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Randy J Zoodsma

from Poughkeepsie, NY
Age ~64
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Also known as:
Richard Zoodsma
Phone and address:
25 Mockingbird Ln, Poughkeepsie, NY 12601
(845) 462-0163
Related to:
Deback N ZoodsmaRuth A Zoodsma, 65Richard P Zoodsma, 92Josiah Zoodsma, 30Helen M Zoodsma, 92Crystal G Zoodsma, 31
Connected to:
Vanessa P Zoog, 47Ada M Zook, 76Beverly S Zook, 54Caitlin T Zook, 40Candyce M Zook, 45Catherine E Zook, 65Claudia B Zook, 70Deborah Zook, 75Doris J Zook, 54Jessica L Zook, 41

Randy Zoodsma Phones & Addresses

  • 25 Mockingbird Ln, Poughkeepsie, NY 12601 (845) 462-0163
  • Kentwood, MI
  • 25 Mockingbird Ln, Poughkeepsie, NY 12601 (914) 462-0163

Work

Position: Sales Occupations

Education

Degree: Associate degree or higher

Publications

Us Patents

Cooling System And Method Employing Multiple Dedicated Coolant Conditioning Units For Cooling Multiple Electronics Subsystems

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US Patent:
7106590, Sep 12, 2006
Filed:
Dec 3, 2003
Appl. No.:
10/726347
Inventors:
Richard C. Chu - Hopewell Junction NY, US
Roger R. Schmidt - Poughkeepsie NY, US
Robert E. Simons - Poughkeepsie NY, US
Randy J. Zoodsma - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
F28D 15/00
US Classification:
361701, 622592, 165 804, 16510433
Abstract:
A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof via the control valve through the heat exchanger. The second cooling loop provides cooled system coolant to the associated electronics rack, and expels heat in the heat exchanger from the electronics rack to the chilled facility coolant in the first cooling loop. The control valve allows regulation of the facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop. Various CCU and associated component redundancies of the cooling system are also provided.

Self-Heated Liquid Level Sensor

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US Patent:
7181965, Feb 27, 2007
Filed:
Dec 20, 2004
Appl. No.:
11/017604
Inventors:
Daniel J. Kearney - Ulster Park NY, US
Randy J. Zoodsma - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01K 7/22
G01F 23/22
US Classification:
73295, 374183, 374 54
Abstract:
A liquid level sensor comprising a thermistor probe and a power source connected to the thermistor probe to heat the thermistor probe. A cover encases the thermistor probe and includes openings allowing liquid to enter and exit an interior of the cover and contact the thermistor probe. A detector detects a liquid level in response to a voltage at the thermistor probe.

Method, System And Program Product For Automatically Checking Coolant Loops Of A Cooling System For A Computing Environment

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US Patent:
7270174, Sep 18, 2007
Filed:
Dec 16, 2003
Appl. No.:
10/736944
Inventors:
Richard C. Chu - Hopewell Junction NY, US
Roger R. Schmidt - Poughkeepsie NY, US
Robert E. Simons - Poughkeepsie NY, US
Randy J. Zoodsma - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G05D 23/00
G01M 3/04
US Classification:
165 111, 165297, 73 40, 62129
Abstract:
Method, system and program product are provided for facilitating operation of a cooling system designed to provide system coolant to one or more electronics subsystems of a computing environment. The technique includes automatically checking at least one coolant loop of the cooling system for a leak. The automatically checking includes isolating the at least one coolant loop from coolant flow through the cooling system and checking for drop in coolant pressure within the at least one coolant loop. Upon detection of a drop in coolant pressure, isolation of the coolant loop is retained thereby allowing operation of the cooling system to continue notwithstanding detection of a leak in the at least one coolant loop.

Hybrid Heat Sink Performance Enhancement Using Recirculating Fluid

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US Patent:
7343963, Mar 18, 2008
Filed:
Dec 7, 2005
Appl. No.:
11/296557
Inventors:
Randy J. Zoodsma - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
F28D 15/00
US Classification:
16510433, 165 803, 165 804
Abstract:
A method and incorporated heat sink that is cooled both thorough air flow and liquid circulation is provided. The heat sink is disposed close to electronic components and used for their cooling. It comprises a finned structure positioned such that air can easily pass though it; a heat source plate disposed thermally in direction of heat flow to one side of the finned structure such that the heat source plate is in thermal communication with the finned structure fin base and fin tips, and a second plate also disposed at an opposing end of the finned structure in thermal communication both with finned structure fin base and fin tips. The heat sink also includes fluid re-circulator disposed at least partially in the plates for circulating fluids though the plates and around said finned structure such that both fin tips and fin base is cooled.

Multiple Self Cleaning Orifice Thermal Expansion Device

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US Patent:
7793512, Sep 14, 2010
Filed:
Jun 20, 2006
Appl. No.:
11/425164
Inventors:
Daniel J. Kearney - Ulster Park NY, US
Mark A. Marnell - Kingston NY, US
Lawrence F. Palmer - Hyde Park NY, US
Donald W. Porter - Highland NY, US
Randy J. Zoodsma - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
F25B 41/04
US Classification:
62222, 62223, 62224, 62527, 62528
Abstract:
A multiport expansion device for vapor compression refrigeration systems is provided having improved reliability by preventing orifice fouling by virtue of its mechanical design. Furthermore, multiple arrays of ports of two or more similar or differently sized port holes is contemplated which allows further reliability based on redundant orifices and pin combinations.

Hybrid Heat Sink With Recirculating Fluid And Interleaving Fins

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US Patent:
7819175, Oct 26, 2010
Filed:
Dec 7, 2005
Appl. No.:
11/296556
Inventors:
Randy J. Zoodsma - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
US Classification:
16510433, 165 804
Abstract:
A method and incorporated hybrid air and liquid cooled heat sink that is provided for cooling electronic components. The heat sink comprises a finned structure having fins positioned for air to pass easily through them. The finned structure is flanked by a heat source plate on one side (closer to direction of heat flowing from electronic components) and a second plate on its opposing side such that both of the plates are in thermal communication with fin tips and fin base of the finned structure. The heat source plate itself is composed of two complementary halves with fins on each half. When brought together, the two halves form a unitary, fluid sealed plate while allowing passage of fluids through it by allowing the fins on each half to create and interleaving structure. A fluid re-circulator is also disposed at least partially in the plates for circulating fluids though the plates and the finned structure such that both fin tips and fin base are cooled.

Method, System And Program Product For Monitoring Rate Of Volume Change Of Coolant Within A Cooling System

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US Patent:
20050126276, Jun 16, 2005
Filed:
Dec 16, 2003
Appl. No.:
10/736947
Inventors:
Richard Chu - Hopewell Junction NY, US
Michael Ellsworth - Lagrangeville NY, US
Roger Schmidt - Poughkeepsie NY, US
Robert Simons - Poughkeepsie NY, US
Randy Zoodsma - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01F017/00
US Classification:
073149000
Abstract:
Method, system and program product are provided for monitoring coolant within a cooling system designed to provide system coolant to one or more electronics subsystems. The monitoring technique includes employing at least one pressure transducer to obtain multiple pressure measurements related to an amount of coolant within an expansion tank of the cooling system, and determining a rate of volume change of coolant within the expansion tank employing the multiple pressure measurements. Successive pressure measurements can be taken at a known time interval to determine the rate of volume change of coolant within the expansion tank. An automatic determination can also be made on the immediacy of action to be taken for service of the cooling system based on the rate of volume change of coolant within the expansion tank.

Modular Pumping Unit(S) Facilitating Cooling Of Electronic System(S)

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US Patent:
20130333865, Dec 19, 2013
Filed:
Jun 14, 2012
Appl. No.:
13/517871
Inventors:
Gary F. GOTH - Pleasant Valley NY, US
Robert K. MULLADY - Poughkeepsie NY, US
Allan C. VANDEVENTER - Poughkeepsie NY, US
Randy J. ZOODSMA - Poughkeepsie NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
F28D 15/00
B21D 53/02
US Classification:
16510431, 2989003
Abstract:
Field-replaceable, modular pumping units are provided, configured to facilitate pumping coolant through a cooling apparatus assisting in removal of heat generated by one or more electronic systems. The cooling apparatus includes one or more heat exchange assemblies, and the modular pumping units are coupled in parallel fluid communication to the cooling apparatus. The modular pumping unit includes a housing, a coolant inlet to the housing, a coolant reservoir tank disposed within the housing, a coolant pump, and a coolant outlet of the housing. The coolant reservoir tank and coolant pump are disposed within the housing in fluid communication, and the coolant pump pumps coolant from the coolant reservoir tank to the coolant outlet of the housing. A modular pumping unit controller is associated with the modular pumping unit, and automatically adjusts operation of the coolant pump based upon one or more sensed parameters.
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Randy J Zoodsma from Poughkeepsie, NY, age ~64 Get Report