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Robert J Binstead

from Nashua, NH
Age ~64
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Also known as:
Robt Binstead
Phone and address:
33 Lund St, Nashua, NH 03060
(603) 598-9437
Connected to:
Amy E Binstein, 35Abbe I Binstock, 69Alan S Binstock, 77Dereka J Binstock, 77Jodi L Binstock, 65Martha B Binstock, 78Steven A Binstock, 46Warren E Binstock, 57Mary L Binswanger, 78Alan D Bint, 79

Robert Binstead Phones & Addresses

  • 33 Lund St, Nashua, NH 03060 (603) 598-9437
  • 31 Jessica Dr, Nashua, NH 03060 (603) 594-8842

Publications

Us Patents

Electroplating Bath Control

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US Patent:
6645364, Nov 11, 2003
Filed:
Oct 19, 2001
Appl. No.:
10/046507
Inventors:
Jeffrey M. Calvert - Acton MA
Robert A. Binstead - Marlborough MA
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
C25D 2112
US Classification:
205 81, 205 82, 205101, 436173
Abstract:
Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.

Electrode, Electrochemical Cell, And Method For Analysis Of Electroplating Baths

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US Patent:
7144488, Dec 5, 2006
Filed:
Jun 5, 2003
Appl. No.:
10/455558
Inventors:
Robert A. Binstead - Marlborough MA, US
Osnat Younes-Metzler - Copenhagen Ø, DK
David A. Valeri - Leominster MA, US
Robert D. Mikkola - Grafton MA, US
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
G01N 27/26
G01N 27/30
G01N 27/403
US Classification:
205 81, 204280, 204412, 204434, 205775, 205787
Abstract:
A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor; an electrolyte disposed within the sheath; and an optionally porous element on the sheath, the porous element providing signal communication between the electrolyte and an analyte.

Electroplating Bath Control

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US Patent:
20030205476, Nov 6, 2003
Filed:
Jun 9, 2003
Appl. No.:
10/457277
Inventors:
Jeffrey Calvert - Acton MA, US
Robert Binstead - Marlborough MA, US
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
C25D021/12
US Classification:
205/082000
Abstract:
Disclosed is a method of analyzing organic components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.

Electroplating Composition

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US Patent:
20040222104, Nov 11, 2004
Filed:
Feb 13, 2004
Appl. No.:
10/778630
Inventors:
Deyan Wang - Hudson MA, US
Robert Mikkola - Grafton MA, US
Robert Binstead - Marlborough MA, US
Assignee:
Rohm and Haas Electronic Materials, L.L.C - Marlborough MA
International Classification:
C25D003/38
US Classification:
205/291000, 106/001130
Abstract:
Compositions useful for electrodepositing a metal are provided. These compositions contain one or more metal salts, electrolyte, two or more brightener compounds and optionally one or more of leveler compounds and wetting agents. Also provided are methods of depositing a metal layer using these compositions.

Plating Method

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US Patent:
20070012576, Jan 18, 2007
Filed:
Jul 13, 2005
Appl. No.:
11/180468
Inventors:
Robert A. Binstead - Marlborough MA, US
Chunyi Wu - Shrewsbury MA, US
Robert D. Mikkola - Grafton MA, US
Assignee:
Rohm and Haas Electronic Materials LLC - Marlborough MA
International Classification:
C25D 3/38
C25D 5/02
US Classification:
205291000, 205118000
Abstract:
Methods of depositing layers of copper that selectively incorporate certain impurities are provided. Such copper layers reduce stress-induced void formation in wide copper lines under vias.

Copper Electroplating

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US Patent:
6610192, Aug 26, 2003
Filed:
Nov 2, 2001
Appl. No.:
10/002281
Inventors:
Eugene N. Step - Newton MA
Robert A. Binstead - Marlborough MA
Denis Morrissey - Huntington NY
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
C25D 338
US Classification:
205297, 205298
Abstract:
Disclosed are compositions and methods for providing a planarized metal layer on a substrate having small apertures. The compositions and methods of the present invention provide complete fill of small apertures with reduced void formation.
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Robert J Binstead from Nashua, NH, age ~64 Get Report