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Nick E Shephard

from Midland, MI
Age ~59
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Also known as:
Nick Dr Shephard, Nick Evan Shephard, Nick T Shephard, Nick E Shepard
Phone and address:
2333 Perrine Rd, Midland, MI 48642
(989) 631-9657
Related to:
Vicki Anuszkiewicz, 57Linda L Profozich, 59Anne R UrbanKiersten L Urban, 50Gail M Urban, 84A Marie, 85John M Urban, 85Lori Ann Anuszkiewicz, 57
Connected to:
Alexis Shephard, 27Arlander N Shephard, 70Barry T Shephard, 67Blake R Shephard, 34Brad Shephard, 45Carrie Shephard, 53Desiree C Shephard, 39Ethan A Shephard, 31Gerry E Shephard, 78Jeffrey J Shephard, 70

Nick Shephard Phones & Addresses

  • 2333 Perrine Rd, Midland, MI 48642 (989) 631-9657
  • 1275 Mckimmy Dr, Beaverton, MI 48612
  • Blacksburg, VA
  • Rhodes, MI
  • Bay City, MI
  • 2333 N Perrine Rd, Midland, MI 48642

Resumes

Resumes

Nick Shephard Photo 1

Fellow

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Location:
Akron, MI
Industry:
Chemicals
Work:
Dow Performance Silicones
Fellow
Education:
Virginia Tech 1958 - 1995
Doctorates, Doctor of Philosophy, Materials Science, Engineering, Philosophy Saginaw Valley State University 1983 - 1987
Bachelors, Chemistry Akron - Fairgrove Jr/Sr High School
Skills:
Materials Science
Polymer Science
Polymers
Polymer Chemistry
Adhesives
Coatings
Chemistry
Polymer Characterization
Design of Experiments
Rheology
Characterization
Materials
Catalysis
Elastomers
Surface Chemistry
Tga
R&D
Ftir
Research and Development
Nick Shephard Photo 2

Nick Shephard

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Nick Shephard Photo 3

Nick Shephard

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Location:
United States

Business Records

Name / Title
Company / Classification
Phones & Addresses
Nick Shephard
President, Principal
ADHESION DURABILITY INSTRUMENTS, INC
Business Services at Non-Commercial Site
2333 Perrine Rd, Midland, MI 48642
Michigan

Publications

Us Patents

Silicones Having Improved Chemical Resistance And Curable Silicone Compositions Having Improved Migration Resistance

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US Patent:
7521124, Apr 21, 2009
Filed:
Jul 13, 2005
Appl. No.:
11/180456
Inventors:
Dongchan Ahn - Midland MI, US
Pamela Jean Huey - Midland MI, US
Nick Evan Shephard - Midland MI, US
Michael John Watson - Midland MI, US
Assignee:
Dow Corning Corporation - Midland MI
International Classification:
C08G 77/24
US Classification:
428447, 528 15, 528 31, 528 32, 528 42, 427387, 156329
Abstract:
A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

Siloxanes And Silanes Cured By Organoborane Amine Complexes

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US Patent:
7732543, Jun 8, 2010
Filed:
Dec 13, 2005
Appl. No.:
11/792063
Inventors:
Cheryl Lynn Loch - Ypsilanti MI, US
Dongchan Ahn - Midland MI, US
Nick Evan Shephard - Midland MI, US
James Steven Tonge - Sanford MI, US
Patricia Ann Olney - Midland MI, US
Assignee:
Dow Corning Corporation - Midland MI
International Classification:
C08F 4/52
US Classification:
526196, 526134, 526141, 526328, 526178, 502162, 502200, 502202, 564 8, 564 9
Abstract:
Curable compositions contain (i) a free radical polymerizable organosilicon monomer, oligomer or polymer; (ii) an organoborane amine complex; optionally (iii) an amine reactive compound having amine reactive groups; and optionally (iv) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The curable compositions can be used as a rubber, tape, adhesive, foam, pressure sensitive adhesive, protective coating, thin film, thermoplastic monolithic molded part, thermosetting monolithic molded part, sealant, gasket, seal, or o-ring, die attachment adhesive, lid sealant, encapsulant, potting compound, or conformal coating. The compositions can also be used in composite articles of manufacture such as integrally bonded device including electrical and electronic connectors and scuba diving masks, in which substrates are coated or bonded together with the composition and cured.

Dual Curing Polymers And Methods For Their Preparation And Use

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US Patent:
8168737, May 1, 2012
Filed:
Dec 10, 2007
Appl. No.:
12/517220
Inventors:
Khristopher Edward Alvarez - Midland MI, US
Nick Evan Shephard - Midland MI, US
James Tonge - Midland MI, US
Assignee:
Dow Corning Corporation - Midland MI
International Classification:
C08G 77/08
US Classification:
528 15, 528 31, 525476
Abstract:
A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R2Si0)b, (RSi0)c, (Si0)d, (R)f, and (R3SiO)g, where each Ris independently an oxygen atom or a divalent hydrocarbon group; each Ris independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

Thermal Interface Material, Electronic Device Containing The Thermal Interface Material, And Methods For Their Preparation And Use

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US Patent:
8334592, Dec 18, 2012
Filed:
Sep 5, 2008
Appl. No.:
12/668495
Inventors:
Dorab Bhagwagar - Saginaw MI, US
Donald Liles - Midland MI, US
Nick Shephard - Midland MI, US
Shengqing Xu - Midland MI, US
Zuchen Lin - Midland MI, US
G. M. Fazley Elahee - Midland MI, US
Assignee:
Dow Corning Corporation - Midland MI
International Classification:
H01L 23/06
US Classification:
257729, 257E2308, 427123, 427401, 427201, 427404, 428457, 428327, 428626, 361717, 252 74, 165185
Abstract:
A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM and TIM applications in electronic devices.

Process For Minimizing Electromigration In An Electronic Device

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US Patent:
8450931, May 28, 2013
Filed:
May 9, 2006
Appl. No.:
11/883992
Inventors:
Khristopher Edward Alvarez - Midland MI, US
Nick Evan Shephard - Midland MI, US
James Steven Tonge - Sanford MI, US
Assignee:
Dow Corning Corporation - Midland MI
International Classification:
H01J 17/49
US Classification:
313586, 445 23
Abstract:
A process for reducing Ag electromigration in electronic circuitry includes the step of treating the electronic circuitry with an electromigration resistant composition. This process is useful in fabricating electronic devices having electronic circuitry that is close together, such as resistors, capacitors, and displays, e. g. , a plasma display panel (PDP) or a liquid crystal display (LCD).

Dual Curing Polymers And Methods For Their Preparation And Use

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US Patent:
8618233, Dec 31, 2013
Filed:
Nov 7, 2007
Appl. No.:
12/517211
Inventors:
Khristopher Alvarez - Midland MI, US
Nick Shephard - Midland MI, US
James Tonge - Sanford MI, US
Assignee:
Dow Corning Corporation - Midland MI
International Classification:
C08G 77/08
US Classification:
528 15, 528 31, 528 35, 428447, 427387, 522148
Abstract:
A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (RSi0), (RSi0), (SiO), (R′), and (RSi0), where each Ris independently an oxygen atom or a divalent hydrocarbon group; each R is independently divalent hydrocarbon group; each Ris independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

Silicones Having Improved Chemical Resistance And Curable Silicone Compositions Having Improved Migration Resistance

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US Patent:
20050038188, Feb 17, 2005
Filed:
Aug 14, 2003
Appl. No.:
10/641810
Inventors:
Dongchan Ahn - Midland MI, US
Pamela Huey - Midland MI, US
Nick Shephard - Midland MI, US
Michael Watson - Midland MI, US
International Classification:
B29C039/10
B29C070/70
B29C070/88
US Classification:
525102000, 264236000, 264259000, 264255000, 264272170, 264279000, 264279100
Abstract:
A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

Encapsulation Of Photovoltaic Cells

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US Patent:
20080276983, Nov 13, 2008
Filed:
Nov 3, 2006
Appl. No.:
12/092150
Inventors:
Robert Andrew Drake - Penarth, GB
Jean da la Croix Habimana - Morlanwelz, BE
Nick Evan Shephard - Midland MI, US
Mustafa Mohamed - Midland MI, US
Barry Mark Ketola - Freeland MI, US
James Steven Tonge - Sanford MI, US
Stephen Jenkins - Bay City MI, US
Stephen Altum - Midland MI, US
International Classification:
H01L 31/042
US Classification:
136251
Abstract:
This invention relates to a photovoltaic cell module and a process of applying a silicone based hot melt encapsulant material () onto photovoltaic cells () to form a photovoltaic cell module. There is provided a photovoltaic array with more efficient manufacturing and better utilization of the solar spectrum by using silicone hot melt sheets () to give a silicone encapsulant photovoltaic device with the process ease of an organic encapsulant but the optical and chemical advantages of a silicone encapsulant. There is further provided a method for fabricating photovoltaic cells with increased throughput and optical efficiency when compared to prior art encapsulation methods. The preferred silicone material is provided in flexible sheet with hot melt properties and low surface tack.
Control profile
Nick E Shephard from Midland, MI, age ~59 Get Report