Michael J Knieser

6583374, Jun 24, 2003

Feb 20, 2001

09/788928

Michael J. Knieser - Richmond Heights OH
Richard D. Harris - Solon OH
Robert J. Kretschmann - Bay Village OH
Ernst H. Dummermuth - Chesterland OH
Patrick C. Herbert - Mentor OH

Rockwell Automation Technologies, Inc. - Mayfield Heights OH

B81B 704

200181, 7351419, 7351416, 7351426, 7351432, 7351433, 7351434, 310306, 310309, 438 50, 257415

A microelectricalmechanical system (MEMS) digital isolator may be created in which an actuator such as an electrostatic motor drives a beam against a predefined force set, for example, by another electrostatic motor. When the threshold of the opposing force is overcome, motion of the beam may be sensed by a sensor also attached to the beam. The beam itself is electrically isolated between the locations of the actuator and the sensor. The structure may be incorporated into integrated circuits to provide on-chip isolation.

6593870, Jul 15, 2003

Oct 18, 2001

09/982726

Ernst H. Dummermuth - Chesterland OH
Michael J. Knieser - Richmond Heights OH
Patrick C. Herbert - Mentor OH
Jeffrey R. Annis - Waukesha WI
Steven M. Galecki - Concord OH
Richard D. Harris - Solon OH
Mark A. Lucak - Hudson OH
Robert J. Kretschmann - Bay Village OH

Rockwell Automation Technologies, Inc. - Mayfield Heights OH

H03M 100

341155, 438 52, 341143

An isolated-ADC and a method for providing isolated analog-to-digital conversion are disclosed. The isolated-ADC includes a microelectromechanical system (MEMS), a comparator, and a digital-to-analog converter (DAC). The MEMS includes a beam element supported from a substrate for movement with respect to an axis, first and second actuators and a sensor. The first and second actuators are capable of exerting respective forces upon the beam element causing the beam element to move in response to analog input and feedback signals, respectively. The sensor detects changes in position of the beam element and produces a position signal indicative thereof. The comparator generates a digital signal based upon a comparison of the position signal with a reference value. Based on the digital signal, the DAC generates the feedback signal, and the isolated-ADC produces a digital output signal.

6617750, Sep 9, 2003

Mar 13, 2001

09/805410

Ernst H. Dummermuth - Chesterland OH
Richard D. Harris - Solon OH
Michael J. Knieser - Richmond Heights OH

Rockwell Automation Technologies, Inc. - Mayfield Heights OH

H02N 100

310309

Microelectricalmechanical systems (MEMS) manufactured on a microscopic scale using integrated circuit techniques may be used to measure a variety of parameters using electrical signals generated by the movement of small beams. Inertial noise may be canceled by the duplication of the beam structure for sensing of the acceleration to be subtracted from a similar beam structure used to measure the parameter of interest.

6756310, Jun 29, 2004

Sep 26, 2001

09/963936

Robert J. Kretschmann - Bay Village OH
Mark A. Lucak - Hudson OH
Richard D. Harris - Solon OH
Michael J. Knieser - Richmond Heights OH

Rockwell Automation Technologies, Inc. - Mayfield Heights OH

H01L 2100

438694, 216 2, 438689

A method for fabricating an electrically isolated MEMS device is provided that uses surface fabrication techniques to form a conductive stationary MEMS element, and a movable MEMS element spaced apart from the conductive stationary MEMS element. The movable element includes a nonconductive base which provides for electrical isolation between a plurality of conductive members extending from the base. Modifications to the basic process permit the incorporation of a wafer-level cap which provides mechanical protection to the movable portions of the device.

6761829, Jul 13, 2004

Apr 26, 2001

09/843545

Richard D. Harris - Solon OH
Robert J. Kretschmann - Bay Village OH
Michael J. Knieser - Richmond Heights OH
Mark A. Lucak - Hudson OH

Rockwell Automation Technologies, Inc. - Mayfield Heights OH

C23F 100

216 2, 216 33

A method for fabricating an electrically isolated MEMS device having an outer stationary MEMS element and an inner movable MEMS element is provided that does not use a sacrificial layer. Rather, a pair of spacers are defined on the outer portions of the upper surface of a conductive wafer, and an insulating material is deposited thereon. The spacers are attached to a substrate to define an internal void therein. The wafer is then patterned to form the outer MEMS element as well as a conductive member for the inner MEMS element, separated from the outer MEMS element by a gap. A portion of the insulating layer that is disposed in the gap is then removed, thereby releasing the inner MEMS element from the stationary MEMS element.

6768628, Jul 27, 2004

Apr 26, 2001

09/842975

Richard D. Harris - Solon OH
Michael J. Knieser - Richmond Heights OH
Robert J. Kretschmann - Bay Village OH
Mark A. Lucak - Hudson OH

Rockwell Automation Technologies, Inc. - Mayfield Heights OH

H01G 500

361277, 361280

A MEMS structure is provided having a cap that encapsulates and protects the fragile components of the device, while having an electrical trace embedded in a nonconductive substrate. The electrical trace includes a first terminal end that is exposed to the peripheral region of the device, and a second end that is connected to the MEMS structure to facilitate operation of the device.

6798312, Sep 28, 2004

Mar 13, 2001

09/804817

Richard D. Harris - Solon OH
Michael J. Knieser - Richmond Heights OH
Ernst H. Dummermuth - Chesterland OH
Robert J. Kretschmann - Bay Village OH

Rockwell Automation Technologies, Inc. - Mayfield Heights OH

H01P 136

333 242, 333105, 333262, 333 171, 200181, 310309

A microelectromechanical system (MEMS) analog isolator may be created in which an actuator such as an electrostatic motor drives a beam against an opposing force set, for example, by another electrostatic motor. Motion of the beam may be sensed by a sensor also attached to the beam. The beam itself is electrically isolated between the locations of the actuator and the sensor. The structure may be incorporated into integrated circuits to provide on-chip isolation.

6815243, Nov 9, 2004

Apr 26, 2001

09/843563

Mark A. Lucak - Hudson OH
Richard D. Harris - Solon OH
Michael J. Knieser - Richmond Heights OH
Robert J. Kretschmann - Bay Village OH

Rockwell Automation Technologies, Inc. - Mayfield Heights OH

H01L 2100

438 52, 438739

A method for fabricating MEMS structure includes etching a recess in an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material.