Nigel F Clay

20030189086, Oct 9, 2003

Apr 9, 2002

10/063300

Nigel Clay - Ann Arbor MI, US
Tsung-Yu Pan - Ypsilanti MI, US
Alan Gickler - Clinton IA, US
Frederic LePrevost - Clinton IA, US

Ford Motor Company - Dearborn MI

B32B003/26
B23K001/20
B23K035/36

228/223000, 228/224000, 228/248100, 420/560000

One method of the present invention includes applying a paste-like fluxing agent to an aluminum body part; heating the fluxing agent to deoxidize the surface of the aluminum body part; applying a solder filler to the aluminum body part; and heating the solder filler to bond the solder filler to the aluminum body part. The melting point of the solder filler is at least 100 E C lower than the melting point of the aluminum body part. Another method includes forming a filler/flux mixture; applying the filler/flux mixture; and heating the filler/flux mixture to bond the solder filler to the aluminum body part. The disclosed solder fillers include tin-based alloys as follows: (1) 12-22% copper, 3-5% zinc and 75-85% tin; and (2) 3-5% copper, iron, cobalt, or nickel, 12-40% zinc and 55-85% tin and zinc-based solder filler alloys composed of 78-98% zinc and 2-22% aluminum.

20050109822, May 26, 2005

Dec 20, 2004

10/905170

Tsung-Yu Pan - Ypsilanti MI, US
Nigel Clay - Ann Arbor MI, US
Frederic LePrevost - Clinton IA, US
Alan Gickler - Clinton IA, US
Matthew Zaluzec - Canton MI, US
Armando Joaquin - Rochester Hills MI, US
David Brown - Bettendorf IA, US

FORD MOTOR COMPANY - Dearborn MI
JOHNSON MANUFACTURING COMPANY - Princeton IA

B23K031/02

228226000

One aspect of the present invention is a method of applying a solder filler to an aluminum body part. The method includes abrading the surface of an aluminum body part at a temperature of at least about 300 degrees Celsius with a solder filler at a temperature of at least about 300 degrees Celsius.