Mohi M Sobhani

6663395, Dec 16, 2003

Feb 28, 2002

10/090599

Mohi Sobhani - Encino CA

Raytheon Company - Lexington MA

H01R 3900

439 21, 439 5, 439 13

An electrical joint that couples electric signals and current between objects that move relative to one another. A conductive slurry is disposed upon a first object and a conductor extends from a second object to engage the conductive slurry. The slurry comprises conductive particle suspended in a fluid carrying agent, such as oil. A non-conductive gel may be disposed upon the exposed surface of the conductive slurry to retain and protect it. The conductive slurry and non-conductive gel may be disposed within a channel on the objects surface so as to define their position and retain them in the desired area. The position of the conductive slurry is oriented and aligned to maintain continuous contact with the conductor as movement occurs. Linear, planar, circular and other movements are contemplated. The electrical joint can be readily adapted to printed circuit and printed wire technology.

57047928, Jan 6, 1998

Jul 15, 1996

8/680075

Mohi Sobhani - Encino CA

Hughes Aircraft Company - Los Angeles CA

H01R 3910
H01R 2366

439 21

A rotary connector comprising first and second printed wiring boards that rotate relative to each other and that are electrically interconnected using spring loaded pogo-stick type contacts. The spring-loaded contacts are used to transfer electrical signals or power to metallized rings or contacts formed on the first printed wiring board. The spring-loaded pogo-stick type contacts are very rugged and provide for a rotary connector having long life.

53174780, May 31, 1994

Mar 30, 1993

8/039715

Mohi Sobhani - Encino CA

Hughes Aircraft Company - Los Angeles CA

H05K 720

361689

A hermetically sealed electronics package in which an electronic element located on a support is hermetically sealed using a cover comprising the top layer of a multilayer flexprint or a separate flexprint. The top layer of the flexprint or the separate flexprint is supported above the electronic element by a frame structure. When the cover comprises the top flexprint layer, the top layer is only partially bonded to the underlying flexprint during fabrication of the package. After circuit placement, the flap portion of the top flexprint layer is bonded to the flexprint to provide hermetic sealing of the underlying electronic elements. The frame structure provides support for the flexprint cover to prevent deformation of the cover and resulting damage to the underlying circuit. A cooling system is also disclosed for use in combination with the hermetic seal configuration to provide an electronic package which is protected from both contaminants and built-up heat.

58997539, May 4, 1999

Apr 3, 1997

8/834789

Tse E. Wong - Los Alamitos CA
Harold M. Cohen - Los Angeles CA
Mohi Sobhani - Encino CA

Raytheon Company - Lexington MA

H01R 3900

439 17

A spring-loaded ball contact device having a housing, a spring disposed in the housing, a moveable plunger disposed in the housing that contacts the spring, a freely moveable ball contact disposed at an end of the plunger, and a lubricant stored within the housing for lubricating the ball contact. A rotary connector using the spring-loaded ball contact devices has first and second printed wiring boards that rotate relative to each other that are electrically interconnected using a plurality of spring-loaded ball contact devices disposed on the first printed wiring board. The spring-loaded ball contact devices are used to transfer electrical signals or power to conductive contacts formed on the second printed wiring board.

54555183, Oct 3, 1995

Nov 26, 1993

8/157556

Mohi Sobhani - Encino CA

Hughes Aircraft Company - Los Angeles CA

G01R 3102

324765

An integrated circuit testing system for testing small quantities of integrated circuit die. The testing system includes an integrated circuit tester and a base printed wiring board interface that physically and electrically interfaces thereto. A die holder that holds an integrated circuit die is coupled to the base printed wiring board interface. A flexprint structure including first and second flexible contact structures is provided that electrically connect to the base printed wiring board interface, to pads on the integrated circuit die, and to each other to provide for electrical connection between the tester and the die. A plurality of alignment pins are provided for aligning the first and second flexible contact structures to each other and to the pads on the integrated circuit die. The present system is specifically designed for testing low quantities of small and large die, such as application specific integrated circuits (ASIC), without attaching the die to a substrate and wire bonding it for test purposes. The testing system is versatile in that it can test a variety of pad patterns on the die.

52882357, Feb 22, 1994

Dec 14, 1992

7/989612

Mohi Sobhani - Encino CA

Hughes Aircraft Company - Los Angeles CA

H01R 909

439 67

Electrical interconnects, contained in a supported bulge (42, 90) which extends substantially across a circuit or flexible cable (24, 92) in a continuous ridge pattern, are formed in both one or more of electrical conductors (32, 94) in the circuit or flexible cable and in any insulation (34, 98) underlying and adjacent to the conductors at the sites of the interconnects. The bulges may be placed individually in each conductor, or traverse the circuit or cable in a straight, curved, segmented or other broken or unbroken meandering path as a V-shaped or hollow shaped fold, wrinkle or crease in both the conductors and any insulation underlying the conductors at the sites of the interconnects. Supports (56, 108) for the bulges are so composed as to be physically, electrically and chemically compatible with their surrounding materials. Such interconnects are employable in circuits or flexible cables whose line widths and spacings are 3 mil (0.

55250653, Jun 11, 1996

Feb 15, 1995

8/389436

Mohi Sobhani - Encino CA

Hughes Aircraft Company - Los Angeles CA

H01R 909

439 67

Electronic interconnection of two printed wiring structures. Two printed wiring boards or a flexprint circuit and a printed wiring board are interconnected by creating a plated hole pattern on a surface of the printed wiring board, and wherein holes of the pattern have a concave cross section. The holes of the plated hole pattern are mated with corresponding bumps or dimples disposed on the second printed wiring board or the flexprint circuit. The holes formed in the first printed wiring board are disposed a predetermined depth below a surface of the printed wiring board, typically to a depth of between 0. 007 inches and 0. 020 inches below the surface. The plurality of plated holes are formed by electroless plating or electroplating of the holes. The present interconnection structure provides for reliable and self aligning interconnection of the two printed wiring boards or the flexprint circuit and printed wiring board.

57317089, Mar 24, 1998

Oct 31, 1995

8/550693

Mohi Sobhani - Encino CA

Hughes Aircraft Company - Los Angeles CA

G01R 3102

324758

A portable integrated circuit die testing system that offers a cost-effective solution for electrically testing bare, unpackaged, integrated circuit chips or die. The system provides for direct electrical interconnection of die of various sizes and thicknesses to an automatic tester without wire bonding or packaging of the semiconductor chip or die. The system includes an X-Y table that is adjustable in horizontal X and Y directions. A contact platform is disposed above the X-Y table that has an opening therein, and is movable in a vertical direction relative to the X-Y table. An adjustment member is coupled to the contact platform for finely adjusting the movement thereof in the vertical direction. A die holder is secured to the X-Y table for holding the die that is to be tested, and in response to movement of the X-Y table. A vacuum connection is provided for drawing a vacuum on the tested die to secure it in the die holder.