Noah Austin Spivak - Oak Hill VA, US Emilie G. Casey - Montgomery Village MD, US
International Classification:
H01C 17/02
US Classification:
29613
Abstract:
A method for building resistive elements into any printed circuit board. Holes are created on said board and filled with resistive material. The top and bottom of the etched pads that contain the resistive material are over plated with an electrically conductive material. This structure now forms a vertical resistive via and substantially reduces the overall area need for resistors.