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Noureddine E Hawat

from Andover, MA
Age ~59
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Also known as:
Nour Eddin Hawat, Nour-Eddin Hawat, Noareddine Hawat, Noureddine Hawad, Hawat Noureddine, Hawat Nour-Eddin, Nourredine Hamat
Phone and address:
36 Oriole Dr, Andover, MA 01810
Related to:
Devon Cantor, 24John StainoThomas Galligan, 75William Galligan, 73
Connected to:
Gaby N Hawat, 59Nicole A Hawat, 40Raed N Hawat, 55Amer E Hawatmeh, 61Elias S Hawatmeh, 70Jamileh B Hawatmeh, 34Ola I Hawatmeh, 59Dereje J Hawaz, 56Carl A Hawbaker, 76Cheri L Hawbaker, 54

Noureddine Hawat Phones & Addresses

  • 36 Oriole Dr, Andover, MA 01810
  • Sewickley, PA
  • 365 Upham St, Melrose, MA 02176
  • 4 Kimball Rd, Woburn, MA 01801
  • 8 Sharon St, Wilmington, MA 01887 (978) 658-3977
  • Lowell, MA
  • San Jose, CA
  • 8 Sharon St, Wilmington, MA 01887

Publications

Us Patents

Methods And Apparatus For Multichip Module Packaging

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US Patent:
20080157295, Jul 3, 2008
Filed:
Dec 20, 2007
Appl. No.:
11/961984
Inventors:
Peter R. Nuytkens - Melrose MA, US
Noureddine Hawat - Woburn MA, US
Joseph M. Kulinets - North Andover MA, US
Assignee:
Custom One Design, Inc. - Melrose MA
International Classification:
H01L 23/498
H01L 21/98
US Classification:
257659, 257686, 438109, 257E23063, 257E21705
Abstract:
Methods and apparatus for multichip modules having improved shielding and isolation properties.

Device Cavity Organic Package Structures And Methods Of Manufacturing Same

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US Patent:
20100087024, Apr 8, 2010
Filed:
Jun 19, 2009
Appl. No.:
12/488137
Inventors:
Noureddine Hawat - Woburn MA, US
Peter R. Nuytkens - Melrose MA, US
International Classification:
H01L 21/98
US Classification:
438 51, 257E21705
Abstract:
Structured and Methods for integrating MEMS devices into low-cost organic chip-scale packages, using sealed cavities, are provided.

Precision Micro-Electromechanical Sensor (Mems) Mounting In Organic Packaging

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US Patent:
20100221860, Sep 2, 2010
Filed:
Jun 19, 2009
Appl. No.:
12/488257
Inventors:
Noureddine Hawat - Woburn MA, US
Peter R. Nuytkens - Melrose MA, US
International Classification:
H01L 21/56
US Classification:
438 51, 257E21502
Abstract:
Apparatus and methods for mounting micro-electromechanical (MEMS) sensors in three dimensions, using horizontal and vertical substrates.

Method For Mounting A Three-Axis Mems Device With Precise Orientation

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US Patent:
20120217286, Aug 30, 2012
Filed:
Feb 22, 2012
Appl. No.:
13/402210
Inventors:
Noureddine Hawat - Wilmington MA, US
International Classification:
B23K 31/02
B23K 1/20
US Classification:
228170, 228203
Abstract:
This invention uses surface tension to align a z-axis MEMS sensing device that is mounted onto a substrate or lead frame oriented in an xy-plane. According to the teachings of the present invention, the height of the z-axis sensing device is less than or substantially equal to its width (y-dimension) while the length of the device in the longitudinal direction (x-dimension) is greater than either of the y- or z-dimensions. As a result, instead of being thin and tall like a wall, which configuration is extremely difficult to align vertically, the elongate z-axis sensing device is mounted on a short z-axis, making it easier to align vertically.

Foldable Substrate

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US Patent:
20130249542, Sep 26, 2013
Filed:
Mar 21, 2012
Appl. No.:
13/426341
Inventors:
Yang Zhao - Andover MA, US
Haidong Liu - Wuxi, CN
Yongyao Cai - Acton MA, US
Zongya Li - Wuxi, CN
Noureddine Hawat - Wilmington MA, US
Jun Ma - Suzhou, CN
Feng Zhang - Wuxi, CN
Zhiwei Duan - Wuxi, CN
Leyue Jiang - Wuxi, CN
International Classification:
G01R 33/02
H05K 1/18
B23P 17/04
B32B 3/16
B32B 7/04
US Classification:
324244, 428 77, 29416, 174254
Abstract:
A foldable substrate is provided that includes a first substrate portion with a first upper surface and a second substrate portion with a second upper surface. A foldable bridge portion couples the first substrate portion to the second substrate portion. The foldable bridge portion includes a coupling strip that extends from the first substrate portion to the second substrate portion with a gap corresponding to a portion of the coupling strip where the gap is defined between the first and second substrate portions by removing portions of a starting wafer substrate. The first and second portions, in one embodiment, include magnetic field sensors and the foldable bridge portion can be bent to arrange the two portions at a predetermined angle to one another. Once bent, the sensor package can be incorporated into a magnetic field sensor assembly to be integrated with other control circuitry.
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Noureddine E Hawat from Andover, MA, age ~59 Get Report