80
Connected to:
Heli S Mikkola, 60Katriina T Mikkola, 38Kevin Mikkola, 63Lisa M Mikkola, 60Margaret L Mikkola, 79Robin Mikkola, 52Leo R Mikkonen, 66Nidia L Mikkonen, 68Rheiff T Mikkonen, 55Kimberly A Mikla, 56

Robert Mikkola Phones & Addresses

  • 410 Leisure Dr, Kalispell, MT 59901 (406) 407-2921
  • 4 Whitney St, North Grafton, MA 01536 (508) 839-6720
  • 10209 Malvinas Cv, Austin, TX 78739 (512) 301-4015
  • 11409 Magna Ct, Austin, TX 78739 (512) 301-4015
  • Knoxville, TN
  • Grafton, MA
  • 4 Whitney St, North Grafton, MA 01536 (508) 308-4831

Work

Position: Construction and Extraction Occupations

Education

Degree: Bachelor's degree or higher

Publications

Us Patents

Electroplating Method

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US Patent:
6649038, Nov 18, 2003
Filed:
Oct 13, 2001
Appl. No.:
09/977588
Inventors:
Robert D. Mikkola - Grafton MA
Jeffrey M. Calvert - Acton MA
Denis Morrissey - Huntington NY
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
C25D 1716
US Classification:
205143, 205148, 205291, 205296
Abstract:
Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.

Method Of Electrodepositing Copper

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US Patent:
6679983, Jan 20, 2004
Filed:
Oct 12, 2001
Appl. No.:
09/976421
Inventors:
Denis Morrissey - Huntington NY
Robert D. Mikkola - Grafton MA
Jeffrey M. Calvert - Acton MA
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
C25D 712
US Classification:
205157, 205123, 205291, 205296
Abstract:
Disclosed are electrolytes for copper electroplating that provide enhanced fill of small features with less overplate. Also disclosed are methods of plating substrates, such as electronic devices, using such electrolytes.

Seed Repair And Electroplating Bath

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US Patent:
6682642, Jan 27, 2004
Filed:
Oct 12, 2001
Appl. No.:
09/976422
Inventors:
Robert A. Mikkola - Grafton MA
Jeffrey M. Calvert - Acton MA
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
C25D 338
US Classification:
205296, 106 126
Abstract:
Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.

Seed Layer Repair

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US Patent:
6797146, Sep 28, 2004
Filed:
Nov 2, 2001
Appl. No.:
10/003151
Inventors:
Denis Morrissey - Huntington NY
Jeffrey M. Calvert - Acton MA
Robert D. Mikkola - Grafton MA
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
C25D 338
US Classification:
205291, 205123, 205157
Abstract:
Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices. Also disclosed are electronic devices containing substantially continuous seed layers.

Leveler Compounds

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US Patent:
7128822, Oct 31, 2006
Filed:
Jun 4, 2003
Appl. No.:
10/453423
Inventors:
Deyan Wang - Hudson MA, US
Chunyi Wu - Westford MA, US
Robert D. Mikkola - Grafton MA, US
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
C25D 3/38
C23C 16/00
US Classification:
205296, 205297, 205298, 106 126
Abstract:
Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and methods are useful for providing a planarized layer of copper on a substrate having small apertures. The compositions and methods provide complete fill of small apertures with reduced void formation.

Electrode, Electrochemical Cell, And Method For Analysis Of Electroplating Baths

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US Patent:
7144488, Dec 5, 2006
Filed:
Jun 5, 2003
Appl. No.:
10/455558
Inventors:
Robert A. Binstead - Marlborough MA, US
Osnat Younes-Metzler - Copenhagen Ø, DK
David A. Valeri - Leominster MA, US
Robert D. Mikkola - Grafton MA, US
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
G01N 27/26
G01N 27/30
G01N 27/403
US Classification:
205 81, 204280, 204412, 204434, 205775, 205787
Abstract:
A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor; an electrolyte disposed within the sheath; and an optionally porous element on the sheath, the porous element providing signal communication between the electrolyte and an analyte.

Leveler Compounds

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US Patent:
7510639, Mar 31, 2009
Filed:
Jul 16, 2005
Appl. No.:
11/182311
Inventors:
Deyan Wang - Hudson MA, US
Robert D. Mikkola - Grafton MA, US
Chunyi Wu - Shrewsbury MA, US
George G. Barclay - Jefferson MA, US
Assignee:
Rohm and Haas Electronic Materials LLC - Marlborough MA
International Classification:
C25D 3/58
C25D 3/38
C23C 18/40
US Classification:
205296, 205239, 205291, 205297, 106 126
Abstract:
Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.

Leveler Compounds

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US Patent:
7662981, Feb 16, 2010
Filed:
Jan 29, 2009
Appl. No.:
12/322090
Inventors:
Deyan Wang - Hudson MA, US
Robert D. Mikkola - Grafton MA, US
Chunyi Wu - Shrewsbury MA, US
George G. Barclay - Jefferson MA, US
Assignee:
Rohm and Haas Electronic Materials LLC - Marlborough MA
International Classification:
C07D 303/12
US Classification:
549556
Abstract:
Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.
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Robert Douglas Mikkola from Kalispell, MT, age ~75 Get Report