Olin B Cecil

43903924, Jun 28, 1983

Sep 16, 1980

6/187662

John T. Robinson - Sherman TX
Olin B. Cecil - Dallas TX
Rajiv R. Shah - Dallas TX

Texas Instruments Incorporated - Dallas TX

H01L 21306
B44C 122
C03C 1500
C03C 2506

156643

In order to produce wafers suitable for fabrication of integrated circuits, an ingot of raw silicon must undergo a process which includes several steps. The ingot must be sawed into slices, the slices edge ground to remove roughness of the edges, lapped to remove as much saw damage as possible, stress relief etched to remove as small a damaged area as possible, then polished. Each of these steps requires removal of some of the material of the slice. The use of laser annealing reduces the amount of surface removed, as it repairs some surface damage, smoothes the surface, and when accomplished in a partial vacuum, improves the chemical composition of the material as related to electrical activity.

39545512, May 4, 1976

Jul 17, 1974

5/489303

Olin B. Cecil - Dallas TX
Paul D. Maycock - Richardson TX

Texas Instruments Incorporated - Dallas TX

B01J 1724
C01B 3302

156608

A ribbon of semiconductor material is formed by supplying powdered semiconductor material at the bottom of a rectangular tube shaping guide while heating the semiconductor material in the region of the guide to produce a molten body of semiconductor material within the guide. The upper surface of the melt is contacted with a seed ribbon which is drawn upward while maintaining the supply of semiconductor material adjacent to the bottom of the guide.