Inventors:
Peter Bakos - Austin TX
Russell E. Darrow - Endicott NY
Nelson P. Franchak - Binghamton NY
Joseph Funari - Vestal NY
Assignee:
IBM Corporation - Armonk NY
International Classification:
H05K 346
Abstract:
A structure comprising on a substrate successive layers of metal circuitry having therebetween as a dielectric a cured polyimide composition containing a polyimide and aluminum oxide or zinc oxide or mixtures thereof. The structure is produced by a method including the following process steps: blanket screen printing a mixture containing a polyamido carboxylic acid, aluminum oxide or zinc oxide or mixtures thereof and a detackifier with the rest being a solvent on a substrate with a layer of metal circuitry thereon, drying the deposited layer at a temperature between about 25. degree. and about 120. degree. C. , selectively etching holes into the deposited layer where vias between adjacent layers of metal circuitry are needed, curing the deposited layer at a temperature between about 300. degree. and about 400. degree. C. and forming another layer of metal circuitry.