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Robert Kerprich

from Dresher, PA
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Connected to:
Alden J Kerr, 29Alexandria D Kerr, 31Alyssa R Kerr, 44Andy Kerr, 38Anedra Kerr, 52Annmarie S Kerr, 57Audrey E Kerr, 55Barbra L Kerr, 51Beth Kerr, 50Billy Kerr, 48

Robert Kerprich Phones & Addresses

  • 9 Sarah Ct, Dresher, PA 19025
  • 14788 Jewell St, Portland, OR 97229 (503) 533-0789
  • 118 Pinecrest Dr, North Kingstown, RI 02852 (401) 294-7793
  • 125 Pinecrest Dr, North Kingstown, RI 02852 (401) 294-7793

Interests

job inquiries, expertise requests, busin...

Industries

Semiconductors

Resumes

Resumes

Robert Kerprich Photo 1

Vp Of Operations At Nexplanar Corporation

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Location:
Portland, Oregon Area
Industry:
Semiconductors
Experience:
NexPlanar Corporation (Privately Held; Semiconductors industry): VP of Operations,  (-) Fujifilm Electronic Materials (Semiconductors industry): Site and Operations Manager,  (2000-2007) Eastman Kodak (Public Company; 10,001 or more employees;...

Business Records

Name / Title
Company / Classification
Phones & Addresses
Robert Kerprich
Vice-President
Nexplanar Corporation
Mfg Electron Tubes
7425 NW Evergreen Pkwy, Beaverton, OR 97124
7175 NW Evergreen Pkwy, Beaverton, OR 97124

Publications

Us Patents

Grooved Cmp Pad

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US Patent:
20090311955, Dec 17, 2009
Filed:
Mar 16, 2009
Appl. No.:
12/381709
Inventors:
Robert Kerprich - Portland OR, US
Karey Holland - North Plains OR, US
Diane Scott - Portland OR, US
Sudhanshu Misra - San Jose CA, US
Assignee:
NexPlanar Corporation - Hillsboro OR
International Classification:
B24D 7/18
US Classification:
451548, 451527
Abstract:
CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

Cmp Pad With Local Area Transparency

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US Patent:
20110171883, Jul 14, 2011
Filed:
Jan 13, 2010
Appl. No.:
12/657135
Inventors:
William Allison - Beaverton OR, US
Ping Huang - St. Louis Park MN, US
Diane Scott - Portland OR, US
Richard Frentzel - Murrieta CA, US
Robert Kerprich - Portland OR, US
Assignee:
NexPlanar Corporation - Hillsboro OR
International Classification:
B24D 7/12
B24B 49/12
B24D 3/00
B24D 3/32
B24D 11/00
US Classification:
451 6, 451527, 51296
Abstract:
A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area;

Soft Polishing Pad For Polishing A Semiconductor Substrate

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US Patent:
20120009855, Jan 12, 2012
Filed:
Jul 8, 2010
Appl. No.:
12/832908
Inventors:
William Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Robert Kerprich - Portland OR, US
Ping Huang - St. Louis Park MN, US
Richard Frentzel - Murrieta CA, US
International Classification:
B24D 11/00
B24D 3/32
B24D 13/14
US Classification:
451527, 51296
Abstract:
Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.

Polishing Pad With Alignment Feature

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US Patent:
20120282849, Nov 8, 2012
Filed:
May 5, 2011
Appl. No.:
13/101826
Inventors:
Robert Kerprich - Portland OR, US
William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
International Classification:
B24D 11/00
B29C 44/22
B29C 44/04
US Classification:
451527, 264319, 264 451
Abstract:
Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.

Polishing Pad With Homogeneous Body Having Discrete Protrusions Thereon

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US Patent:
20120302148, Nov 29, 2012
Filed:
May 23, 2011
Appl. No.:
13/113655
Inventors:
Rajeev Bajaj - Fremont CA, US
Ping Huang - Eden Prairie MN, US
Robert Kerprich - Portland OR, US
William C. Allison - Beaverton OR, US
Richard Frentzel - Murrieta CA, US
Diane Scott - Portland OR, US
International Classification:
B24D 11/00
B29C 44/12
B29C 39/12
US Classification:
451527, 264255, 264 453
Abstract:
Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.

Polishing Pad Having Polishing Surface With Continuous Protrusions

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US Patent:
20170203409, Jul 20, 2017
Filed:
Apr 5, 2017
Appl. No.:
15/479779
Inventors:
- Hillsboro OR, US
William C. ALLISON - Beaverton OR, US
Alexander William SIMPSON - Hillsboro OR, US
Diane SCOTT - Portland OR, US
Ping HUANG - Beaverton OR, US
Leslie M. CHARNS - Portland OR, US
James Richard RINEHART - Portland OR, US
Robert KERPRICH - Portland OR, US
International Classification:
B24B 37/26
B24B 37/22
Abstract:
Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.

Low Density Polishing Pad

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US Patent:
20160221145, Aug 4, 2016
Filed:
Jan 30, 2015
Appl. No.:
14/611064
Inventors:
Ping Huang - Beaverton OR, US
William C. Allison - Beaverton OR, US
Richard Frentzel - Murrieta CA, US
Paul Andre Lefevre - Portland OR, US
Robert Kerprich - Portland OR, US
Diane Scott - Portland OR, US
International Classification:
B24B 37/24
C08J 9/00
C08J 9/228
Abstract:
Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.

Grooved Cmp Pads

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US Patent:
20160023321, Jan 28, 2016
Filed:
Oct 2, 2015
Appl. No.:
14/874179
Inventors:
Robert Kerprich - Portland OR, US
Karey Holland - North Plains OR, US
Diane Scott - Portland OR, US
Sudhanshu Misra - San Jose CA, US
International Classification:
B24B 37/26
Abstract:
CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
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Robert Kerprich from Dresher, PA Get Report