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Payam Bozorgi

from Santa Barbara, CA
Age ~50

Payam Bozorgi Phones & Addresses

  • 990 Cheltenham Rd, Santa Barbara, CA 93105
  • Goleta, CA
  • Sedona, AZ
  • Mobile, AL
  • Fairfield, CA
  • Benicia, CA
  • Los Angeles, CA

Resumes

Resumes

Payam Bozorgi Photo 1

Director

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Location:
Santa Barbara, CA
Industry:
Research
Work:
Boyd Corp
Director

Pimems
Chief Executive Officer and Co-Founder
Education:
Uc Santa Barbara 2006 - 2010
Doctorates, Doctor of Philosophy
University of Southern California
Master of Science, Masters, Mechanical Engineering
Skills:
Mems
Semiconductors
Nanotechnology
Electronics
Matlab
Materials Science
Characterization
Microfabrication
Scanning Electron Microscopy
Nanofabrication
Thin Films
Nanomaterials
Afm
Microfluidics
Photolithography
Payam Bozorgi Photo 2

Net And Pc

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Location:
Santa Barbara, CA
Work:
Vista Net
Net and Pc
Education:
Shahid Khodadadi Technical College
Payam Bozorgi Photo 3

Payam Bozorgi

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Location:
United States

Business Records

Name / Title
Company / Classification
Phones & Addresses
Payam Bozorgi
President
Pimems, Inc
Nonclassifiable Establishments
650 Page Ml Rd, Palo Alto, CA 94304
228 W Anapamu St, Santa Barbara, CA 93101

Publications

Us Patents

Titanium-Based Thermal Ground Plane

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US Patent:
20110120674, May 26, 2011
Filed:
Jul 21, 2009
Appl. No.:
13/055111
Inventors:
Noel C. MacDonald - Santa Barbara CA, US
Carl D. Meinhart - Santa Barbara CA, US
Changsong Ding - Goleta CA, US
Payam Bozorgi - Goleta CA, US
Gaurav Soni - Pasadena CA, US
Brian D. Piorek - Santa Barbara CA, US
Assignee:
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA - Oakland CA
International Classification:
F28D 15/04
B21D 53/02
US Classification:
16510426, 2989003
Abstract:
Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.

High Performance Two-Phase Cooling Apparatus For Portable Applications

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US Patent:
20200256628, Aug 13, 2020
Filed:
Apr 27, 2020
Appl. No.:
16/858781
Inventors:
- Pleasanton CA, US
Payam BOZORGI - Santa Barbara CA, US
Assignee:
PiMEMS, Inc. - Pleasanton CA
International Classification:
F28F 21/08
F28D 15/02
F28D 15/04
H01L 23/427
Abstract:
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

Titanium-Based Thermal Ground Plane

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US Patent:
20200025462, Jan 23, 2020
Filed:
Apr 18, 2019
Appl. No.:
16/388804
Inventors:
- Oakland CA, US
Carl D. Meinhart - , US
Changsong Ding - Goleta, CN
Payam Bozorgi - Santa Barbara CA, US
Gaurav Soni - Fremont, IN
Brian D. Piorek - Santa Barbara CA, US
Assignee:
The Regents of the University of California - Oakland CA
International Classification:
F28D 15/04
H01L 23/427
Abstract:
Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.

High Performance Two-Phase Cooling Apparatus

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US Patent:
20200003500, Jan 2, 2020
Filed:
Aug 16, 2019
Appl. No.:
16/543428
Inventors:
- Santa Barbara CA, US
Payam BOZORGI - Santa Barbara CA, US
Assignee:
PiMEMS, Inc. - Santa Barbara CA
International Classification:
F28D 15/04
Abstract:
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The intermediate substrate may form narrow channels within the wicking structure, providing high capillary forces to support large pressure differences between the liquid and vapor phases, while minimizing viscous losses of the liquid flowing in the wicking structure.

Titanium Thermal Module

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US Patent:
20190116691, Apr 18, 2019
Filed:
Sep 20, 2018
Appl. No.:
16/137471
Inventors:
- Santa Barbara CA, US
Payam BOZORGI - Santa Barbara CA, US
Assignee:
PiMEMS, Inc. - Santa Barbara CA
International Classification:
H05K 7/20
C01G 23/047
F28D 15/02
F28D 15/04
F28F 21/08
Abstract:
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

High Performance Two-Phase Cooling Apparatus For Portable Applications

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US Patent:
20170338167, Nov 23, 2017
Filed:
May 9, 2017
Appl. No.:
15/590621
Inventors:
- Santa Barbara CA, US
Payam BOZORGI - Santa Barbara CA, US
Assignee:
PiMEMS, Inc. - Santa Barbara CA
International Classification:
H01L 23/467
H01L 23/373
F28F 21/08
H01L 23/367
Abstract:
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

Two-Phase Cooling Devices With Low-Profile Charging Ports

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US Patent:
20160377353, Dec 29, 2016
Filed:
Jun 24, 2015
Appl. No.:
14/749439
Inventors:
Payam Bozorgi - Santa Barbara CA, US
Carl D. Meinhart - Santa Barbara CA, US
Assignee:
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA - Oakland CA
PIMEMS, INC. - Santa Barbara CA
International Classification:
F28D 15/02
B23P 15/26
Abstract:
A two-phase cooling device, including a predetermined amount of at least one working fluid, a cavity formed from at least one of a metal structure or a metal alloy structure, at least one opening formed in the structure, wherein said opening is configured as a port for partial filling of the cavity with the at least one working fluid, and at least one cover for said opening, wherein said cover is configured to be sealed to the opening, to prevent said working fluid from leaving the cavity, and to prevent contaminants and non-condensable gas from entering the cavity.

High Performance Two-Phase Cooling Apparatus

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US Patent:
20160216042, Jul 28, 2016
Filed:
Jan 19, 2016
Appl. No.:
15/000460
Inventors:
Payam BOZORGI - Santa Barbara CA, US
Carl MEINHART - Santa Barbara CA, US
International Classification:
F28D 15/04
Abstract:
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The intermediate substrate may form narrow channels within the wicking structure, providing high capillary forces to support large pressure differences between the liquid and vapor phases, while minimizing viscous losses of the liquid flowing in the wicking structure.
Payam Bozorgi from Santa Barbara, CA, age ~50 Get Report