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Paul E Fischer

from Otis, OR
Age ~61
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Also known as:
Paul Fisher
Phone and address:
49 N Westview Cir, Rose Lodge, OR 97368
(541) 961-7799
Related to:
Jody K Fisher, 56Christopher M Fisher, 51Lawrence R Ballinger, 86Jessica M Fischer, 36Nola G Stanek, 90Nolan C Fischer, 31Jessica FischerStacy L Fischer, 57Carey M Ridge, 63Rex L StanekBernice M Fischer, 60Joseph K Fischer, 67
Connected to:
Achim Fischer, 78Aida S Fischer, 100Alise K Fischer, 56Alisha D Fischer, 43Amie E Fischer, 35Amy E Fischesser, 67Angela C Fischer, 48Anita E Fischer, 47Arleena D Fischer, 42Arno B Fischer, 60

Paul Fischer Phones & Addresses

  • 49 N Westview Cir, Otis, OR 97368 (541) 961-7799
  • Vancouver, WA
  • Portland, OR
  • North Plains, OR
  • Troutdale, OR
  • Newport, OR
  • Beaverton, OR

Ranks

Licence: Virginia - Authorized to practice law Date: 1998

Professional Records

Lawyers & Attorneys

Paul Fischer Photo 1

Paul Charles Fischer - Lawyer

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Licenses:
Virginia - Authorized to practice law 1998
Paul Fischer Photo 2

Paul Fischer - Lawyer

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ISLN:
921369231
Admitted:
Texas
Paul Fischer Photo 3

Paul Fischer - Lawyer

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Specialties:
SEC, NASD and NYSE Enforcement
Securities
Securities Litigation
Insurance Litigation
ISLN:
907414498
Admitted:
1974
University:
University of Pennsylvania, B.S., 1971
Law School:
University of Pennsylvania, J.D., 1974

Medicine Doctors

Paul Fischer Photo 4

Paul M. Fischer

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Specialties:
Family Medicine
Work:
Center For Primary Care
363 N Belair Rd, Evans, GA 30809
(706) 650-7563 (phone), (706) 650-0512 (fax)

Center For Primary Care
4039 Gtwy Blvd, Grovetown, GA 30813
(706) 922-1600 (phone), (706) 922-1010 (fax)
Education:
Medical School
University of Connecticut School of Medicine
Graduated: 1978
Procedures:
Arthrocentesis
Cardiac Stress Test
Continuous EKG
Destruction of Benign/Premalignant Skin Lesions
Electrocardiogram (EKG or ECG)
Hearing Evaluation
Osteopathic Manipulative Treatment
Pulmonary Function Tests
Skin Tags Removal
Vaccine Administration
Conditions:
Abnormal Vaginal Bleeding
Acne
Acute Bronchitis
Acute Pharyngitis
Acute Sinusitis
Languages:
English
Description:
Dr. Fischer graduated from the University of Connecticut School of Medicine in 1978. He works in Evans, GA and 1 other location and specializes in Family Medicine.
Paul Fischer Photo 5

Paul D. Fischer

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Specialties:
Plastic Surgery
Work:
Milford Medical & Aesthetic Care
849 Boston Post Rd STE 300, Milford, CT 06460
(203) 301-5860 (phone), (203) 301-5861 (fax)
Education:
Medical School
Brown University Alpert Medical School
Graduated: 1981
Procedures:
Breast Reconstruction
Languages:
English
Italian
Vietnamese
Description:
Dr. Fischer graduated from the Brown University Alpert Medical School in 1981. He works in Milford, CT and specializes in Plastic Surgery. Dr. Fischer is affiliated with Griffin Hospital, Milford Hospital Inc and Yale-New Haven Hospital Saint Raphael Campus.

License Records

Paul A. Fischer

License #:
PIC.019686 - Expired
Issued Date:
Dec 15, 2011
Expiration Date:
Dec 31, 2016
Type:
Pharmacist-in-Charge (V)

Paul A. Fischer

License #:
PST.019686 - Expired
Issued Date:
Dec 15, 2011
Expiration Date:
Dec 31, 2016
Type:
Pharmacist

Paul W Fischer

License #:
RS046242A - Expired
Category:
Real Estate Commission
Type:
Real Estate Salesperson-Standard

Paul Donald Fischer

License #:
MT017586T - Expired
Category:
Medicine
Type:
Graduate Medical Trainee

Business Records

Name / Title
Company / Classification
Phones & Addresses
Paul Fischer
Owner
Clydesdale's Moving
Movers. Delivery Service. Garbage Disposals - Household
1808 17th St West, Saskatoon, SK S7M 1E6
(306) 978-0638
Paul Fischer
The Happy Landscaper
Landscape Contractors
5756 Arnhem Terrace, Nanaimo, BC V9T 2M3
(250) 756-6131
Mr. Paul Fischer
Danley's Home Exterior
Garage Builders
3100 Dundee Road, Suite 910, Northbrook, IL 60062-2441
(877) 326-5397
Mr Paul Fischer
Manager
Channel Book Shop
Books - Used & Rare. Books - New
923 SE Bay Blvd UNIT 44, Newport, OR 97365
(541) 765-2352
Paul Fischer
Owner
Clydesdale's Moving
Movers · Delivery Service · Garbage Disposals - Household
(306) 978-0638
Paul Fischer
Manager
Elberfeld Garage
Auto Repair Services
(812) 983-2638, (812) 983-2638
PAUL FISCHER
MANAGER
SERVERON CORPORATION
Instrument Manufacturing for Measuring and Testing Electrici · Home Health Care Services
3305 NW Aloclek Dr, Hillsboro, OR 97124
(503) 924-3200, (503) 924-3242
Paul Fischer
Incorporator
DELTA GATE LODGE NO. 2060, LOYAL ORDER OF MOOSE, INC

Publications

Wikipedia References

Paul Fischer Photo 6

Paul Fischer (Luthier)

Us Patents

Ceria Based Slurry For Chemical-Mechanical Polishing

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US Patent:
6358853, Mar 19, 2002
Filed:
Sep 10, 1998
Appl. No.:
09/151370
Inventors:
Kenneth C. Cadien - Portland OR
Allen D. Feller - Portland OR
Mark Buehler - Portland OR
Paul Fischer - Hillsboro OR
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21302
US Classification:
438692, 252 791, 252 793, 252 794, 52308
Abstract:
A ceria based abrasive is used in a chemical mechanical polishing operation at low polish pressure, and a predetermined pH range, to achieve high polish rates and good uniformity when planarizing layers formed from low dielectric constant materials, including but not limited to polymers. The distribution of ceria particle sizes in an exemplary slurry is bimodal and controlled. In a particular embodiment a polishing abrasive containing a controlled distribution of ceria particle sizes is used in a CMP polisher apparatus with a polishing pressure of approximately 3 psi and a pH of approximately 10. 6 to planarize polymer films.

Polishing Pad Design

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US Patent:
6887131, May 3, 2005
Filed:
Aug 27, 2002
Appl. No.:
10/228094
Inventors:
Lei Jiang - Aloha OR, US
Sadasivan Shankar - Cupertino CA, US
Paul Fischer - Portland OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
B24B009/00
US Classification:
451 28, 451 54, 451 41
Abstract:
A method is provided for creating a polish pad. This may involve determining a design layout of a wafer. The design layout may include a distribution of metal line features on the wafer. A polish pad design may be created/determined based on the determined layer. The polish pad may have asperities having a width greater than a width of metal line features of the wafer.

Differential Planarization

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US Patent:
6914002, Jul 5, 2005
Filed:
Dec 28, 2002
Appl. No.:
10/334308
Inventors:
James A. Boardman - Hillsboro OR, US
Sarah E. Kim - Portland OR, US
Paul B. Fischer - Portland OR, US
Mauro J. Kobrinsky - Hillsboro OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L021/302
US Classification:
438693, 438691, 438692
Abstract:
Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.

Method To Fabricate Interconnect Structures

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US Patent:
7087517, Aug 8, 2006
Filed:
Dec 24, 2003
Appl. No.:
10/748106
Inventors:
Kenneth Cadien - Portland OR, US
Paul Fischer - Portland OR, US
Valery M. Dubin - Portland OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/4763
US Classification:
438627, 438643, 438644, 438645, 438628, 438631
Abstract:
A method includes forming a barrier layer on a substrate surface including at least one contact opening; forming an interconnect in the contact opening; and reducing the electrical conductivity of the barrier layer. A method including forming a barrier layer on a substrate surface including a dielectric layer and a contact opening, depositing a conductive material in the contact opening, removing the conductive material sufficient to expose the barrier layer on the substrate surface, and reducing the electrical conductivity of the barrier layer. An apparatus including a circuit substrate including at least one active layer including at least one contact point, a dielectric layer on the at least one active layer, a barrier layer on a surface of the dielectric layer, a portion of the barrier layer having been transformed from a first electrical conductivity to a second different and reduced electrical conductivity, and an interconnect coupled to the at least one contact point.

Differential Planarization

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US Patent:
7105925, Sep 12, 2006
Filed:
Feb 2, 2005
Appl. No.:
11/055453
Inventors:
James A. Boardman - Hillsboro OR, US
Sarah E. Kim - Portland OR, US
Paul B. Fischer - Portland OR, US
Mauro J. Kobrinsky - Hillsboro OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/48
H01L 23/52
H01L 29/49
US Classification:
257752, 257686, 257690, 257620, 257621, 257758, 257E21583, 257E2158
Abstract:
Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.

Method Of Bonding Semiconductor Devices

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US Patent:
7186637, Mar 6, 2007
Filed:
Jul 31, 2003
Appl. No.:
10/631508
Inventors:
Grant Kloster - Lake Oswego OR, US
Shriram Ramanathan - Hillsboro OR, US
Chin-Chang Chen - Portland OR, US
Paul Fischer - Portland OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H10L 21/44
H10L 23/52
H10L 23/48
H10L 23/40
H10L 23/485
US Classification:
438614, 438613, 438615, 257780, 257781, 257E23021
Abstract:
A method of bonding semiconductor devices is disclosed. The method comprises providing a first substrate having a first conductive interconnecting structure formed thereon and a second substrate having a second conductive interconnecting structure formed thereon. A first conductive passivation layer is selectively formed over exposed areas of the first conductive interconnecting structure. A second conductive passivation layer is selectively formed over exposed areas of the second conductive interconnecting structure. The first substrate and the second substrate are bonded together in such a way that the first conductive passivation layer bonds to the second conductive passivation layer to create a passivation-passivation interface.

Semiconductor Substrate Polishing Methods And Equipment

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US Patent:
7205236, Apr 17, 2007
Filed:
Sep 28, 2004
Appl. No.:
10/952655
Inventors:
Paul B. Fischer - Portland OR, US
Chris E. Barns - Portland OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/461
H01L 21/302
US Classification:
438690, 438691, 438692, 438693
Abstract:
According to one aspect of the present invention, a method of electrochemically polishing a semiconductor substrate may be provided. A semiconductor substrate processing fluid, having a plurality of abrasive particles therein, may be placed between the surface of the semiconductor substrate and the polish head. The polish head may be moved relative to the surface of the semiconductor substrate to cause the abrasive particles to polish the surface of the semiconductor substrate. According to a second aspect of the present invention, a method for electro-polishing a semiconductor substrate may be provided. A semiconductor substrate may be placed in an electrolytic solution. A surface of the semiconductor substrate may be contacted with at least one conductive member. A voltage may be applied across the electrolytic solution and the at least one conductive member. The at least one conductive member may be moved across the surface of the semiconductor substrate.

Low Stress Barrier Layer Removal

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US Patent:
7371685, May 13, 2008
Filed:
Mar 3, 2004
Appl. No.:
10/794738
Inventors:
Paul Fischer - Portland OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/302
US Classification:
438690, 257E21239
Abstract:
Apparatus and methods of fabricating an interconnect in a dielectric material, such as by a damascene or dual damascene processes. In specific, with the use of a barrier layer, such as to contain copper-containing materials used in the fabrication of the interconnect, a slurry jet is used to remove the barrier layer without significantly damaging underlying dielectric material. Such a process is particularly useful when low-k dielectrics are used as the dielectric material, as low-k dielectrics can be easily damaged by known barrier layer removal techniques.

Isbn (Books And Publications)

Fundamentals of Advanced Accounting

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Author

Paul M. Fischer

ISBN #

0324378904

Cost Accounting: Theory and Applications

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Author

Paul M. Fischer

ISBN #

0538017201

Advanced Accounting/Book and Companion Book

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Author

Paul M. Fischer

ISBN #

0538808721

Advanced Accounting/Update

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Author

Paul M. Fischer

ISBN #

0538871954

Financial Dimensions of Marketing Management

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Author

Paul M. Fischer

ISBN #

0471033766

The Office Laboratory

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Author

Paul M. Fischer

ISBN #

0838572448

Controversies of the Music Industry

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Author

Paul D. Fischer

ISBN #

0313310947

Configuring Cisco Routers for Isdn

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Author

Paul Fischer

ISBN #

0070220735

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Paul E Fischer from Otis, OR, age ~61 Get Report