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Robert O Lussow

from Saugerties, NY
Age ~89
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Also known as:
Robert W
Related to:
Ingrid LarkaRebecca Vargas, 56Deborah L Lockwood, 57George Froming, 83George D Froming, 55
Connected to:
Jonathan R Lussow, 60Richard J Lussow, 78Barbara A Lust, 88Bianca S Lust, 40Edward J Lust, 63Mark R Lust, 91Melissa M Lust, 44Patricia A Lust, 82Peter Lust, 64Sally J Lust, 68

Robert Lussow Phones & Addresses

  • Saugerties, NY
  • Hopewell Junction, NY
  • New York, NY
  • Highland, NY
  • 237 Main St, Saugerties, NY 12477

Business Records

Name / Title
Company / Classification
Phones & Addresses
Robert O. Lussow
LUSSOW ASSOCIATES, LTD
PO Box 191, Saugerties, NY 12477

Publications

Us Patents

Multiple Voltage Integrated Circuit Packaging Substrate

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US Patent:
46494170, Mar 10, 1987
Filed:
Sep 22, 1983
Appl. No.:
6/534900
Inventors:
Allan C. Burgess - Yorktown Heights NY
Robert O. Lussow - Hopewell Junction NY
George E. Melvin - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 3902
US Classification:
357 80
Abstract:
A multilayer ceramic integrated circuit packaging substrate provides a plurality of integrated circuit operating voltages at the integrated circuit mounting surface thereof without requiring a separate input/output pin and internal power distribution plane for every integrated circuit operating voltage. The substrate includes a power via for supplying a first integrated circuit operating voltage at the integrated circuit mounting surface, and a plurality of voltage converting means on the integrated circuit mounting surface for stepping down the first operating voltage to all other requisite operating voltages. The voltage converting means may be resistors or operational amplifier voltage dividers.

Multilayer Microelectronic Wiring Module And Method For Forming The Same

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US Patent:
55177514, May 21, 1996
Filed:
Oct 29, 1993
Appl. No.:
8/145273
Inventors:
Arthur Bross - Poughkeepsie NY
Robert O. Lussow - Hopewell Junction NY
Thomas J. Walsh - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 336
US Classification:
29830
Abstract:
A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets formed by injection, compression or other suitable molding techniques. Metal pieces to form vias of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets.

Method For Passivating Chromium

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US Patent:
39392937, Feb 17, 1976
Filed:
Apr 30, 1974
Appl. No.:
5/465657
Inventors:
Vlasta Brusic - Mount Kisco NY
Robert O. Lussow - Hopewell Junction NY
Assignee:
International Business Machines, Corporation - Armonk NY
International Classification:
C23F 702
US Classification:
427403
Abstract:
Chromium is passivated by forming a chromium oxide layer thereon by heating at temperatures of about 450. degree. C in an atmosphere containing oxygen. While useful, per se, the process finds particular application as an integral part of overall processing schemes where thermal cycles are used.

Method Of Direct Transferring Of Electrically Conductive Elements Into A Substrate

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US Patent:
53055233, Apr 26, 1994
Filed:
Dec 24, 1992
Appl. No.:
7/996445
Inventors:
Arthur Bross - Poughkeepsie NY
Julian G. Cempa - Deposit NY
Robert O. Lussow - Hopewell Junction NY
James A. McDonald - Newburgh NY
Donald E. Myers - Poughkeepsie NY
Joseph D. Peruffo - Pleasant Valley NY
Thomas J. Walsh - Poughkeepsie NY
Thomas J. Walsh - Verbank NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 330
US Classification:
29832
Abstract:
A method is provided for forming one or more electrical conductors in a multilayer structure such as a computer component during a punching operation. A conducting sheet is placed in direct contact with a sheet of a deformable dielectric material. A punch is used to form a conducting slug from the sheet and to simultaneously transfer the slug into the dielectric material. During the transfer operation, a portion of the dielectric material is displaced so as to cause a mechanical interference between the slug and dielectric material.

Glass Composition

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US Patent:
39611140, Jun 1, 1976
Filed:
Aug 7, 1974
Appl. No.:
5/495352
Inventors:
Melvin Berkenblit - Yorktown Heights NY
Robert O. Lussow - Hopewell Junction NY
Arnold Reisman - Yorktown Heights NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B32B 900
B44C 508
B06B 324
US Classification:
428 38
Abstract:
A glass composition comprises a low glass transition temperature glass and a higher glass transition temperature glass, which glasses are uniquely capable of forming together a continuous vitreous phase over their entire compositional range. During thermal cycling, the low glass transition temperature glass flows out and solubilizes the higher glass transition temperature glass to thereby synthesize in situ a new glass. The low glass transition temperature glass is composed of 14. 1% SiO. sub. 2, 72. 8% PbO, 12. 5% B. sub. 2 O. sub. 3, 0. 2% Al. sub. 2 O. sub. 3, 0. 1% CaO, 0. 2% Na. sub. 2 O, and 0. 1% MgO, and the higher glass transition temperature glass is composed of 71. 11% SiO. sub. 2, 2. 38% Al. sub. 2 O. sub. 3, 7. 13% CaO, 14. 45% Na. sub. 2 O, 3. 76% MgO, 0. 30% of K. sub. 2 O, 0. 13% B. sub. 2 O. sub. 3, and 0. 74% PbO.

Method For Forming A Multilayer Microelectronic Wiring Module

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US Patent:
52591107, Nov 9, 1993
Filed:
Apr 3, 1992
Appl. No.:
7/863627
Inventors:
Arthur Bross - Poughkeepsie NY
Robert O. Lussow - Hopewell Junction NY
Thomas J. Walsh - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 336
H01K 310
B29C 4700
B32B 3120
US Classification:
29830
Abstract:
A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets formed by injection, compression or other suitable molding techniques. Metal pieces to form vias of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets.

High Density Connector System

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US Patent:
52057380, Apr 27, 1993
Filed:
Apr 3, 1992
Appl. No.:
7/863643
Inventors:
Herbert R. Anderson - Patterson NY
Arthur Bross - Poughkeepsie NY
Julian G. Cempa - Deposit NY
Robert O. Lussow - Hopewell Junction NY
Donald E. Myers - Poughkeepsie NY
Thomas J. Walsh - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R 909
US Classification:
439 59
Abstract:
There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system.

Method Of Manufacturing A High Density Connector System

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US Patent:
52769640, Jan 11, 1994
Filed:
Jan 11, 1993
Appl. No.:
8/002159
Inventors:
Herbert R. Anderson - Patterson NY
Arthur Bross - Poughkeepsie NY
Julian G. Cempa - Deposit NY
Robert O. Lussow - Hopewell Junction NY
Donald E. Myers - Poughkeepsie NY
Thomas J. Walsh - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 320
US Classification:
29853
Abstract:
There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated. After a ball is seated in contact with a conductive trace, the solder plating may be reflowed.
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Robert O Lussow from Saugerties, NY, age ~89 Get Report