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Quinn K Tong

from Nokomis, FL
Age ~71
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Also known as:
Quinn Kun Tong, Quinn Dr Tong, Quinn Athua Tong, Quinn Alhua Tong, Quinn Aihua Tong, Quinn P Tong, Quinn A Tong, Kun K Tong, Tong Quinn
Related to:
Harvey W Wang, 23
Connected to:
Alyssa T Tong, 37Andy Tong, 53Annabella Tong, 42Argus C Tong, 48Audrey Tong, 124Bernice C Tong, 65Billy K Tong, 60Bo L Tong, 69Camille M Tong, 46Carole A Tong, 82

Quinn Tong Phones & Addresses

  • Nokomis, FL
  • 199 Berkley Ave, Belle Mead, NJ 08502 (908) 281-1236 (908) 359-2584 (908) 431-3109
  • 74 Monroe Ave, Belle Mead, NJ 08502
  • Flemington, NJ
  • Bridgewater, NJ
  • Butler, AL
  • Amherst, MA
  • Milford, CT
  • 199 Berkley Ave, Belle Mead, NJ 08502 (908) 581-3789

Work

Position: Professional/Technical

Education

Degree: Graduate or professional degree

Publications

Us Patents

Conductive And Resistive Materials With Electrical Stability For Use In Electronics Devices

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US Patent:
6344157, Feb 5, 2002
Filed:
Feb 13, 2001
Appl. No.:
09/782421
Inventors:
Chih-Min Cheng - Lowell MA
Gerald Fredrickson - Westford MA
Yue Xiao - Belle Mead NJ
Quinn K. Tong - Belle Mead NJ
Daoqiang Lu - Allentown PA
Assignee:
National Starch and Chemical Investment Holding Corporation - New Castle DE
International Classification:
H01B 122
US Classification:
252512, 252514, 2525201
Abstract:
An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, optionally either a reactive or a nonreactive diluent, optionally an inert filler, and an oxygen scavenger or corrosion inhibitor or both to provide the electrical stability. Alternatively, the composition may also include a low melting point metal filler component.

Package Encapsulant Compositions For Use In Electronic Devices

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US Patent:
6350838, Feb 26, 2002
Filed:
Jun 28, 2001
Appl. No.:
09/894540
Inventors:
Bodan Ma - Weehawken NJ
Quinn K. Tong - Belle Mead NJ
Assignee:
National Starch and Chemical Investment Holding Corporation - New Castle DE
International Classification:
C08F 2608
US Classification:
526262, 526258, 526259, 526264, 526315, 526306, 526310, 526312
Abstract:
A curable composition for encapsulating an electronic component comprises one or more mono- or polyfunctional maleimide compounds, or one or more mono- or polyfunctional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, with a free radical curing agent, and optionally, one or more fillers.

Dual Cure B-Stageable Underfill For Wafer Level

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US Patent:
6833629, Dec 21, 2004
Filed:
Dec 14, 2001
Appl. No.:
10/020638
Inventors:
Bodan Ma - Hillsborough NJ
Sun Hee Hong - Hillsborough NJ
Quinn K. Tong - Belle Mead NJ
Assignee:
National Starch and Chemical Investment Holding Corporation - New Castle DE
International Classification:
H01L 2328
US Classification:
257790, 257787, 257788, 257789, 257793
Abstract:
A silicon wafer has a B-stageable underfill material deposited on the active face of the wafer. The B-stageable underfill comprises a first composition with a lower curing temperature and a second composition with a higher curing temperature, characterized in that the first composition has been fully cured.

Pre-Applied Fluxing Underfill Composition Having Pressure Sensitive Adhesive Properties

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US Patent:
7004375, Feb 28, 2006
Filed:
May 23, 2003
Appl. No.:
10/444604
Inventors:
Jayesh Shah - Plaistow NH, US
Brian Wheelock - Sandown NH, US
Quinn K. Tong - Belle Mead NJ, US
Assignee:
National Starch and Chemical Investment Holding Corporation - New Castle DE
International Classification:
B23K 31/02
C08K 9/10
US Classification:
228215, 523211, 525107
Abstract:
The present invention relates to a pressure sensitive fluxing underfill composition that may be pre-applied to electronic components, such as CSP's, in order to increase the reliability of the component against mechanical stresses such as impact and bending. The composition contains an epoxy resin, a solid anhydride curing agent, and catalyst. Other materials, such as air release agents and fillers, may also be added as desired. The composition may be applied selectively to parts of the CSP, for example to the solder bumps. The composition provides sufficient tack in order to hold the electronic assembly together during the assembly process.

Underfill Encapsulant For Wafer Packaging And Method For Its Application

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US Patent:
7037399, May 2, 2006
Filed:
Mar 1, 2002
Appl. No.:
10/084869
Inventors:
Quinn K. Tong - Belle Mead NJ, US
Yue Xiao - Belle Mead NJ, US
Bodan Ma - Racine WI, US
Sun Hee Hong - Hillsborough NJ, US
Assignee:
National Starch and Chemical Investment Holding Corporation - New Castle DE
International Classification:
B32B 31/12
US Classification:
156256, 156330, 257793, 428620, 523466, 528 94, 528103, 528405, 528407, 528418, 528419
Abstract:
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy resin, a solvent, an imidazole-anhydride curing agent, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.

B-Stageable Underfill Encapsulant And Method For Its Application

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US Patent:
7608487, Oct 27, 2009
Filed:
Nov 21, 2005
Appl. No.:
11/284219
Inventors:
Allison Yue Xiao - Belle Mead NJ, US
Quinn K. Tong - Belle Mead NJ, US
Bodan Ma - Racine WI, US
Gyanendra Dutt - Piscataway NJ, US
Assignee:
Henkel AG & Co. KGaA - Düsseldorf
International Classification:
H01L 21/00
US Classification:
438127, 257E21502
Abstract:
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin system comprising an epoxy resin, a phenol-containing compound such as phenol or phenolic resin, a solvent, an imidazole phosphate salt catalyst, inorganic fillers, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.

No Flow Underfill Composition

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US Patent:
20030162911, Aug 28, 2003
Filed:
Jan 31, 2002
Appl. No.:
10/062902
Inventors:
Yue Xiao - Belle Mead NJ, US
Quinn Tong - Belle Mead NJ, US
Paul Morganelli - Upton MA, US
Jayesh Shah - Plaistow NH, US
International Classification:
C08G059/14
US Classification:
525/533000
Abstract:
A curable underfill encapsulant composition which is especially useful in the no-flow encapsulation process. The composition contains a thermal curable resin system comprising an admixing of at least one epoxy resin and a phenol-containing compound such as phenol or phenolic resin, an imidazole-anhydride adduct as a catalyst, and a fluxing agent. Various additives, such as air release agents, flow additives, adhesion promoters and rheology modifiers may also be added as desired.

B-Stageable Underfill Encapsulant And Method For Its Application

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US Patent:
20030164555, Sep 4, 2003
Filed:
Mar 1, 2002
Appl. No.:
10/084873
Inventors:
Quinn Tong - Belle Mead NJ, US
Yue Xiao - Belle Mead NJ, US
Bodan Ma - Racine WI, US
Gyanendra Dutt - Edison NJ, US
International Classification:
H01L021/44
H01L021/56
US Classification:
257/787000, 257/788000, 257/793000, 438/127000, 438/113000, 438/114000
Abstract:
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin system comprising an epoxy resin, a phenol-containing compound such as phenol or phenolic resin, a solvent, an imidazole-anhydride curing agent, inorganic fillers, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.
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Quinn K Tong from Nokomis, FL, age ~71 Get Report