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Mohamed A Rabie

from Clifton Park, NY
Age ~46

Mohamed Rabie Phones & Addresses

  • 11 Heavenly Way, Clifton Park, NY 12065
  • Halfmoon, NY
  • Mechanicville, NY
  • San Jose, CA
  • 2100 Sahara Way, Santa Clara, CA 95050 (408) 615-7135

Business Records

Name / Title
Company / Classification
Phones & Addresses
Mohamed Rabie
Managing
Noontech, LLC
Mobile Software Solutions
1189 White Dr, Santa Clara, CA 95051

Publications

Us Patents

Pic Structure Having Barrier Surrounding Opening For Optical Element To Prevent Stress Damage

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US Patent:
20230030723, Feb 2, 2023
Filed:
Jul 30, 2021
Appl. No.:
17/389759
Inventors:
- Malta NY, US
Jae Kyu Cho - Niskayuna NY, US
Mohamed Rabie - Clifton Park NY, US
Yunyao Jiang - Mechanicville NY, US
Koushik Ramachandran - Wappingers Falls NY, US
Pallabi Das - Bangalore, IN
International Classification:
H01L 23/00
H01L 23/58
G02B 6/12
G02B 6/125
G02B 6/13
G02B 6/30
Abstract:
A photonic integrated circuit (PIC) structure includes an active region in at least an active layer over a substrate, the active region including a plurality of transistors therein. A plurality of dielectric interconnect layers are over the active region, and an opening is defined through the plurality of dielectric interconnect layers. The opening extends to at least the active layer. A barrier is within the plurality of dielectric interconnect layers and surrounding the opening. An optical element is positioned in the opening. The barrier prevents stress damage, such as cracks and/or delaminations, from propagating from or to the opening, and maintains the hermetic seal of the PIC structure.

Corner Structures For An Optical Fiber Groove

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US Patent:
20210375788, Dec 2, 2021
Filed:
Aug 12, 2021
Appl. No.:
17/400847
Inventors:
- Malta NY, US
Jae Kyu Cho - Niskayuna NY, US
Mohamed A. Rabie - Clifton Park NY, US
Andreas D. Stricker - Essex Junction VT, US
International Classification:
H01L 23/00
H01L 23/522
H01L 31/02
H01L 33/62
Abstract:
Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.

Ic Product Comprising A Single Active Fin Finfet Device And An Electrically Inactive Fin Stress Reduction Structure

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US Patent:
20210358865, Nov 18, 2021
Filed:
May 18, 2020
Appl. No.:
16/876532
Inventors:
- Santa Clara CA, US
Kai Sun - Clifton Park NY, US
Elizabeth Strehlow - Malta NY, US
James Mazza - Saratoga Springs NY, US
David Pritchard - Glenville NY, US
Heng Yang - Rexford NY, US
Mohamed Rabie - Clifton Park NY, US
International Classification:
H01L 23/00
H01L 29/06
H01L 29/423
H01L 29/78
H01L 29/66
Abstract:
An illustrative device disclosed herein includes a semiconductor substrate and a FinFET transistor device positioned above the semiconductor substrate, wherein the FinFET transistor device has a single active fin structure. The device also includes an electrically inactive dummy fin structure positioned adjacent the single active fin structure, wherein the electrically inactive dummy fin structure is electrically inactive with respect to electrical operation of the FinFET transistor having the single active fin.

Corner Structures For An Optical Fiber Groove

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US Patent:
20210305172, Sep 30, 2021
Filed:
Mar 26, 2020
Appl. No.:
16/830543
Inventors:
- Santa Clara CA, US
Jae Kyu Cho - Niskayuna NY, US
Mohamed A. Rabie - Clifton Park NY, US
Andreas D. Stricker - Essex Junction VT, US
International Classification:
H01L 23/00
H01L 33/62
H01L 31/02
H01L 23/522
Abstract:
Structures for an optical fiber groove and methods of forming a structure for an optical fiber groove. A photonics chip includes a substrate and an interconnect structure over the substrate. The photonics chip has a first exterior corner, a second exterior corner, and a side edge extending from the first exterior corner to the second exterior corner. The substrate includes a groove positioned along the side edge between the first exterior corner and the second exterior corner. The groove is arranged to intersect the side edge at a groove corner, and the interconnect structure includes metal structures adjacent to the first groove corner. The metal structures extend diagonally in the interconnect structure relative to the side edge of the photonics chip.

Method To Mitigate Chip Package Interaction Risk On Die Corner Using Reinforcing Tiles

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US Patent:
20170373019, Dec 28, 2017
Filed:
Jun 27, 2016
Appl. No.:
15/193700
Inventors:
- Grand Cayman, KY
Mohamed RABIE - Clifton Park NY, US
International Classification:
H01L 23/00
H01L 23/498
Abstract:
A method for producing semiconductor devices including reinforcing metal tiles and the resulting semiconductor package are provided. Embodiments include forming one or more reinforcing metal tiles at corners of an upper portion of a metal stack of semiconductor die during manufacturing of the semiconductor die; and attaching the semiconductor die to a packaging substrate.

Isbn (Books And Publications)

The Politics of Foreign Aid: U. S. Foreign Assistance and Aid to Israel

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Author

Mohamed Rabie

ISBN #

0275930009

Conflict Resolution and Ethnicity

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Author

Mohamed Rabie

ISBN #

0275945987

U.S.-Plo Dialogue: Secret Diplomacy and Conflict Resolution

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Author

Mohamed Rabie

ISBN #

0813013267

Wikipedia

Mohamed Rabie Meftah

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Mohamed Rabie Meftah (born 5 May 1985 in Tizi Ouzou) is an Algerian footballer. He currently plays as a right wingback for JSM Bjaa in the Algerian Ligue ...

Mohamed A Rabie from Clifton Park, NY, age ~46 Get Report