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Paul E Kladitis

from Clayton, OH
Age ~55
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Also known as:
Paul Emmanuel Kladitis, Paul K Kladitis
Phone and address:
6446 Kimmel Rd, Englewood, OH 45315
Related to:
Brooklyn KladitisLydia K Kladitis, 28Jennifer L Barnes, 54Christa Barnes, 27Edgar Petry, 83Claire Highsmith, 56
Connected to:
Michael J Kladke, 63Susan E Kladny, 50Kristin J Kladstrup, 63Michele Kladzan, 63Mary E Klaebel, 51Benjamin J Klaehn, 44Krista A Klaehn, 53Opal F Klaehn, 82Kimberly M Klaer, 34Alvin P Klaeren, 96

Paul Kladitis Phones & Addresses

  • 6446 Kimmel Rd, Clayton, OH 45315
  • 2902 Homeway Dr, Dayton, OH 45434 (937) 426-6645
  • Beavercreek, OH
  • 5766 Benford Dr, Haymarket, VA 20169 (703) 754-7083
  • Deatsville, AL
  • 1166 Palmetto, Edwards, CA 93523 (661) 258-9446
  • New Carlisle, OH

Work

Company: University of dayton research institute 2013 Position: Leader, multifunctional structures and materials group and senior research scientist

Education

Degree: Masters School / High School: Air Command and Staff College 2010 Specialities: Art

Skills

Program Management • Air Force • Security Clearance • Dod • Leadership • R&D • Uav • Engineering • Simulations • Top Secret • Military Operations • Flight Test • Radar • Science • Research • Space Systems • Research and Development • Technical Writing • Project Management • Nanotechnology • Laboratory • Innovation Development • Lean Management • Army • Design of Experiments • Systems Engineering • Acquisitions • University Teaching • Training • Lean Thinking • Staff Management • Operations Management • Community Outreach • Air Crew • Research and Development • Technical Operations • Product Innovation • New Business Development • Mathematical Modeling • Clean Rooms • Microsystems • Device and Materials Characterization • Fabrication • Theory of Constraints • Layout and Design • Modeling and Simulation • Programming • Collaboration • Anechoic Chamber • Microscopy

Industries

Research

Resumes

Resumes

Paul Kladitis Photo 1

Leader, Multifunctional Structures And Materials Group And Senior Research Scientist

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Location:
Dayton, OH
Industry:
Research
Work:
University of Dayton Research Institute
Leader, Multifunctional Structures and Materials Group and Senior Research Scientist
National Reconnaissance Office Us Air Force 2012 - 2013
Director, Technology Exploration Division
Usaf 386Th Air Expeditionary Wing Dec 2011 - Jun 2012
Director of Staff
Us Navy, National Reconnaissance Office 2010 - 2012
Leader, Nanotechnology Group
Usaf Air Command and Staff College Jun 2009 - Jun 2010
Student, Masters, Military Operational Art and Science
Education:
Air Command and Staff College 2010
Masters, Art University of Colorado Boulder 2001
Doctorates, Doctor of Philosophy, Philosophy, Mechanical Engineering Air Force Institute of Technology - Graduate School of Engineering & Management 1997
Master of Science, Masters, Electrical Engineering Wright State University 1996
Bachelors, Bachelor of Science, Electrical Engineering
Skills:
Program Management
Air Force
Security Clearance
Dod
Leadership
R&D
Uav
Engineering
Simulations
Top Secret
Military Operations
Flight Test
Radar
Science
Research
Space Systems
Research and Development
Technical Writing
Project Management
Nanotechnology
Laboratory
Innovation Development
Lean Management
Army
Design of Experiments
Systems Engineering
Acquisitions
University Teaching
Training
Lean Thinking
Staff Management
Operations Management
Community Outreach
Air Crew
Research and Development
Technical Operations
Product Innovation
New Business Development
Mathematical Modeling
Clean Rooms
Microsystems
Device and Materials Characterization
Fabrication
Theory of Constraints
Layout and Design
Modeling and Simulation
Programming
Collaboration
Anechoic Chamber
Microscopy

Publications

Us Patents

Shaped Mems Contact

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US Patent:
7601554, Oct 13, 2009
Filed:
Jan 31, 2005
Appl. No.:
11/047345
Inventors:
Paul E. Kladitis - New Carlisle OH, US
Robert L. Crane - Kettering OH, US
Assignee:
The United States of America as represented by the Secretary of the Air Force - Washington DC
International Classification:
H01L 21/00
US Classification:
438 48, 200181, 257E21001
Abstract:
A MEMS switch fabrication process and apparatus inclusive of a bulbous rounded surface movable contact assembly that is integral with the switch movable element and achieving of long contact wear life with low contact electrical resistance. The disclosed process is compatible with semiconductor integrated circuit fabrication materials and procedures and includes an unusual photoresist reflow step in which the bulbous contact shape is quickly defined in three dimensions from more easily achieved integrated circuit mask and etching-defined precursor shapes. A plurality of differing photoresist materials are used in the process. A large part of the contact and contact spring formation used in the invention is accomplished with low temperature processing including electroplating. Alternate processing steps achieving an alloy metal contact structure are included. Use of a subroutine of processing steps to achieve differing but related portions of the electrical contact structure is also included.

Digital Delay Device

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US Patent:
7676153, Mar 9, 2010
Filed:
Oct 17, 2005
Appl. No.:
11/251192
Inventors:
Guna Seetharaman - Dayton OH, US
Paul E. Kladitis - Edwards CA, US
Assignee:
The United States of America as represented by the Secretary of the Air Force - Washington DC
International Classification:
H04J 14/00
US Classification:
398 45, 398 53, 385 18
Abstract:
A digitally controlled optical delay apparatus providing optical signal delays electrically selectable in the picosecond to nanosecond range by way of selectable signal path lengths. Path lengths are incremented in physical length and path delay time according to digital ratios. The delay element includes micro-miniature path changing mirrors controlled in path length selecting positioning by input signals of logic level magnitude. Fiber optic coupling of signals to and from the delay element and a combination of fixed position and movable mirror included optical signal path lengths are included.

Shaped Mems Contact

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US Patent:
7906738, Mar 15, 2011
Filed:
Oct 13, 2009
Appl. No.:
12/578034
Inventors:
Paul E. Kladitis - New Carlisle OH, US
Robert L. Crane - Kettering OH, US
Assignee:
The United States of America as represented by the Secretary of the Air Force - Washington DC
International Classification:
H01L 29/78
US Classification:
200181, 200237, 257414
Abstract:
A MEMS switch fabrication process and apparatus inclusive of a bulbous rounded surface movable contact assembly that is integral with the switch movable element and achieving of long contact wear life with low contact electrical resistance. The disclosed process is compatible with semiconductor integrated circuit fabrication materials and procedures and includes an unusual photoresist reflow step in which the bulbous contact shape is quickly defined in three dimensions from more easily achieved integrated circuit mask and etching-defined precursor shapes. A plurality of differing photoresist materials are used in the process. A large part of the contact and contact spring formation used in the invention is accomplished with low temperature processing including electroplating. Alternate processing steps achieving an alloy metal contact structure are included. Use of a subroutine of processing steps to achieve differing but related portions of the electrical contact structure is also included.

Radio Frequency Mems Switch Contact Metal Selection

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US Patent:
7235750, Jun 26, 2007
Filed:
Jan 31, 2005
Appl. No.:
11/047344
Inventors:
Paul E. Kladitis - New Carlisle OH, US
Robert L. Crane - Kettering OH, US
Kevin D. Leedy - Centerville OH, US
Assignee:
United States of America as represented by the Secretary of the Air Force - Washington DC
International Classification:
H01H 57/00
US Classification:
200181, 335 78, 257414, 257411, 438107, 438109
Abstract:
A method for selecting metal alloys as the electric contact materials for microelectromechanical systems (MEMS) metal contact switches. This method includes a review of alloy experience, consideration of equilibrium binary alloy phase diagrams, obtaining thin film material properties and, based on a suitable model, predicting contact electrical resistance performance. After determination of a candidate alloy material, MEMS switches are conceptualized, fabricated and tested to validate the alloy selection methodology. Minimum average contact resistance values of 1. 17 and 1. 87 ohms are achieved for micro-switches with gold (Au) and gold-platinum (Au-(6. 3 at %)Pt) alloy contacts. In addition, ‘hot-switched’ life cycle test results of 1. 02×10and 2. 70×10cycles may be realized for micro-switches with Au and Au-(6.
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Paul E Kladitis from Clayton, OH, age ~55 Get Report