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Mark Eyolfson Phones & Addresses

  • Monument, CO
  • Downers Grove, IL
  • 3233 E Red Stone Dr, Boise, ID 83712 (208) 344-8293
  • 3233 N North Church Ave, Boise, ID 83706 (208) 344-8293
  • Grand Lake, CO

Publications

Us Patents

Method And Apparatus For Automated, In Situ Material Detection Using Filtered Fluoresced, Reflected, Or Absorbed Light

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US Patent:
6369887, Apr 9, 2002
Filed:
Apr 25, 2001
Appl. No.:
09/842513
Inventors:
Mark Eyolfson - Boise ID
Elton J. Hochhalter - Boise ID
Joe Lee Phillips - Nampa ID
David R. Johnson - Meridian ID
Peter S. Frank - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G01N 2188
US Classification:
3562374, 356 72, 2504581, 2504611
Abstract:
A method and apparatus for detection of a particular material, such as photo-resist material, on a sample surface. A narrow beam of light is projected onto the sample surface and the fluoresced and/or reflected light intensity at a particular wavelength band is measured by a light detector. The light intensity is converted to a numerical value and transmitted electronically to a logic circuit which determines the proper disposition of the sample. The logic circuit controls a sample-handling robotic device which sequentially transfers samples to and from a stage for testing and subsequent disposition. The method is particularly useful for detecting photo-resist material on the surface of a semiconductor wafer.

Method And Apparatus For Automated, In Situ Material Detection Using Filtered Fluoresced, Reflected, Or Absorbed Light

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US Patent:
6704107, Mar 9, 2004
Filed:
Nov 4, 1997
Appl. No.:
08/964451
Inventors:
Mark Eyolfson - Boise ID
Elton J. Hochhalter - Boise ID
Joe Lee Phillips - Nampa ID
David R. Johnson - Meridian ID
Peter S. Frank - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G01B 1100
US Classification:
356388, 356 71, 356389, 356390, 356394, 356433, 356434
Abstract:
A method and apparatus for detection of a particular material, such as photoresist material, on a sample surface. A narrow beam of light is projected onto the sample surface and the fluoresced and/or reflected light intensity at a particular wavelength band is measured by a light detector. The light intensity is converted to a numerical value and transmitted electronically to a logic circuit which determines the proper disposition of the sample. The logic circuit controls a sample-handling robotic device which sequentially transfers samples to and from a stage for testing and subsequent disposition. The method is particularly useful for detecting photo-resist material on the surface of a semiconductor wafer.

Method And Apparatus For Automated, In Situ Material Detection Using Filtered Fluoresced, Reflected, Or Absorbed Light

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US Patent:
7102737, Sep 5, 2006
Filed:
Jun 4, 2004
Appl. No.:
10/861738
Inventors:
Mark Eyolfson - Boise ID, US
Elton J. Hochhalter - Boise ID, US
Joe Lee Phillips - Nampa ID, US
David R. Johnson - Meridian ID, US
Peter S. Frank - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G01N 21/64
G01N 21/88
US Classification:
356 72, 3562374, 356417, 2504581
Abstract:
A method and apparatus for detection of a particular material, such as photo-resist material, on a sample surface are disclosed. A narrow beam of light is projected onto the sample surface and the fluoresced and/or reflected light intensity at a particular wavelength band is measured by a light detector. The light intensity is converted to a numerical value and transmitted electronically to a logic circuit, which determines the proper disposition of the sample. The logic circuit controls a sample-handling robotic device which sequentially transfers samples to and from a stage for testing and subsequent disposition. The method is particularly useful for detecting photo-resist material on the surface of a semiconductor wafer.

System And Method For Analyzing Electrical Failure Data

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US Patent:
7319935, Jan 15, 2008
Filed:
Feb 12, 2003
Appl. No.:
10/365997
Inventors:
Xueqing Sun - Manassas VA, US
Mark Eyolfson - Boise ID, US
Chris Langworthy - Boise ID, US
Karl L. Major - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G01R 31/00
US Classification:
702 59, 3562374
Abstract:
A system and method to perform analysis on test results of multiple integrated circuits. Based on the analysis, the system and method display a wafer map having map indicators representing statistical values of the test results.

Method And Apparatus For Automated, In Situ Material Detection Using Filtered Fluoresced, Reflected, Or Absorbed Light

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US Patent:
20020093642, Jul 18, 2002
Filed:
Mar 7, 2002
Appl. No.:
10/093350
Inventors:
Mark Eyolfson - Boise ID, US
Elton Hochhalter - Boise ID, US
Joe Phillips - Nampa ID, US
David Johnson - Meridian ID, US
Peter Frank - Boise ID, US
International Classification:
G01N021/88
US Classification:
356/072000, 356/237400, 250/458100, 250/461100
Abstract:
A method and apparatus for detection of a particular material, such as photo-resist material, on a sample surface. A narrow beam of light is projected onto the sample surface and the fluoresced and/or reflected light intensity at a particular wavelength band is measured by a light detector. The light intensity is converted to a numerical value and transmitted electronically to a logic circuit which determines the proper disposition of the sample. The logic circuit controls a sample-handling robotic device which sequentially transfers samples to and from a stage for testing and subsequent disposition. The method is particularly useful for detecting photo-resist material on the surface of a semiconductor wafer.

System And Method For Analyzing Electrical Failure Data

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US Patent:
20060265156, Nov 23, 2006
Filed:
Jul 26, 2006
Appl. No.:
11/493716
Inventors:
Xueqing Sun - Manassas VA, US
Mark Eyolfson - Boise ID, US
Chris Langworthy - Boise ID, US
Karl Major - Boise ID, US
International Classification:
G01R 31/00
US Classification:
702058000
Abstract:
Some embodiments of the invention include system and method for performing a calculation on the data associated with a group of wafers. The system and method display a wafer map having map indicators representing calculation results from the calculation. Other embodiments are described and claimed.

Method And Apparatus For Automated, In Situ Material Detection Using Filtered Fluoresced, Reflected, Or Absorbed Light

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US Patent:
62560948, Jul 3, 2001
Filed:
Dec 30, 1999
Appl. No.:
9/475439
Inventors:
Mark Eyolfson - Boise ID
Elton J. Hochhalter - Boise ID
Joe Lee Phillips - Nampa ID
David R. Johnson - Meridian ID
Peter S. Frank - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G01N 2188
US Classification:
3562374
Abstract:
A method and apparatus for detection of a particular material, such as photo-resist material, on a sample surface. A narrow beam of light is projected onto the sample surface and the fluoresced and/or reflected light intensity at a particular wavelength band is measured by a light detector. The light intensity is converted to a numerical value and transmitted electronically to a logic circuit which determines the proper disposition of the sample. The logic circuit controls a sample-handling robotic device which sequentially transfers samples to and from a stage for testing and subsequent disposition. The method is particularly useful for detecting photo-resist material on the surface of a semiconductor wafer.

Methods Of Thermal Processing And Rapid Thermal Processing

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US Patent:
62879278, Sep 11, 2001
Filed:
Jan 20, 2000
Appl. No.:
9/488974
Inventors:
Robert Burke - Boise ID
Mark Eyolfson - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 21336
US Classification:
438308
Abstract:
In one aspect, the invention includes a method of thermal processing comprising: a) providing a semiconductor substrate, the semiconductor substrate supporting a material that is to be thermally processed; b) forming a sacrificial mass over the material, the mass comprising an inner portion and an outer portion, the inner portion having a different composition than the outer portion and being nearer the material than the outer portion; c) exposing the mass to radiation to heat the mass, the exposing being for a period of time sufficient for the material to absorb heat from the mass and be thermally processed thereby; and d) removing the mass from over the material. In another aspect, the invention includes a method of thermal processing comprising: a) providing a semiconductor substrate, the substrate supporting a material that is to be thermally processed; b) forming a first sacrificial layer over the material; c) forming a second sacrificial layer over the first sacrificial layer, the second sacrificial layer comprising a different composition than the first sacrificial layer; d) exposing the second sacrificial layer to radiation to heat the second layer, the exposing being for a period of time sufficient for the material to absorb heat from the sacrificial layer and be thermally processed thereby; e) cooling the material and the sacrificial layers; and f) removing the sacrificial layers from over the material.
Mark Allen Eyolfson from Monument, CO, age ~63 Get Report