Paul E Grandmont

53545931, Oct 11, 1994

Nov 10, 1992

7/973939

Paul E. Grandmont - Cumberland RI
Harold Lake - Sharon MA
Richard A. Anderson - North Attleboro MA

The Foxboro Company - Foxboro MA

B32B 900

428137

A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

49159836, Apr 10, 1990

Jun 10, 1985

6/742747

Harold Lake - Sharon MA
Paul E. Grandmont - Franklin MA

The Foxboro Company - Foxboro MA

B05D 512
H05K 306
H05K 342
H05K 346

427 98

A process for making additive multilayer circuit boards uses separately designed and fabricated composite structures each consisting of a patterned conductive metal foil supported by a photo-processible insulating film. The composite is bonded foil pattern side down to the substrate or pre-existing multilayer structure and selected areas of the insulating film are removed down to underlying metal sites for electroless plating. All of the apertures in the insulating film are then electrolessly plated full of metal flush to the upper surface. Additional patterned composites are applied and plated up as desired to create blind vias and new conductor patterns layer by layer. In an alternate process a foil clad composite is bonded to an existing substrate foil side up. The insulating layer is selectively etched through windows photoetched in the foil layer. The voids in the insulator layer expose copper sites on the underlying composite.

58123873, Sep 22, 1998

Feb 21, 1997

8/803980

Qun Lu - Lexington MA
Paul E. Grandmont - Whitman MA
Shih-Chang Liu - Brighton MA

International Power Devices, Inc. - Boston MA

H02M 100

363144

A multi-deck power converter module assembly for connection with a substrate (e. g. , a host board) having connection regions disposed on its surface includes a second circuit board positioned over a first circuit board, the second circuit board having apertures extending from an upper surface to a lower surface of the second circuit board. At least two rail members are positioned over the second circuit board, each rail member having a first and a second plurality of holes. A pair of spacers are disposed between the first and second circuit boards, each spacer extending through one of the apertures of the second circuit board and received within one of the first plurality of holes of one of the rail members. Terminal pins are attached to the first circuit board, at least one terminal pin extending through the second circuit board and a corresponding one of the second plurality of holes for connection to one of the connection regions on the substrate. Each of the second plurality of holes is sized to allow the rail members to be slidably positioned over the terminal pins during assembly of the power converter module.

53024940, Apr 12, 1994

Jul 17, 1992

7/915341

Paul E. Grandmont - Cumberland RI
Harold Lake - Sharon MA
Richard A. Anderson - Attleboro MA

The Foxboro Company - Foxboro MA

G03C 500

430325

A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

59493216, Sep 7, 1999

Jul 14, 1998

9/114759

Paul E. Grandmont - Whitman MA
Qun Lu - Lexington MA
Fei Ma - Malden MA

International Power Devices, Inc. - Allston MA

H01F 500
H01F 2728

336232

A planar winding assembly includes first and second windings, each winding having an axis and a pair of insulative sheet layers, laminated together, with at least one of each of the pairs of insulative sheets having a hole. Each winding further includes a metal strip conductor that is wound about the axis of its winding and is sealed between the laminated insulative sheet layers. The metal strip conductor has a portion projecting into the hole. The metal strip conductor of the first winding is electrically connected to the metal strip conductor of the second winding through the holes of the insulative sheets.

52544354, Oct 19, 1993

Sep 16, 1992

7/946812

Paul E. Grandmont - Franklin MA
Harold Lake - Sharon MA

The Foxboro Company - Foxboro MA

G03C 190

430260

A CAD driven photoplotter selectively exposes a photographic imaging layer without affecting the underlying UV sensitive resist on a substrate to make a printed wiring board, for example. The image layer is developed on the board and used as an in situ mask for the underlying UV resist during exposure to UV. After UV exposure, the image layer is peeled off to allow conventional processing of the resist. The in situ mask is preferably applied in the form of a baseless, high contrast, high gamma emulsion layer bonded to the protective cover sheet over the uncured resist. To facilitate application, the emulsion layer is carried by a release paper which is removed before photoplotting. After UV exposure, the cover sheet and emulsion layer are integrally peeled from the resist.

57810931, Jul 14, 1998

Aug 5, 1996

8/693878

Paul E. Grandmont - Whitman MA
Qun Lu - Lexington MA
Fei Ma - Malden MA

International Power Devices, Inc. - Boston MA

H01F 2728
H01F 500

336232

A planar winding assembly includes first and second windings, each winding having an axis and a pair of insulative sheet layers, laminated together, with at least one of each of the pairs of insulative sheets having a hole. Each winding further includes a metal strip conductor that is wound about the axis of its winding and is sealed between the laminated insulative sheet layers. The metal strip conductor has a portion projecting into the hole. The metal strip conductor of the first winding is electrically connected to the metal strip conductor of the second winding through the holes of the insulative sheets.

60308516, Feb 29, 2000

Jun 4, 1997

8/869014

Paul E. Grandmont - Whitman MA
Clifford D. Fung - Mansfield MA

H01L 2100

438 53

A structure and method of fabrication is provided for a micromechanical overrange protected pressure sensor. A pressure sensor having a silicon substrate is provided with a cavity and a deformable diaphragm wherein deflection of the diaphragm in response to pressure is limited by a forward pressure stop. A method is provided for electrodepositing a metal layer which is attached to the substrate adjacent to the diaphragm to provide a reverse pressure stop in response to pressure supplied to the underside of a diaphragm. The metal layer has a relatively low thermal coefficient of expansion and is patterned through use of a photo-resist layer. A previously deposited precision spacer between the diaphragm and reverse pressure stop is removed to provide a precision gap between the reverse pressure stop and the diaphragm. Micromechanical elements of relatively great size, yet having precision dimensions or positioning are herein fabricated by lithography of patterned resist films up to several hundred microns thick, exposed and developed to great depth with faithful pattern delineation. The patterns formed by development of the exposed resist are then metallized, preferably by pulse electroplating, to form structural or mechanical elements.