Mohit Gupta

20180342463, Nov 29, 2018

Jul 13, 2018

16/035048

- Santa Clara CA, US
Anna M. PRAKASH - Chandler AZ, US
Suriyakala RAMALINGAM - Chandler AZ, US
Boxi LIU - Chandler AZ, US
Mohit GUPTA - Chandler AZ, US
Ziv BELMAN - Yokneam Ilit, IL
Baruch SCHIFFMANN - Shoham, IL
Arnon HIRSHBERG - D.N misgav, IL
Vladimir MALAMUD - Hedera, IL
Ron WITTENBERG - Haifa, IL

H01L 23/552
H01L 23/00
H01L 25/16
H01L 25/00
H01L 23/31
H01L 31/107
H01S 5/022

In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

20180190593, Jul 5, 2018

Dec 30, 2016

15/396415

- Santa Clara CA, US
Anna M. PRAKASH - Chandler AZ, US
Suriyakala RAMALINGAM - Chandler AZ, US
Boxi LIU - Chandler AZ, US
Mohit GUPTA - Chandler AZ, US
Ziv BELMAN - Yokneam Ilit, IL
Baruch SCHIFFMANN - Shoham, IL
Arnon HIRSHBERG - Haifa, IL
Vladimir MALAMUD - Hadera, IL
Ron WITTENBERG - Haifa, IL

H01L 23/552
H01L 25/00
H01L 25/16
H01L 23/31
H01L 23/00

In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

20140120293, May 1, 2014

Dec 22, 2011

13/993336

Mohit Gupta - Chandler AZ, US
Haiwei Lu - Chandler AZ, US
Dingying D. Xu - Maricopa AZ, US
Ninad Patel - Chandler AZ, US
Kowtilya Bijjula - Chandler AZ, US
P. Erasenthiran Poonjolai - Chandler AZ, US

H01L 21/683

428 417, 428354

The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be diced into individual microelectronic dice using an adhesive tape which reduces the potential of electrostatic discharge damage by the incorporation or anti-static, and may be compatible with a laser scribing process by the incorporation of ultraviolet light absorbing agents into an adhesive layer of the adhesive tape.