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Robert H Metter

from Portland, OR
Age ~68
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Related to:
Harvey D MetterMichael A Metter, 31Evelyn L Metter
Connected to:
Amy E Metter, 54Ben Metter, 41David L Metter, 67Jeff Metter, 41John Metter, 101Kathleen A Metter, 69Renee Metter, 47Joshua R Mettert, 37Michele Mettert, 62Marlene L Mettes, 56

Robert Metter Phones & Addresses

  • Portland, OR
  • 7821 Briarwood Rd, Orange, CA 92869 (714) 633-7439
  • Beaverton, OR
  • San Fernando, CA
  • Brea, CA
  • 7821 E Briarwood Rd, Orange, CA 92869

Work

Position: Production Occupations

Education

Degree: Graduate or professional degree

Resumes

Resumes

Robert Metter Photo 1

Director Of Engineered Optics

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Location:
Portland, OR
Industry:
Semiconductors
Work:
Acm Research Inc
Sales Director and Account Manager
Tru Vue
Director of Engineered Optics
Agc Electronics America
Director Business Development and Marketing
Sgl Group - the Carbon Company Sep 1997 - Nov 1999
Director, Sales and Marketing
Sgl Group - the Carbon Company Oct 1992 - Sep 1996
Business Manager - Semicarb Product Line
Education:
University of California, Los Angeles 1974 - 1978
Bachelor of Applied Science, Bachelors, Bachelor of Science
Skills:
Semiconductors
Business Development
Product Management
Product Development
Thin Films
R&D
Product Marketing
Cross Functional Team Leadership
Manufacturing
New Business Development
Engineering
Optics
Engineering Management
Key Account Management
Six Sigma
Management
Mobile Device Coverglass
Coatings
International Sales
Research and Development
Touch Screens
Led Displays
Digital Signage
Multi Cultural Team Management
Sales Management
Business Strategy
Strategic Planning
Proposal Management
Competitive Analysis
Net Present Value
Semiconductor Industry
Customer Relationship Management
Internet of Things
Marketing Strategy
Negotiations
Strategic Negotiations
High Performance Sales Teams
Sales Performance
Strategic Relationships
Strategic Selling
Coaching
Strategic Sales Plans
Tatical Sales Plan
Interpersonal Skills
Interpersonal Leadership
Interpersonal Relationships
Strtategic Business
Languages:
English
Robert Metter Photo 2

Robert Metter

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Location:
Portland, OR
Robert Metter Photo 3

Director Of Business Development At Agc Electronics America

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Position:
Director of Business Development at AGC Electronics America
Location:
Portland, Oregon Area
Industry:
Semiconductors
Work:
AGC Electronics America
Director of Business Development
Education:
University of California, Los Angeles
Robert Metter Photo 4

Director Of Business Development At Agc Electronics America

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Position:
Director of Business Development at AGC Electronics America
Location:
Portland, Oregon Area
Industry:
Semiconductors
Work:
AGC Electronics America
Director of Business Development
Robert Metter Photo 5

Robert Metter

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Location:
United States

Business Records

Name / Title
Company / Classification
Phones & Addresses
Robert Metter
VP Marketing
Asahi Glass Electronics Matls
Ret Paint/Glass/Wallpaper · Semiconductor and Related Device Manufacturing
4375 NW 235 Ave, Beaverton, OR 97124
(503) 844-3604
Robert Metter
Marketing Director
A G. P R. Inc
Nonclassifiable Establishments · Flat Glass Manufacturing
4375 NW 235 Ave, Beaverton, OR 97124
(503) 872-9805, (503) 640-0691, (503) 693-6247

Publications

Us Patents

Protecting Thin Semiconductor Wafers During Back-Grinding In High-Volume Production

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US Patent:
7186629, Mar 6, 2007
Filed:
Nov 19, 2003
Appl. No.:
10/716992
Inventors:
Mark Wesselmann - Carlsbad CA, US
Kostadin Petkov - San Diego CA, US
Robert Metter - Portland OR, US
Michael S. Wisnieski - Keizer OR, US
John Boyd - Atascadero CA, US
Assignee:
Advanced Materials Sciences, Inc. - Portland OR
International Classification:
H01L 21/46
US Classification:
438460, 438459, 257678, 257687, 257703, 257794, 257E23127, 4284255
Abstract:
A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer configured to provide strength and stiffness to the semiconductor wafer during processing. In one aspect of the invention, the protective disk is soluble in a mildly alkaline or mildly acidic solution. In another aspect, the adhesive layer comprises a high molecular weight polymer. In another aspect, the support layer comprises a polymer and a filler. The present invention may enable a robust, cost-effective, high-volume, automated process for thinning semiconductor wafers below 150 μm, and for subsequent process steps of stress relief and transfer to a dicing frame for die singulation. Additionally, the invention enables use of existing toolsets and processes to produce thinner substrates than conventionally achievable.

High Purity Carbon/Carbon Composite Useful As A Crucible Susceptor

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US Patent:
58584862, Jan 12, 1999
Filed:
Jun 3, 1997
Appl. No.:
8/868211
Inventors:
Robert Howard Metter - Orange CA
Joseph David Hathcock - Huntington Beach CA
Peter M. Winsek - Newport Beach CA
Assignee:
SGL Carbon Composites, Inc. - Gardena CA
International Classification:
B29D 2200
US Classification:
428 341
Abstract:
A Czochralski process furnace component comprises a high purity, semiconductor standard composite including a carbon fiber reinforced carbon matrix having a total level of metal impurity below about 10 ppm, preferably below about 5 ppm, and most preferably having a level of metal impurity below the detection limit of inductively coupled plasma spectroscopy for the metals Ag, Al, Ba, Be, Ca, Cd, Co, Cr, Cu, K, Mg, Mn, Mo, Na, Ni, P, Pb, Sr and Zn. A crucible susceptor for a crystal growing process for pulling a crystal ingot from a crystal material melt in a crucible comprises a high purity composite comprising a two dimensional, continuously woven carbon fiber fabric reinforced carbon matrix; the high purity composite having a total level of metal impurity less than about 10 parts per million; the crucible susceptor being a one piece, ply lay-up structure of said high purity composite, having a side ring and a base, said side ring and said base having substantially the same thickness.

Corrosion Resistant Composites Useful In Chemical Reactors

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US Patent:
60689250, May 30, 2000
Filed:
May 2, 1997
Appl. No.:
8/850205
Inventors:
Doug Wilson - Laguna Beach CA
Raj Mathur - Huntington Beach CA
Gary Pruett - Cypress CA
Robert Howard Metter - Orange CA
Assignee:
SGL Carbon Composites - Gardena CA
International Classification:
B32B 900
US Classification:
428408
Abstract:
A chemical process apparatus component comprising a high purity, corrosion resistant composite including a continuous carbon fiber reinforced carbon matrix having a level of total metal impurity below about 10 ppm, preferably below about 5 ppm. Most preferably, the composite has a level of metal impurity below the detection limit of inductively coupled plasma spectroscopy for the metals Ag, Al, Ba, Be, Ca, Cd, Co, Cr, Cu, K, Mg, Mn, Mo, Na, Ni, P, Pb, Sr and Zn.

High Purity Composite Useful As Furnace Components

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US Patent:
58009248, Sep 1, 1998
Filed:
Mar 31, 1997
Appl. No.:
8/829345
Inventors:
Robert Howard Metter - Orange CA
Assignee:
SGL Carbon Composites, Inc. - Gardena CA
International Classification:
B32B 900
US Classification:
428408
Abstract:
A Czochralski process furnace component is disclosed. The component comprises a high purity, semiconductor standard composite including a carbon fiber reinforced carbon matrix having a level of metal impurity below the detection limit of inductively coupled plasma spectroscopy. A process for producing the components includes heat treatment of the carbon fiber and the components.

Chemical Process Employing Corrosion Resistant Composites

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US Patent:
59895047, Nov 23, 1999
Filed:
Jun 20, 1997
Appl. No.:
8/879982
Inventors:
Doug Wilson - Laguna Beach CA
Raj Mathur - Huntington Beach CA
Gary Pruett - Cypress CA
Robert Howard Metter - Orange CA
Assignee:
SGL Carbon Composites - Gardena CA
International Classification:
C01G 300
US Classification:
423 23
Abstract:
A chemical process apparatus component comprising a high purity, corrosion resistant composite including a continuous carbon fiber reinforced carbon matrix having a level of total metal impurity below about 10 ppm, preferably below about 5 ppm. Most preferably, the composite has a level of metal impurity below the detection limit of inductively coupled plasma spectroscopy for the metals Ag, Al, Ba, Be, Ca, Cd, Co, Cr, Cu, K, Mg, Mn, Mo, Na, Ni, P, Pb, Sr and Zn. A process utilizing at least one of the above components for use in a chemical process apparatus, wherein said component is in contact with at least one of i) a high purity material, such as for processing, and ii) a corrosive process media.

High Purity Composite Useful As Furnace Components

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US Patent:
56832818, Nov 4, 1997
Filed:
Feb 27, 1995
Appl. No.:
8/394605
Inventors:
Robert Howard Metter - Orange CA
Assignee:
Hitco Technologies, Inc - Gardena CA
International Classification:
B32B 900
US Classification:
442179
Abstract:
A Czochralski process furnace component comprises a high purity, semiconductor standard composite including a carbon fiber reinforced carbon matrix having a level of metal impurity below the detection limit of inductively coupled plasma spectroscopy. A process for producing the components includes heat treatment of the carbon fiber and the components.
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Robert H Metter from Portland, OR, age ~68 Get Report