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Ran Liu

from Menlo Park, CA
Age ~35
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Connected to:
Abraham C Liu, 109Adele T Liu, 65Adi P Liu, 35Alan Y Liu, 39Albert Y Liu, 36Alen K Liu, 39Alma R Liu, 73Amanda T Liu, 54Ambrose M Liu, 52An P Liu, 59

Ran Liu Phones & Addresses

  • Menlo Park, CA
  • Stanford, CA
  • Long Island City, NY
  • New York, NY
  • Lancaster, PA

Work

Company: Jonten certified public accountants - Chengdu, CN Mar 2012 Position: Audit department intern

Education

School / High School: SOUTHWESTERN UNIVERSITY OF FINANCE ECONOMICS- Chengdu, CN Jun 2008 Specialities: Bachelor of Administration in Accounting

Resumes

Resumes

Ran Liu Photo 1

Ran Liu

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Location:
United States
Ran Liu Photo 2

Student

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Position:
Automatic Logistics Specialist at U.S. Army Reserve
Location:
Rowland Heights, California
Industry:
Accounting
Work:
U.S. Army Reserve since Sep 2009
Automatic Logistics Specialist
Education:
California State University-Fullerton 2011 - 2013
Bachelor of Art, Accounting Mt. San Antonio College
Ran Liu Photo 3

Ran Liu

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Location:
United States
Ran Liu Photo 4

Ran Liu

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Location:
United States
Ran Liu Photo 5

Ran Liu

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Location:
United States
Ran Liu Photo 6

Ran Liu

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Location:
United States
Ran Liu Photo 7

Ran Liu Jersey City, NJ

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Work:
JONTEN CERTIFIED PUBLIC ACCOUNTANTS
Chengdu, CN
Mar 2012 to Apr 2012
Audit Department Intern
SICHUAN POWER DEVELOPMENT CO., LTD
Chengdu, CN
Aug 2011 to Sep 2011
Intern in Financial Property Right Department
"RURAL LAND TRANSFER IN CHENGDU" RESEARCH PROJECT
CHENGDU, CN
Dec 2010 to Apr 2011
Team member
RED CROSS SOCIETY OF SWUFE
Chengdu, CN
May 2010 to May 2010
Volunteer
Member/Event Planner
Mar 2009 to Aug 2009
Education:
SOUTHWESTERN UNIVERSITY OF FINANCE ECONOMICS
Chengdu, CN
Jun 2008
Bachelor of Administration in Accounting
BARUCH COLLEGE, Zicklin School of Business
New York, NY
Master of Science in Accounting

Publications

Us Patents

Mitigating Thermal Expansion Mismatch In Temperature Probe Construction Apparatus And Method

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US Patent:
20220351989, Nov 3, 2022
Filed:
Apr 28, 2021
Appl. No.:
17/243203
Inventors:
- Milpitas CA, US
Razieh Mahzoon - Hawyard CA, US
Ran Liu - Fremont CA, US
International Classification:
H01L 21/67
H01L 21/66
Abstract:
A process condition sensing apparatus is disclosed. The apparatus includes a substrate and an electronic enclosure including one or more electronic components. The apparatus includes a floating connection assembly configured to mechanically couple the electronic enclosure to the substrate, the floating connection assembly includes a leg and a foot. The leg or foot are arranged to mitigate thermal stress between one or more interfaces. The one or more interfaces include a leg-enclosure interface or a foot-substrate interface.

Encapsulated Instrumented Substrate Apparatus For Acquiring Measurement Parameters In High Temperature Process Applications

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US Patent:
20200203200, Jun 25, 2020
Filed:
Oct 28, 2019
Appl. No.:
16/665960
Inventors:
- Milpitas CA, US
Earl Jensen - Santa Clara CA, US
Jing G. Zhou - Milpitas CA, US
Ran Liu - Milpitas CA, US
International Classification:
H01L 21/67
H01L 21/687
Abstract:
An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.

Methods And Systems To Modulate Film Stress

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US Patent:
20180130642, May 10, 2018
Filed:
Nov 7, 2017
Appl. No.:
15/805466
Inventors:
- Santa Clara CA, US
John C. Forster - Mt. View CA, US
Ran Liu - Sunnyvale CA, US
Kenichi Ohno - Sunnyvale CA, US
Ning Li - San Jose CA, US
Mihaela Balseanu - Sunnyvale CA, US
Keiichi Tanaka - San Jose CA, US
Li-Qun Xia - Cupertino CA, US
International Classification:
H01J 37/32
C23C 16/50
C23C 16/455
C23C 16/52
C23C 16/458
C23C 16/34
C23C 16/40
Abstract:
Apparatus and methods to control the phase of power sources for plasma process regions in a batch process chamber. A master exciter controls the phase of the power sources during the process sequence based on feedback from the match circuits of the respective plasma sources.

Encapsulated Instrumented Substrate Apparatus For Acquiring Measurement Parameters In High Temperature Process Applications

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US Patent:
20170365495, Dec 21, 2017
Filed:
Sep 27, 2016
Appl. No.:
15/277792
Inventors:
- Milpitas CA, US
Earl Jensen - Milpitas CA, US
Jing G. Zhou - Milpitas CA, US
Ran Liu - Milpitas CA, US
International Classification:
H01L 21/67
H01L 21/687
Abstract:
An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
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Ran Liu from Menlo Park, CA, age ~35 Get Report