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Peter Dussinger Phones & Addresses

  • 8 Lindside Ct, Lititz, PA 17543 (717) 626-6468
  • Ocean City, MD
  • 8 Lindside Ct, Lititz, PA 17543 (717) 940-5039

Education

Degree: Graduate or professional degree

Emails

Publications

Us Patents

Cylindrical Fin Tower Heat Sink And Heat Exchanger

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US Patent:
6712128, Mar 30, 2004
Filed:
Nov 20, 2002
Appl. No.:
10/300094
Inventors:
Peter M. Dussinger - Lititz PA
David Sarraf - Elizabethtown PA
Assignee:
Thermal Corp. - Stanton DE
International Classification:
H05K 720
US Classification:
165 803, 165182, 165185, 361704
Abstract:
An air flow apparatus including an elongate post and a plurality of fin disks disposed on the elongate post, each fin disk including a centrally disposed opening therein for receiving the elongate post, and a plurality of flow openings disposed around the periphery of the centrally disposed opening. The air flow apparatus is preferably used in conjunction with a circulation device to form a heat exchanger.

Integrated Circuit Heat Pipe Heat Spreader With Through Mounting Holes

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US Patent:
6896039, May 24, 2005
Filed:
May 7, 2004
Appl. No.:
10/841784
Inventors:
Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US
John H. Rosenfeld - Lancaster PA, US
Kenneth L. Minnerly - Lititz PA, US
Assignee:
Thermal Corp. - Stanton DE
International Classification:
F28D015/00
US Classification:
16510426, 16510421, 165 76, 361700, 257715
Abstract:
A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.

Integrated Circuit Heat Pipe Heat Spreader With Through Mounting Holes

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US Patent:
7028760, Apr 18, 2006
Filed:
Mar 1, 2005
Appl. No.:
11/069260
Inventors:
Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US
John H. Rosenfeld - Lancaster PA, US
Kenneth L. Minnerly - Lititz PA, US
Assignee:
Thermal Corp. - Wilmington DE
International Classification:
F28D 15/00
F28F 7/00
US Classification:
16510426, 16510421, 16510433, 165 803
Abstract:
A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.

Integrated Circuit Heat Pipe Heat Spreader With Through Mounting Holes

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US Patent:
7066240, Jun 27, 2006
Filed:
May 9, 2001
Appl. No.:
09/852322
Inventors:
Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US
Assignee:
Thermal Corp - Wilmington DE
International Classification:
F28D 15/00
US Classification:
16510426, 16510433, 361700, 257715
Abstract:
The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

Integrated Circuit Heat Pipe Heat Spreader With Through Mounting Holes

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US Patent:
7100679, Sep 5, 2006
Filed:
Dec 18, 2003
Appl. No.:
10/739709
Inventors:
Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US
Assignee:
Thermal Corp. - Wilmington DE
International Classification:
F28D 15/00
US Classification:
16510426, 16510421
Abstract:
A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

Integrated Circuit Heat Pipe Heat Spreader With Through Mounting Holes

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US Patent:
7100680, Sep 5, 2006
Filed:
Aug 9, 2005
Appl. No.:
11/200349
Inventors:
Peter M. Dussinger - Lititz PA, US
Thomas L. Myers - Lititz PA, US
Assignee:
Thermal Corp. - Wilmington DE
International Classification:
F28D 15/00
F28F 7/00
US Classification:
16510426, 16510421, 165 83, 165185, 165 76, 361700, 257715
Abstract:
The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

Evaporator For Capillary Loop

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US Patent:
7748436, Jul 6, 2010
Filed:
May 3, 2006
Appl. No.:
11/416731
Inventors:
William G. Anderson - Boundbrook NJ, US
David Sarraf - Elizabethtown PA, US
Peter M. Dussinger - Lititz PA, US
John R. Hartenstine - Mountville PA, US
Assignee:
Advanced Cooling Technologies, Inc - Lancaster PA
International Classification:
F28D 15/00
H05K 7/20
US Classification:
16510426, 16510421
Abstract:
The apparatus is a capillary loop evaporator in which the vapor space is the internal volume of a cup shaped evaporator wick with sidewalls in full contact with the outer casing of the evaporator. Liquid is furnished to the wick through thicker wick wall sections, slabs protruding from the liquid-vapor barrier wick, eccentric wick cross sections, or tunnel arteries. The tunnel arteries can also be formed within heat flow reducing ridges protruding into the vapor space. The tunnel arteries can be fed liquid by bayonet tubes or cable arteries, and can be isolated from the heat source with regions of finer wick to impede vapor flow into the liquid. Tunnel arteries also enable separation of the evaporator and the reservoir for thermal isolation and structural flexibility. A wick within the reservoir aids collection of liquid in low gravity applications.

Heat Pipe Heat Spreader With Internal Solid Heat Conductor

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US Patent:
20020050341, May 2, 2002
Filed:
Dec 12, 2001
Appl. No.:
10/020845
Inventors:
Peter Dussinger - Lititz PA, US
Thomas Myers - Lititz PA, US
International Classification:
F28D015/00
US Classification:
165/104260
Abstract:
The invention is a flat heat pipe heat spreader with the addition of a solid heat conductive structure spanning the internal space in the heat pipe only at the region of contact with the heat source. Capillary wick is also bonded to the sides of the solid heat conductive structure. Thus, the solid structure provides both direct heat conduction from the heat source to a heat sink mounted atop the heat spreader and also acts as an extended evaporator surface within the heat pipe. The combination furnishes a decrease in the thermal resistance compared to a heat pipe without the solid structure.
Peter M Dussinger from Lititz, PA, age ~61 Get Report