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Mikhail L Pevzner

from Woburn, MA
Age ~37
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Also known as:
Misha A Pevzner
Connected to:
Emily J Pevzner, 28Holly J Pevzner, 50Lisa J Pevzner, 50Mariya Pevzner, 67Alan J Pew, 71Chad M Pew, 49Franklin C Pew, 74Heather L Pew, 46Janet S Pew, 72Jay T Pew, 71

Mikhail Pevzner Phones & Addresses

  • Woburn, MA
  • Flintridge, CA
  • 37 Saco St, Newton U F, MA 02464 (617) 775-0805
  • Newton, MA
  • Tucson, AZ
  • Pasadena, CA
  • Stanford, CA
  • 37 Saco St, Newton Upper Falls, MA 02464

Work

Company: Raytheon intelligence and information systems Nov 2012 to Jun 2013 Address: Greater Denver Area Position: Gps test engineer

Education

Degree: Master of Science School / High School: Stanford University 2009 to 2010 Specialities: Mechanical Engineering

Skills

Analysis • Labview • Robotics • Matlab • Solidworks • C++ • Mechanical Analysis • Dynamics • Structural Dynamics • Radar • Missile Defense • Simulation • System Modeling • Manufacturing • Lean Manufacturing • Manufacturing Operations • Six Sigma • 6S • Design for Manufacturing • ANSYS • System Design • Finite Element Analysis • Aerospace • Machining • Unigraphics • Spacecraft • CAD • Root Cause Analysis • Manufacturing Engineering

Industries

Defense & Space

Resumes

Resumes

Mikhail Pevzner Photo 1

Test Engineer At Raytheon Intelligence And Information Systems

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Location:
Aurora, Colorado
Industry:
Defense & Space
Work:
Raytheon Intelligence and Information Systems - Greater Denver Area Nov 2012 - Jun 2013
GPS Test Engineer
Raytheon Company Jan 2011 - Jun 2013
Member of the Rotational Engineering Leadership Development Program
Raytheon Missile Systems - Tucson, Arizona Mar 2012 - Nov 2012
Manufacturing Engineer
Raytheon Integrated Defense Systems - Missile Defense Center - Woburn, MA Jan 2011 - Mar 2012
Systems Engineer
Raytheon Integrated Defense Systems - Customer Integration Center - Arlington, VA Jun 2009 - Aug 2009
Engineering Intern
Education:
Stanford University 2009 - 2010
Master of Science, Mechanical Engineering Cornell University 2005 - 2009
Bachelor of Science, summa cum laude, Mechanical Engineering
Skills:
Analysis
Labview
Robotics
Matlab
Solidworks
C++
Mechanical Analysis
Dynamics
Structural Dynamics
Radar
Missile Defense
Simulation
System Modeling
Manufacturing
Lean Manufacturing
Manufacturing Operations
Six Sigma
6S
Design for Manufacturing
ANSYS
System Design
Finite Element Analysis
Aerospace
Machining
Unigraphics
Spacecraft
CAD
Root Cause Analysis
Manufacturing Engineering

Publications

Us Patents

Ball Bond Impedance Matching

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US Patent:
20220254750, Aug 11, 2022
Filed:
Feb 5, 2021
Appl. No.:
17/169098
Inventors:
- Waltham MA, US
James E. Benedict - Chelmsford MA, US
Erika Klek - Wilmington MA, US
Mikhail Pevzner - Woburn MA, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H01L 23/00
Abstract:
Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.

Preparation Of Solder Bump For Compatibility With Printed Electronics And Enhanced Via Reliability

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US Patent:
20210400820, Dec 23, 2021
Filed:
Sep 2, 2021
Appl. No.:
17/465292
Inventors:
- Waltham MA, US
Gregory G. Beninati - Salem NH, US
Mikhail Pevzner - Woburn MA, US
Thomas V. Sikina - Acton MA, US
Andrew R. Southworth - Lowell MA, US
International Classification:
H05K 3/34
H05K 3/00
Abstract:
A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.

Pcb Cavity Mode Suppression

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US Patent:
20210360772, Nov 18, 2021
Filed:
May 15, 2020
Appl. No.:
16/874794
Inventors:
- Waltham MA, US
John P. Haven - Lowell MA, US
James E. Benedict - Lowell MA, US
William J. Clark - Waltham MA, US
Channing P. Favreau - Barre MA, US
Erika Klek - Wilmington MA, US
Mikhail Pevzner - Woburn MA, US
Donald G. Hersey - Beverly MA, US
Gregory G. Beninati - Salem NH, US
Thomas J. Tellinghuisen - Pelham NH, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H05K 1/02
H05K 7/14
H01P 1/20
Abstract:
Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.

Process For Removing Bond Film From Cavities In Printed Circuit Boards

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US Patent:
20210305187, Sep 30, 2021
Filed:
Mar 31, 2020
Appl. No.:
16/836470
Inventors:
- Waltham MA, US
Paul A. Danello - Marlborough MA, US
Mikhail Pevzner - Woburn MA, US
Thomas V. Sikina - Acton MA, US
Andrew R. Southworth - Lowell MA, US
International Classification:
H01L 23/00
Abstract:
A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.
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Mikhail L Pevzner from Woburn, MA, age ~37 Get Report