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Peter S Bakos

from San Diego, CA
Age ~37
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Related to:
Corazon C KlemmerRobert S Klemmer, 59Kenneth Klemmer, 54Cynthia D Klemmer, 58Michael M Dupont, 61
Connected to:
Andrew J Bakos, 35Ashley M Bakos, 33Jamie L Bakos, 47Lee A Bakos, 73Melissa F Bakos, 49Mike Bakos, 98Renee M Bakos, 42Tamas Bakos, 61Todd A Bakos, 48Kimberly Bakosh, 66

Peter Bakos Phones & Addresses

  • San Diego, CA
  • Chula Vista, CA
  • Hutto, TX
  • Round Rock, TX
  • Austin, TX

Publications

Us Patents

Structure Containing A Layer Consisting Of A Polyimide And An Organic Filled And Method For Producing Such A Structure

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US Patent:
46703250, Jun 2, 1987
Filed:
Jul 2, 1986
Appl. No.:
6/881586
Inventors:
Peter Bakos - Austin TX
Russell E. Darrow - Endicott NY
Nelson P. Franchak - Binghamton NY
Joseph Funari - Vestal NY
Assignee:
IBM Corporation - Armonk NY
International Classification:
H05K 346
US Classification:
428209
Abstract:
A structure comprising on a substrate successive layers of metal circuitry having therebetween as a dielectric a cured polyimide composition containing a polyimide and aluminum oxide or zinc oxide or mixtures thereof. The structure is produced by a method including the following process steps: blanket screen printing a mixture containing a polyamido carboxylic acid, aluminum oxide or zinc oxide or mixtures thereof and a detackifier with the rest being a solvent on a substrate with a layer of metal circuitry thereon, drying the deposited layer at a temperature between about 25. degree. and about 120. degree. C. , selectively etching holes into the deposited layer where vias between adjacent layers of metal circuitry are needed, curing the deposited layer at a temperature between about 300. degree. and about 400. degree. C. and forming another layer of metal circuitry.

Raw Card Fabrication Process With Nickel Overplate

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US Patent:
47567953, Jul 12, 1988
Filed:
Oct 31, 1986
Appl. No.:
6/925583
Inventors:
Peter Bakos - Austin TX
Lawrence M. Baldauf - Austin TX
Duane T. Napp - Austin TX
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
C23F 102
B44C 122
C03C 1500
C03C 2506
US Classification:
156645
Abstract:
A process for making printed circuit cards is disclosed wherein a copper clad, insulating substrate having a layer of copper from which circuitry lines and patterns will be fabricated, is coated with a thin layer of nickel prior to forming any circuit patterns.
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Peter S Bakos from San Diego, CA, age ~37 Get Report