US Patent:
20120125534, May 24, 2012
Inventors:
Megan Nicole Watson - Kent WA, US
Joseph L. Hafenrichter - Seattle WA, US
Mary H. Vargas - Woodinville WA, US
Michael W. Evens - Burien WA, US
Assignee:
THE BOEING COMPANY - Irvine CA
International Classification:
B29C 65/48
B32B 37/00
Abstract:
Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.