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Martin J Pitasi

from Topsfield, MA
Age ~82
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Also known as:
Martin Kathryn Pitasi, Martin Pitisi, Alejandro A Alday, Alex Alday, Pitasi Martin
Related to:
Luiz Claudio Carvalho, 61
Connected to:
Joyce U Pitasi, 80Judith A Pitasi, 74Marilyn Pitaso, 58Justin M Pitassi, 43Nicole M Pitassi, 35Susan G Pitassi, 59Juan C Pitbladdo, 91Robin M Pitblado, 76Christine M Pitcairn, 82Bruce E Pitcaithley, 70

Martin Pitasi Phones & Addresses

  • Topsfield, MA
  • 42 Middle St, Newbury, MA 01951 (978) 462-1223 (978) 463-9495
  • Woburn, MA
  • Byfield, MA
  • Brookline, MA
  • Arlington, MA
  • 42 Middle Rd, Newbury, MA 01951 (978) 462-1223

Work

Position: Professional/Technical

Education

Degree: Associate degree or higher

Resumes

Resumes

Martin Pitasi Photo 1

At Hte Associates, Inc.

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Position:
Owner/Senior Mechanical Engineer-Thermal/Mechanical Packaging at HTE Associates
Location:
Greater Boston Area
Industry:
Electrical/Electronic Manufacturing
Work:
HTE Associates since Apr 1999
Owner/Senior Mechanical Engineer-Thermal/Mechanical Packaging
General Compression Feb 2009 - Mar 2009
Consultant Thermal Analysis and Design
Teradyne, Inc. Mar 2008 - Sep 2008
Strategic Engineering Consultant -Cooling
BAE Systems Nov 2007 - Mar 2008
Senior Mechanical Engineer
Cadence Design System 1995 - 1998
Staff Consultant
Education:
Northeastern University 1962 - 1966
BS, Mechanical Engineering Wentworth Institute of Technology 1960 - 1962
Associates, Mechanical Engineering-MEP
Interests:
Alternative energy, problem solving, prototype model making, instrumentation, testing, pumped refrigerant cooling, precision control and alignment, optics, system architecture, high power cooling, thermal design, system design, mechanical design, compact heat exchanger design
Honor & Awards:
Cadence Design Systems Performance Engineering • Special Achievement Award for outstanding accomplishments and contributions Hewlett-Packard Workstation System Marketing Group • Award for dedication and commitment to the 715-product September launch • Award and Recognition Certificate for outstanding contribution to development of the 710 and 705 workstations National Aeronautics and Space Administration • Group Achievement Award for performance, teamwork, professional ability, dedication, technical expertise, and team spirit • Group Achievement Award for HEAO-1Scanning Modulation Collimator Experiment Team Raytheon Missile System Division • Award for developing an innovative non-destructive method for temperature mapping of an advanced multi-mode radar system
Martin Pitasi Photo 2

Mechanical Or Industrial Engineering Professional

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Location:
Greater Boston Area
Industry:
Mechanical or Industrial Engineering

Business Records

Name / Title
Company / Classification
Phones & Addresses
Martin Pitasi
President
The Associates, Inc
Computer Related Services
42 Middle Rd, Plum Island, MA 01951
(978) 463-9495
Martin Pitasi
Manager
HOMMEWORKS, LLC
42 Middle Rd, Newbury, MA 01951

Publications

Us Patents

Surface-To-Air Heat Exchanger For Electronic Devices

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US Patent:
52939308, Mar 15, 1994
Filed:
Sep 24, 1992
Appl. No.:
7/950207
Inventors:
Martin J. Pitasi - Newbury MA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
F28F 700
US Classification:
165 803
Abstract:
A heat exchanger for cooling an electronic device combines material, geometry and fin effectiveness to maximize heat transfer rate for a its heat exchanging surface area. The heat exchanger comprises a thermally conductive spacer adapted to be mounted onto a surface of the electronic device. A thermally conductive disk-shaped fin is centered on the spacer and has opposed surface-to-air heat exchanging surfaces extending radially from the spacer generally parallel to the surface of the device. The spacer can be disk-shaped and has a diameter which is less than the diameter of the thermally conductive disk. As such, the heat exchanger is omnidirectional in that it effectively removes heat from the electronic device for an incoming air flow originating from any direction and flowing generally parallel to the surface of the device.

Heat Dissipation For Electronic Components On A Ceramic Substrate

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US Patent:
46822690, Jul 21, 1987
Filed:
Sep 9, 1986
Appl. No.:
6/908779
Inventors:
Martin J. Pitasi - Newbury MA
Assignee:
Teradyne, Inc. - Boston MA
International Classification:
H05K 720
US Classification:
361386
Abstract:
A heat dissipator for electronic components comprising a ceramic plate having a first surface for receiving heat from the electronic components and a second surface, and a plurality of separate, spaced metallic, heat-conducting elements mounted on and extending from the second surface of the ceramic plate.
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Martin J Pitasi from Topsfield, MA, age ~82 Get Report