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Parker Gould Phones & Addresses

  • Berkeley, CA
  • 20 Fairmont St, Cambridge, MA 02139
  • Oakland, CA
  • Lebanon, TN
  • Ponca City, OK
  • Houston, TX
  • Vestavia, AL
  • Madison, AL

Work

Company: Massachusetts institute of technology (mit) May 2019 Position: Research affiliate

Education

Degree: Doctorates, Doctor of Philosophy School / High School: Massachusetts Institute of Technology 2012 to 2017 Specialities: Electrical Engineering, Philosophy

Interests

Sailing • Golf • Ultimate Frisbee • Baseball

Industries

Research

Resumes

Resumes

Parker Gould Photo 1

Co-Founder And Chief Technology Officer

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Location:
San Francisco, CA
Industry:
Research
Work:
Massachusetts Institute of Technology (Mit)
Research Affiliate

Massachusetts Institute of Technology (Mit) Jan 2019 - May 2019
Postdoctoral Research Associate

Inchfab Jan 2019 - May 2019
Co-Founder and Chief Technology Officer

Activate Jan 2019 - May 2019
Entrepreneurial Research Fellow at Cyclotron Road

Massachusetts Institute of Technology (Mit) Aug 2012 - Sep 2018
Phd Candidate
Education:
Massachusetts Institute of Technology 2012 - 2017
Doctorates, Doctor of Philosophy, Electrical Engineering, Philosophy
University of Cambridge 2011 - 2012
Vanderbilt University 2007 - 2011
Bachelor of Engineering, Bachelors, Electrical Engineering, Management, Engineering, Political Science
Interests:
Sailing
Golf
Ultimate Frisbee
Baseball

Publications

Us Patents

Peristaltic Micropump And Related Systems And Methods

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US Patent:
20130287613, Oct 31, 2013
Filed:
Oct 7, 2011
Appl. No.:
13/877925
Inventors:
Parker A. Gould - Cambridge MA, US
Loi T. Hoang - Antioch TN, US
Joseph R. Scherrer - Nashville TN, US
William J. Matloff - Paradise Valley AZ, US
Kevin T. Seale - Nashville TN, US
Erica L. Curtis - Atlanta GA, US
David K. Schaffer - Nashville TN, US
Douglas J. Hall - Chesterfield MO, US
Ronald S. Reiserer - Nashville TN, US
Hunter Tidwell - Nashville TN, US
Assignee:
VANDERBILT UNIVERSITY - Nashville TN
International Classification:
F04B 43/12
US Classification:
417476
Abstract:
A peristaltic micropump comprising one or more conduits configured to transfer one or more pumped fluids, wherein each conduit comprises: an inlet (), an outlet (), a central portion () between the inlet and the outlet, and an actuator () configured to engage the central portions of the one or more conduits.

Processing System For Small Substrates

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US Patent:
20210087671, Mar 25, 2021
Filed:
Dec 2, 2020
Appl. No.:
17/109596
Inventors:
- Cambridge MA, US
Parker Andrew Gould - Cambridge MA, US
Martin Arnold Schmidt - Reading MA, US
International Classification:
C23C 14/34
C23C 14/50
H01J 37/32
H01L 21/67
C23C 14/54
H01J 37/34
C23C 14/48
Abstract:
A substrate processing system that is optimized for the production of smaller volumes of semiconductor components is disclosed. To minimize cost, the substrate processing system is designed to accommodate smaller substrates, such as substrates having a diameter of roughly one inch. Additionally, the components of the substrate processing system are designed to be interchangeable, thereby further reducing cost and complexity. In certain embodiments, the substrate processing system comprises a lower assembly, which may be used with one or more upper assemblies. The lower assembly is used to support the substrate and provide many of the fluid, electrical, and sensor connections, while the upper assemblies include the apparatus required to perform a certain fabrication function. For example, different upper assemblies may exist for deposition, etching, sputtering and ion implantation.

Processing System For Small Substrates

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US Patent:
20170194129, Jul 6, 2017
Filed:
Sep 10, 2015
Appl. No.:
15/325224
Inventors:
- Cambridge MA, US
Parker Andrew Gould - Cambridge MA, US
Martin Arnold Schmidt - Reading MA, US
International Classification:
H01J 37/32
C23C 14/50
C23C 14/34
C23C 14/48
Abstract:
A substrate processing system that is optimized for the production of smaller volumes of semiconductor components is disclosed. To minimize cost, the substrate processing system is designed to accommodate smaller substrates, such as substrates having a diameter of roughly one inch. Additionally, the components of the substrate processing system are designed to be interchangeable, thereby further reducing cost and complexity. In certain embodiments, the substrate processing system comprises a lower assembly, which may be used with one or more upper assemblies. The lower assembly is used to support the substrate and provide many of the fluid, electrical, and sensor connections, while the upper assemblies include the apparatus required to perform a certain fabrication function. For example, different upper assemblies may exist for deposition, etching, sputtering and ion implantation.
Parker A Gould from Berkeley, CA, age ~35 Get Report