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Peter C Bordiga

from Petaluma, CA
Age ~73
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Also known as:
Peter Carl Bordiga, Peter C Ordig, Peter C Brodiga, Peter A
Phone and address:
2 Fullerton Ln, Petaluma, CA 94952
(707) 789-9801
Related to:
Adele Bordiga
Connected to:
Victoria L Bordignon, 61Aileen F Bordin, 70Claudia Bordin, 71Isabella Bordin, 40Victor J Bordin, 61Kenneth M Bording, 104Roger W Bordine, 37Scott E Bordinger, 62Carlos R Bordini, 46Joseph R Bordini, 63

Peter Bordiga Phones & Addresses

  • 2 Fullerton Ln, Petaluma, CA 94952 (707) 789-9801
  • Santa Cruz, CA
  • 437 Camille Cir, San Jose, CA 95134
  • Santa Clara, CA
  • El Segundo, CA
  • Norwell, MA
  • Sonoma, CA
  • Rohnert Park, CA
  • Forest Ranch, CA
  • 2 Fullerton Ln, Petaluma, CA 94952

Work

Company: Brooks automation Feb 2006 to Jun 2012 Position: Senior product and manufacturing engineer

Education

Degree: Masters School / High School: The University of Texas at El Paso Specialities: Mechanical Engineering

Skills

Ptc Pro/Engineer • Solidworks • Oracle Agile • Pro/Intralink • Flotherm • Icepak • Flo Emc • Ms Word • Ms Project • Microsoft Excel • Powerpoint • Design For Manufacturing • Manufacturing • Windchill • Basic Metalworking • End Mill • Engine Lathe • Brazing • Mig Welding • Arc Welding • Semiconductor Industry • Semiconductors • R&D • Testing • Metrology • Engineering Management • Fmea • Product Development • Failure Analysis • Lean Manufacturing • Pro Engineer • Design of Experiments • Spc • Cad • Manufacturing Engineering

Industries

Mechanical Or Industrial Engineering

Resumes

Resumes

Peter Bordiga Photo 1

Peter Bordiga

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Location:
2 Fullerton Ln, Petaluma, CA 94952
Industry:
Mechanical Or Industrial Engineering
Work:
Brooks Automation Feb 2006 - Jun 2012
Senior Product and Manufacturing Engineer
Nokia 1999 - 2005
Mechanical Design Engineer Iv
Ag Associates 1995 - 1999
Senior Mechanical Engineer
Lockheed Martin 1990 - 1994
Research Specialist
Education:
The University of Texas at El Paso
Masters, Mechanical Engineering The University of Texas at El Paso
Bachelors, Earth Science, Geology
Skills:
Ptc Pro/Engineer
Solidworks
Oracle Agile
Pro/Intralink
Flotherm
Icepak
Flo Emc
Ms Word
Ms Project
Microsoft Excel
Powerpoint
Design For Manufacturing
Manufacturing
Windchill
Basic Metalworking
End Mill
Engine Lathe
Brazing
Mig Welding
Arc Welding
Semiconductor Industry
Semiconductors
R&D
Testing
Metrology
Engineering Management
Fmea
Product Development
Failure Analysis
Lean Manufacturing
Pro Engineer
Design of Experiments
Spc
Cad
Manufacturing Engineering

Publications

Us Patents

Heat Dissipation System For Multiple Integrated Circuits Mounted On A Printed Circuit Board

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US Patent:
7502229, Mar 10, 2009
Filed:
Jun 21, 2005
Appl. No.:
11/157667
Inventors:
Peter Carl Bordiga - Petaluma CA, US
Assignee:
Alcatel Lucent - Paris
International Classification:
H05K 7/20
H01L 23/48
US Classification:
361719, 361704, 361718, 361720, 257718, 257723, 174 151, 174 161, 174 163, 174252, 165 803, 16510433, 165185
Abstract:
A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate and one or more thermally conductive discs attached to the primary plate. The one or more thermally conductive discs make intimate contact with the one or more ICs mounted to the printed circuit board such that the heat generated by the one or more ICs in operation transfers through the one or more discs and onto the plate, whereupon the heat laterally distributes across the primary plate and dissipates into the environment.

Selective Reflectivity Process Chamber With Customized Wavelength Response And Method

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US Patent:
7737385, Jun 15, 2010
Filed:
Aug 16, 2006
Appl. No.:
11/506174
Inventors:
Paul J. Timans - Mountain View CA, US
Daniel J. Devine - Los Gatos CA, US
Young Jai Lee - Sunnyvale CA, US
Yao Zhi Hu - San Jose CA, US
Peter C. Bordiga - Petaluma CA, US
Assignee:
Mattson Technology, Inc. - Fremont CA
International Classification:
F27B 5/14
F26B 19/00
US Classification:
219390, 219405, 219411, 2194431, 2194441, 2194661, 219533, 219534, 219546, 219547, 219548, 118724, 118725, 118 501, 118728
Abstract:
A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.

Selective Reflectivity Process Chamber With Customized Wavelength Response And Method

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US Patent:
20050023267, Feb 3, 2005
Filed:
Jul 28, 2003
Appl. No.:
10/629400
Inventors:
Paul Timans - Mountain View CA, US
Daniel Devine - Los Gatos CA, US
Young Lee - Sunnyvale CA, US
Yao Hu - San Jose CA, US
Peter Bordiga - Petaluma CA, US
International Classification:
F27D011/00
F27B005/14
US Classification:
219405000, 219390000
Abstract:
A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.

Selective Reflectivity Process Chamber With Customized Wavelength Response And Method

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US Patent:
20100219174, Sep 2, 2010
Filed:
May 10, 2010
Appl. No.:
12/776845
Inventors:
Paul J. Timans - Mountain View CA, US
Daniel J. Devine - Los Gatos CA, US
Young Jai Lee - Sunnyvale CA, US
Yao Zhi Hu - San Jose CA, US
Peter C. Bordiga - Petaluma CA, US
International Classification:
F27D 11/00
US Classification:
219391
Abstract:
A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.
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Peter C Bordiga from Petaluma, CA, age ~73 Get Report