Myung Seop Lee

7751332, Jul 6, 2010

Oct 25, 2007

11/923777

Yong Liu - San Jose CA, US
Eun Il Seo - Hwaseong-si, KR
Jin Young Yang - Seoul, KR
Myung Jong Lee - New York NY, US
Xuhui Hu - New York NY, US

Samsung Electronics Co., Ltd. - Suwon-si
The Research Foundation of the City University of New York - New York NY

H04L 12/28

370238, 370251, 370254, 709241

A data routing method and system, the data routing method including: locating a destination node using a destination locating packet; establishing a preliminary route including anchor nodes based on a route where the destination locating packet is transmitted to the destination node; determining a link cost between neighbor nodes of each of the anchor nodes, and also between the anchor nodes and the neighbor nodes of each of the anchor nodes; generating minimum cost information with respect to a route consuming a minimum cost from the destination node to a source node using the link cost; and forming a data route from the destination node to the source node using the minimum cost information.

8081583, Dec 20, 2011

Jul 11, 2008

12/171913

Jae Hong Ruy - Daejeon, KR
Jong Suk Chae - Daejeon, KR
Cheol Sig Pyo - Daejeon, KR
Bong Soo Kim - Daejeon, KR
Eun Ju Lee - Daejeon, KR
Myung Jong Lee - Paramus NJ, US
Tae Rim Park - New York NY, US
Rui Zhang - New York NY, US

Electronics & Telecommunications Research Institute - Daejeon
Research Foundation of the City University of New York - New York NY

H04L 12/26

370256

Provided is a method of supporting node portability in a sensor network, wherein data transmission to a portable node can be guaranteed since even when the portable node is assigned with a different address by being associated with another network, the newly assigned address is transmitted to a parent node or a sink node that was previously associated with the portable node.

7995508, Aug 9, 2011

Jul 11, 2008

12/171657

Jae Hong Ruy - Daejeon, KR
Jong Suk Chae - Daejeon, KR
Cheol Sig Pyo - Daejeon, KR
Bong Soo Kim - Daejeon, KR
Myung Jong Lee - Paramus NJ, US
Tae Rim Park - New York NY, US

Electronics & Telecommunications Research Institute - Daejeon
Research Foundation of the City University of New York - New York NY

H04W 52/02

370311, 455574, 4553432

Provided is a method of minimizing power consumed by each node in a wireless network when communicating with neighboring nodes. Unlike a conventional synchronous media access control (MAC), the present invention suggests an asynchronous MAC. Thus, the active duration of a node extends only when transmitting a large quantity of data and the extended active duration returns to the minimum active duration again after completing the data transmission.

20130290955, Oct 31, 2013

Apr 30, 2012

13/460836

Yoshio Turner - San Francisco CA, US
Jeongkeun Lee - Mountain View CA, US
Myung Jin Lee - Palo Alto CA, US

G06F 9/455

718 1

Topology input is used to identify a set of data flows as between a set of virtual machines (VMs), as well as one or more network services for one or more of the data flows. A determination is made as to a minimal number of network service virtual machines (NSVMs) for use in providing the one or more network services. An arrangement is determined for server resources and network resources of the data center network on which a virtual network topology is provided for the tenant, including the set of VMs and the number of NSVMs.

57857563, Jul 28, 1998

Mar 6, 1997

8/811755

Myung B. Lee - West Orange NJ

Northrop Grumman Corporation - Los Angeles CA

C30B 2304

117105

A novel molecular beam epitaxy deposition process for precisely growing structurally robust films and coatings containing germanium and various fluoride compounds for use as an optical filter. The process comprises depositing two (2) materials having different indices of refraction via molecular beam epitaxy at a temperature significantly lower than the optimal growth temperature. At such lower temperature, layers of the respective compounds are grown, via molecular beam epitaxy, such that the layers contain large concentrations of dislocations. Once the film or coating has been grown to the desired thickness, the material deposited is allowed to cool to room temperature and may then be used in a wide range of applications.

20160240457, Aug 18, 2016

Feb 18, 2015

14/625020

- San Jose CA, US
Myung June Lee - Cupertino CA, US

H01L 23/48
H01L 21/768
H01L 21/56

An integrated circuit package may include a first integrated circuit die attached to a front surface of a second integrated circuit die. An intermediate layer made of a molding compound is formed to surround the second integrated circuit die in a “fan-out” arrangement while leaving a surface of the second integrated circuit die exposed. Accordingly, a group of via holes is then formed in the intermediate layer and filled with a conductive material. Such a configuration forms a dual-sided stacking structure. The stacking structure may also be applicable for package-on-package packages and fan-out wafer-level chip scale packages, in which the stacking structure is formed between two heterogeneous or homogeneous integrated circuit packages.