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Mukul R Khosla

from San Jose, CA
Age ~59
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Also known as:
Michael Khosla, Mike Khosla, Mukul Kholsa
Phone and address:
1138 Olive Branch Ln, San Jose, CA 95120
(408) 268-5929
Related to:
Neil M Khosla, 31Sarah Khosla, 28Rita Khosla, 59
Connected to:
Akhil Khosla, 36Anuj Khosla, 34Chanchal K Khosla, 73Chander M Khosla, 74Gautam J Khosla, 45Inder S Khosla, 62Manju Khosla, 53Manu Khosla, 43Munish Khosla, 53Niti G Khosla, 46

Mukul Khosla Phones & Addresses

  • 1138 Olive Branch Ln, San Jose, CA 95120 (408) 268-5929 (408) 729-4443

Publications

Us Patents

Linear Multipole Rod Assembly For Mass Spectrometers

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US Patent:
6441370, Aug 27, 2002
Filed:
Apr 11, 2000
Appl. No.:
09/546748
Inventors:
Mukul Khosla - San Jose CA
Berg Tehlirian - Daly City CA
Assignee:
Thermo Finnigan LLC - San Jose CA
International Classification:
H01J 4942
US Classification:
250292, 250293, 250290
Abstract:
A multiple-pole electrode assembly is disclosed for use in mass spectrometers or other applications such as ion traps or ion guides. The disclosed apparatus provides a rod mounting and connection assembly in which equally spaced rectangular rods are embedded in spaced, dimensionally stable insulating materials. This structure is more conveniently and inexpensively manufactured than previously available multiple pole electrode assemblies.

Apparatus And Method For Enhanced Degassing Of Semiconductor Wafers For Increased Throughput

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US Patent:
6497734, Dec 24, 2002
Filed:
Jan 2, 2002
Appl. No.:
10/037026
Inventors:
Kenneth K. Barber - San Jose CA
Mark Fissel - Danville CA
Soo Yun Joh - Livermore CA
Mukul Khosla - San Jose CA
Karl B. Levy - Los Altos CA
Robert Martinson - San Mateo CA
Michael Meyers - Freemont CA
Dhairya Shrivastava - Los Altos CA
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
H01L 21324
US Classification:
29 2501, 438795, 438908, 438909
Abstract:
A multi-level shelf degas station relying on at least two heaters integrated within wafer holding shelves or slots, where the semiconductor wafers do not have direct contact with the heater shelves. The heaters provide conduction heating. In order to degas a wafer, the heater and wafer holder assembly is positioned in a sequential manner through each wafer slot to the next available slot. If a degassed wafer exists in the slot, a transfer chamber arm removes it. A loader arm then places a wafer in the available, empty slot and the stage is moved upwards to receive the wafer from the loader arm. The transfer chamber arm removes an individual wafer from the heater and wafer holder assembly allowing the removed wafer to be individually processed while the other wafers remain in the heater and wafer holder assembly. In some instances, a loader arm may also remove wafers. The remaining wafers in the heater and wafer holder assembly are subjected to further degas treatment while the wafer(s) removed by the transfer chamber arm are exposed to other process steps.

Passivation Of Copper In Dual Damascene Metalization

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US Patent:
6554914, Apr 29, 2003
Filed:
Feb 2, 2001
Appl. No.:
09/776704
Inventors:
Robert T. Rozbicki - San Jose CA
Ronald Allan Powell - San Carlos CA
Erich Klawuhn - San Jose CA
Michal Danek - Sunnyvale CA
Karl B. Levy - Los Altos CA
Jonathan David Reid - Sherwood OR
Mukul Khosla - San Jose CA
Eliot K. Broadbent - Beaverton OR
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
C23C 824
US Classification:
148238, 148282
Abstract:
The present invention pertains to systems and methods for passivating the copper seed layer deposited in Damascene integrated circuit manufacturing. More specifically, the invention pertains to systems and methods for depositing the copper seed layer by physical vapor deposition, while passivating the copper during or immediately after the deposition in order to prevent excessive oxidation of the copper. The invention is applicable to dual Damascene processing.

Capillary Tube Assembly With Replaceable Capillary Tube

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US Patent:
6667474, Dec 23, 2003
Filed:
Oct 27, 2000
Appl. No.:
09/699141
Inventors:
Jeffrey B. Abramson - Scotts Valley CA
Nigel P. Gore - San Jose CA
Mukul Khosla - San Jose CA
Iain C. Mylchreest - Gilroy CA
Keqi Tang - Richland WA
Eric B. Johnson - San Rafael CA
Assignee:
Thermo Finnigan LLC - San Jose CA
International Classification:
B01D 5944
US Classification:
250288, 210634
Abstract:
The present invention relates to a heated capillary assembly which connects an atmospheric pressure ionization source to a lower pressure mass analyzing system which comprises a capillary tube removably secured to, and extending through the bore of a capillary support assembly.

Closed Loop Monitoring Of Electroplating Bath Constituents Using Mass Spectrometry

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US Patent:
6726824, Apr 27, 2004
Filed:
Apr 11, 2001
Appl. No.:
09/833385
Inventors:
Mukul Khosla - San Jose CA
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
C25D 2112
US Classification:
205 82, 205 81, 205 84
Abstract:
The present invention provides methods and apparatus for analysis and monitoring of electrolyte bath composition. Based on the results of the analysis, the invention controls electrolyte bath composition and plating hardware. Thus, the invention provides control of electroplating processes based on plating bath composition data. The invention accomplishes this by incorporating mass spectral analysis into a feedback control mechanism for electroplating. Mass spectrometry is used to identify plating bath conditions and based on the results, the plating bath formulation and plating process are controlled.

Systems And Methods For Inhibiting Oxide Growth In Substrate Handler Vacuum Chambers

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US Patent:
20120251271, Oct 4, 2012
Filed:
Mar 14, 2012
Appl. No.:
13/419625
Inventors:
Mukul Khosla - San Jose CA, US
Ronald Powell - Portola Valley CA, US
Arun Keshavamurthy - Bangalore, IN
Richard Blank - San Jose CA, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
B65G 47/90
US Classification:
414217, 4147491, 414800, 901 30
Abstract:
A substrate handling robot includes an arm section and a wrist portion connected to the arm section. An end effector is connected to the wrist portion and is configured to support a substrate. A housing is arranged adjacent to the end effector and includes a gas outlet that directs gas onto an exposed surface of the substrate during transport.

Vapor Delivery Apparatus

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US Patent:
20130312663, Nov 28, 2013
Filed:
May 22, 2012
Appl. No.:
13/477928
Inventors:
Mukul Khosla - San Jose CA, US
Mike Grimes - San Jose CA, US
Peter Krotov - San Jose CA, US
Genny Epshteyn - San Jose CA, US
Assignee:
Applied Microstructures, Inc. - San Jose CA
International Classification:
F17D 3/00
C23C 16/52
US Classification:
118710, 137334, 137 12
Abstract:
A vapor delivery apparatus for providing a precursor vapor for a vapor deposition process includes a precursor container for holding a liquid or solid precursor. A first temperature control assembly maintains the precursor container at a first temperature to generate a vapor precursor from the liquid or solid precursor. An isolation valve is coupled to the precursor container, and a specific quantity of the vapor precursor is accumulated in an expansion volume. A fill valve, which is coupled to each of the isolation valve and the expansion volume, controls the flow of the vapor precursor from the precursor container into the expansion volume. A second temperature control assembly maintains the isolation valve at a second temperature greater than the first temperature.

Method And Apparatus For Rapid Pump-Down Of A High-Vacuum Loadlock

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US Patent:
20130312835, Nov 28, 2013
Filed:
May 23, 2013
Appl. No.:
13/901000
Inventors:
Victor F. Morris - San Jose CA CA, US
Ram Charan - Bangalore, IN
Ronald A. Powell - Portola Valley CA, US
Mukul Khosla - San Jose CA, US
International Classification:
H01L 21/67
US Classification:
137 12, 137494
Abstract:
A gas expansion module for use with semiconductor wafer loadlocks and other regulated-pressure components of semiconductor processing tools is provided. The gas expansion module may be barometrically isolated from the loadlock or other component and pumped down to a vacuum condition while the loadlock is performing operations at a higher pressure, such as ambient atmospheric conditions. After an initial pump-down of the loadlock is performed, the gas expansion module may be fluidly joined to the loadlock volume and the gases within each allowed to reach equilibrium. A further pump-down of the combined volume may be used to bring the loadlock pressure to a desired vacuum condition.
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Mukul R Khosla from San Jose, CA, age ~59 Get Report