Kabseog Kim

20030062652, Apr 3, 2003

Oct 3, 2001

09/970246

Harish Manohara - Pasadena CA, US
Kabseog Kim - Richardson TX, US
Sang-Won Park - Dallas TX, US

B29C033/40

264/227000

Methods of rapidly prototyping microstructures such as HARMs are disclosed. A high precision process uses polymeric microstructure replication techniques and sacrificial layer etching techniques to mass produce high aspect ratio metallic and polymer micromold inserts. In one embodiment, after fabrication of an initial micromold insert, high aspect ratio replications are created by casting replication material, such as PDMS, directly onto the initial micromold insert. The replicated HARM is coated with a sacrificial layer and then electroplated to replicate another set of micromold inserts. After the electroplating process is completed, the sacrificial layer is etched away to release the replicated micromold inserts.

7096568, Aug 29, 2006

Jul 10, 2003

10/616735

Erik Nilsen - McKinney TX, US
Matthew D. Ellis - Allen TX, US
Charles L. Goldsmith - Plano TX, US
Jeong Bong Lee - Plano TX, US
Xiaojun Huang - Goleta CA, US
Arun Kumar Nallani - Richardson TX, US
Kabseog Kim - Dallas TX, US
George D. Skidmore - Richardson TX, US

Zyvex Corporation - Richardson TX

H05B 3/00

29611, 29840, 29846, 257678, 361803, 439 65, 439329, 977724

A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.