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Marnie L Harker

from San Francisco, CA
Age ~50

Marnie Harker Phones & Addresses

  • 291 Monterey Blvd, San Francisco, CA 94131 (415) 586-3472 (415) 586-2978
  • 452 Dover Way, Campbell, CA 95008 (408) 371-1063
  • 122 Salice Way, Campbell, CA 95008 (408) 374-8854
  • Sioux Falls, SD
  • Sunnyvale, CA
  • Cambridge, MA
  • Stafford Springs, CT
  • Santa Clara, CA
  • 1035 Aster Ave APT 2135, Sunnyvale, CA 94086

Work

Position: Precision Production Occupations

Education

Degree: High school graduate or higher

Resumes

Resumes

Marnie Harker Photo 1

Massachusetts Institute Of Technology

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Location:
South San Francisco, CA
Industry:
Biotechnology
Work:
Genentech
Project Lead, Contract Management, S2P Transformation

Genentech Aug 1, 2013 - Jul 2015
Lead, Analytics and Reporting, S2P Transformation Program

Genentech Dec 1, 2009 - Aug 1, 2013
Senior Manager, Procurement

Genentech Mar 2007 - Dec 2009
Strategic Sourcing Manager

Intel Corporation 1997 - 2006
Various Role In Engineering and Semiconductor Equipment Supplier Management
Education:
Massachusetts Institute of Technology 1996 - 1997
Master of Science, Masters, Materials Science, Engineering
Massachusetts Institute of Technology 1992 - 1996
Bachelors, Bachelor of Science, Materials Science, Engineering
Skills:
Cross Functional Team Leadership
Supply Management
Strategic Sourcing
Spend Analysis
Contract Manufacturing
Supplier Evaluation
Program Management
Process Improvement
Pharmaceutical Industry
Vendor Management
Continuous Improvement
Procurement
Contract Negotiation
Management
E Procurement
Strategy
Sourcing
Supply Chain
Outsourcing
Business Process Improvement
Interests:
Education
Languages:
English
Marnie Harker Photo 2

Head Of Indirect Procurement

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Location:
San Francisco, CA
Work:

Head of Indirect Procurement

Publications

Us Patents

Stabilization Of Low Dielectric Constant Film With In Situ Capping Layer

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US Patent:
6566757, May 20, 2003
Filed:
Mar 1, 2000
Appl. No.:
09/516650
Inventors:
Indrajit Banerjee - San Jose CA
Lawrence D. Wong - Beaverton OR
Marnie L. Harker - Campbell CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2348
US Classification:
257758, 257759, 257760
Abstract:
An interconnect structure for microelectronic devices includes interconnect lines having dielectric material disposed therebetween as an intralayer dielectric, and a capping structure, also disposed between the interconnect lines, that reduces outgassing from the material. Typical embodiments include fluorinated dielectric materials, such as amorphous fluorinated carbon. The capping structure also acts as a moisture barrier to prevent moisture from penetrating into the fluorinated material and combining therewith to produce corrosive chemicals. The capping structure is formed in-situ so that the fluorinated dielectric material is not exposed to moisture prior to the formation of the capping structure.
Marnie L Harker from San Francisco, CA, age ~50 Get Report