Inventors:
James A. Bruce - Underhill VT
Rajesh G. Narechania - Essex Junction VT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01B 2108
G01N 308
G01N 1904
Abstract:
A test site for gauging the adhesion between the insulating layers and the metal layers used to produce the various devices on a semiconductor chip. The chip-sized test site can be formed along with the product chips on the product wafers. The layers of the test site are arranged such that a first polyimide layer forms a first test interface with a silicon nitride layer and a second test interface with a first metal layer, and a second polyimide layer forms a third test interface with a second metal layer, a fourth test interface with the first polyimide layer, and a fifth test interface with the silicon nitride layer. These five interfaces form a single continuous adhesion test interface. During a 90. degree. peel test, the layers of the test site will sequentially separate along this interface.
