Ramakrishna Cheboli

7323058, Jan 29, 2008

Nov 22, 2004

10/996342

Dmitry Lubomirsky - Cupertino CA, US
Arulkumar Shanmugasundram - Sunnyvale CA, US
Russell Ellwanger - San Juan Bautista CA, US
Ian A. Pancham - San Francisco CA, US
Ramakrishna Cheboli - Sunnyvale CA, US

Applied Materials, Inc. - Santa Clara CA

B05C 3/02

118410, 118423, 118428, 118429, 118321, 204227, 204232, 204242, 204267, 134902

An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure.

7497767, Mar 3, 2009

Jan 28, 2005

11/046189

Hung Chih Chen - Santa Clara CA, US
Shijian Li - San Jose CA, US
John M. White - Hayward CA, US
Ramin Emami - San Jose CA, US
Fred C. Redeker - Fremont CA, US
Steven M. Zuniga - Soquel CA, US
Ramakrishna Cheboli - Santa Clara CA, US

Applied Materials, Inc. - Santa Clara CA

B24B 5/35

451398, 451288, 451290

A carrier head for chemical mechanical polishing is described. The carrier head includes a backing assembly, a housing and a damping material. The backing assembly includes a substrate support surface. The housing is connectable to a drive shaft to rotate with the drive shaft about a rotation axis. In one implementation, the damping material is in a load path between the backing assembly and the housing to reduce transmission of vibrations from the backing assembly to the housing.

7827930, Nov 9, 2010

Jan 26, 2005

11/043442

Dmitry Lubomirsky - Cupertino CA, US
Arulkumar Shanmugasundram - Sunnyvale CA, US
Russell Ellwanger - San Juan Bautista CA, US
Ian A. Pancham - San Francisco CA, US
Ramakrishna Cheboli - Sunnyvale CA, US
Timothy W. Weidman - Sunnyvale CA, US

Applied Materials, Inc. - Santa Clara CA

B05C 3/02

118500, 118 52, 118319, 118320, 118420, 118429

An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure. The system also includes a substrate a fluid delivery system that is configured to deliver a processing fluid by use of a spraying process to a substrate mounted in the processing enclosure.

20030068966, Apr 10, 2003

Apr 16, 2002

10/124066

Hung Chen - San Jose CA, US
Steven Zuniga - Soquel CA, US
Ramakrishna Cheboli - Sunnyvale CA, US

Applied Materials, Inc.

B24B005/00
B24B047/02

451/398000

A carrier head has a backing assembly with a substrate support surface, a housing connectable to a drive shaft to rotate with the drive shaft about a rotation axis, and a dampening material in a load path between the backing assembly and the housing. The dampening material reduces transmission of vibrations from the backing assembly to the housing.

20040005842, Jan 8, 2004

Apr 7, 2003

10/409637

Hung Chen - Santa Clara CA, US
Steven Zuniga - Soquel CA, US
Ramakrishna Cheboli - Sunnyvale CA, US

B24B001/00
B24B007/19

451/041000, 451/398000

A carrier head for chemical mechanical polishing of a substrate has a flexible membrane extending beneath a base to define a chamber. The flexible membrane provides a substrate receiving surface, and can be configured so that a pressure profile applied to a substrate is substantially insensitive to retaining ring wear.